511J CAPACITOR Search Results

DNA 1002

Abstract: TE-5001 n014 jis c 5201-1 511j MARKING T20 SOT23 471j CAPACITOR 470M 471J diodes tvb
Contextual Info: NETWORKS Resistors / capacitors / diodes 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION TYPE COATING COLOR MARKING

DNA 1002

Abstract: RNX W16 marking s14 sot23 KPC T16 DNA MARKING CODE KOA KPC T16 Packaging marking code 8 lead soic-n package analog devices MARKING W16 SOT23 CODE DIODE
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

DNA 1002

Abstract: rnx w16 dn5 marking packaging resistor MARKING W16 SOT23 rnx Q24 DN6 marking diode
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

Contextual Info: NETWORKS KOA´S INTEGRATED PASSIVE COMPONENTS 3 THIN FILM ON SILICON TFOS KPC STRUCTURE 2 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION Specifications given herein may be changed at any time without prior notice.

473m ceramic capacitors

Abstract: C2012CH1H C2012PH1H101J 1H273K C2012X7R1H 331J COG 100 C2012X7R1C103K C2012CH1H130J 111J C2012X8R1H
Contextual Info: Multilayer Ceramic Chip Capacitors C Series C2012 TYPE [EIA: CC0805] SHAPES AND DIMENSIONS 2 ± 0.2 c\j ö +i Dimensions in mm -0 .2 min. T Thickness 0.6±0.15_ 0.85±0.15_ 1.25±0.2_ • gg |K i CAPACITANCE RANGE/CLASS I (TEMPERATURE COMPENSATION)

TE-5001

Abstract: MARKING W16 SOT23 HBM W20 rnx w16 DNA 1002 TVC 2 HB IEEE resistor color code RDA Q20 W16 sot 23 acd marking code
Contextual Info: NETWORKS Resistors / capacitors / diodes 3 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 2 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 4 IDENTIFICATION TYPE COATING COLOR MARKING

1R1C

Abstract: MCH185CN152K 331J COG 100
Contextual Info: 1608 0603 Size chip capacitors : MCH18 ● ● ● ● Miniture, light weight Achieved high capacitance by thin and multi layer technology Lead-free plating terminal No polarity Quick Reference The design and specifications are subject to change without prior notice. Before ordering or using,

rnx w16

Abstract: 471j CAPACITOR w16 sot23 511j CAPACITOR KPC T16 12w SOT23-3 appendix T16 KOA KPC appendix KOA KPC T16
Contextual Info: 抵抗器 Resistors R/C NETWORKS KPC 表面実装形薄膜抵抗/コンデンサネットワーク KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire

331J COG 100

Abstract: 680J
Contextual Info: 1608 0603 Size chip capacitors : MCH18 ● ● ● ● Miniture, light weight Achieved high capacitance by thin and multi layer technology Lead-free plating terminal No polarity Quick Reference The design and specifications are subject to change without prior notice. Before ordering or using,

T70a

Abstract: MCH185CN102K MCH185CN223K AN 22022 331J COG 100 020C MCH18 MCH185CN221K MCH185CN682K
Contextual Info: 1608 0603 Size chip capacitors : MCH18 ● ● ● ● Miniture, light weight Achieved high capacitance by thin and multi layer technology Lead-free plating terminal No polarity Quick Reference The design and specifications are subject to change without prior notice. Before ordering or using,

331J COG 100

Abstract: 3R9C MCH185CN152K AN 22022 CASE STYLE, 301J 561J ET-7201 MCH185A ROHM
Contextual Info: 1608 0603 Size chip capacitors : MCH18 ● ● ● ● Miniture, light weight Achieved high capacitance by thin and multi layer technology Lead-free plating terminal No polarity Quick Reference The design and specifications are subject to change without prior notice. Before ordering or using,

et10 glass

Abstract: ETR10 ETR15 101J ET10 ET15E511 ET10E101J
Contextual Info: Glass/ET Series Caps Elevated Temperature HEAT It’s the enemy of reliable, long-term circuit performance. In many applications, very high temperatures are not a consideration in circuit design. But in a few specialized areas, elevated temperatures create very real design problems.

capacitor 361j

Contextual Info: MCH18 Ceramic capacitors Multi-layer ceramic chip capacitors MCH18 1608 (0603 size, chip capacitor) zFeatures 1) Miniture, light weight 2) Achieved high capacitance by thin and multi layer technology 3) Lead-free plating terminal 4) No polarity zQuick Reference

capacitor 361j

Abstract: capacitor 152j R265A 48 H diode marking code 102j transistor 010C MCH184FN225Z MCH185CN682K marking 330j 020C
Contextual Info: MCH18 Ceramic capacitors Multi-layer ceramic chip capacitors MCH18 1608 (0603 size, chip capacitor) zFeatures 1) Miniture, light weight 2) Achieved high capacitance by thin and multi layer technology 3) Lead-free plating terminal 4) No polarity zQuick Reference

et10 glass

Abstract: ETR15 glass capacitor ETR10 101J ET10 101j Capacitor ET15E47
Contextual Info: Glass/ET Series Caps Elevated Temperature HEAT It’s the enemy of reliable, long-term circuit performance. In many applications, very high temperatures are not a consideration in circuit design. But in a few specialized areas, elevated temperatures create very real design problems.

ETR10

Abstract: ET 3005 CYR10 capacitor cross reference avx ETR15 et10 glass CYFR10 CY10 CYR15 CYR51
Contextual Info: Glass Dielectric Caps Index Introduction Capacitor Military Cross Reference and Alphabetical Parts Listing .2 Glass Selector Guide .3

BU 3150

Abstract: tc 3085 space shuttle K250 cap K250 capacitor military relay ETR15 downhole ET322 M39014 5
Contextual Info: Glass Dielectric Caps Index Introduction Capacitor Military Cross Reference and Alphabetical Parts Listing .2 Glass/Glass-K Selector Guide .3

Contextual Info: DALLAS PRELIMINARY SEMICONDUCTOR 3.3V DS21352 and 5V DS21552 _ T1 Single Chip Transceivers SCT FEATURES • • • • • • • • • • • • • • • • • • • • • • Complete DS1/ISDN-PRI transceiver functionality

RK73-RT

Abstract: RK73G-RT WK73-RT hr r 681k- 1kv A/SG73P1E WK73S2 SG73S2E sec 472m sf MOS2CT52 RK73H-RT
Contextual Info: KOA SPEER ELECTRONICS, INC. passive components 199 Bolivar Drive Bradford, PA 16701 Phone: 814-362-5536 Fax: 814-362-8883 www.koaspeer.com KOA SPEER ELECTRONICS, INC. AHA 12/14 2.5M KOA Speer Electronics, Inc. Printed in U.S.A. passive components KOA Speer’s

panasonic inverter dv 707 manual

Abstract: 018T A423 Mosfet FTR 03-E Arcotronics 1.27.6 nsl 7053 mkp DX 3500 manual Honeywell DBM 01A Polyester capacitors 823k 250V SPRAGUE powerlytic 36Dx sprague 68D
Contextual Info: PASSIVE COMPONENTS Resistors Networks and Arrays Bourns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590, 591, 592 Caddock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593 CTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594