4K X 1 DRAM Search Results
4K X 1 DRAM Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TMS4030JL |
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TMS4030JL - TMS4030 - DRAM, 4KX1, 300ns, MOS, CDIP22 |
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4164-15JDS/BEA |
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4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 150 NS ACCESS TIME - Dual marked (8201006EA) |
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4164-15FGS/BZA |
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4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 150 NS ACCESS TIME - Dual marked (8201006ZA) |
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4164-12JDS/BEA |
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4164 - DRAM, 64K X 1, 3-STATE OUTPUTS, 120 NS ACCESS TIME - Dual marked (8201008EA) |
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CDCV857ADGGR |
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2.5V SSTL-II Phase Lock Loop Clock Driver for Double Data-Rate Synchronous DRAM Applications 48-TSSOP 0 to 85 |
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4K X 1 DRAM Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: L4B7SE5 □ Q 4f l cì 7 3 M5T NECE NEC 16M DRAMs cont ORGANIZATION FEATURES PACKAGE 2M x 8 Fast-page access, 4K refresh, self-refresh 2M x 8 2M x 8 2M x 8 1 M x 16 1 M x 16 1 M x 16 1M x 16 Fast-page access, 4K refresh, self-refresh Hyper-page access, 4K refresh |
OCR Scan |
400-mil) uPD4216800LE-60 uPD4216800LE-70 uPD4216800LE-80 iPD4216800LE PD4216800G5 lPD4216805LE | |
Contextual Info: HB56EW472ETC-A Series, HB56EW872ETK-A Series 32/64MB Buffered EDO DRAM DIMM 4-Mword X 72-bit, 4k Refresh, 1 Bank Module 4 pcs of 4M X 16 & 2 pcs of 4M x 4 components 8-Mword x 72-bit, 4k Refresh, 2 Bank Module (8 pcs of 4M x 16 & 4 pcs of 4M x 4 components) |
OCR Scan |
HB56EW472ETC-A HB56EW872ETK-A 32/64MB 72-bit, ADE-203-844 HB56EW472ETC-A, 64-Mbit | |
CAPACITOR 64 680 4J
Abstract: 11DQ12 8dq9 Nippon capacitors
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OCR Scan |
HB56EW472ETC-A HB56EW872ETK-A 32/64MB 72-bit, ADE-203-844 HB56EW 472ETC-A, 872ETK-A CAPACITOR 64 680 4J 11DQ12 8dq9 Nippon capacitors | |
Contextual Info: 8K x 8 4K x 8 CMOS FourPort RAM MODULE PRELIMINARY IDT7MB1041 IDT7MB1042 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 64K /32K -bit C M O S FourPort RAM Modules • 8K x 8 ID T 7 M B 1 0 4 1 or 4K x 8 (ID T 7 M B 1 042) option |
OCR Scan |
IDT7MB1041 IDT7MB1042 100ns 120-pin | |
Contextual Info: HB56HW464ETNC-5/6, HB56HW864ETNK-5/6 32/64MB Unbuffered EDO DRAM DIMM 4-Mword X 64-bit, 4k Refresh, 1 Bank Module 8-Mword X 64-bit, 4k Refresh, 2 Bank Module 4/8 pcs of 4M X 16 components HITACHI ADE-203-901A (Z) Rev. 1.0 Apr. 14, 1998 Description The HB56HW464ETNC, HB56HW864ETNK belong to 8-byte DIMM (Dual in-line Memory Module) |
OCR Scan |
HB56HW464ETNC-5/6, HB56HW864ETNK-5/6 32/64MB 64-bit, ADE-203-901A HB56HW464ETNC, HB56HW864ETNK HB56HW464ETNC 64Mbit | |
Contextual Info: KMM366F203CK KMM366F213CK DRAM MODULE KMM366F203CK & KMM366F213CK EDO Mode without buffer 2M x 64 DRAM DIMM based on 2Mx8, 4K & 2K Refresh, 3.3V GENERAL DESCRIPTION FEATURES The Samsung KMM366F20 1 3CK is a 2M bit x 64 Dynamic RAM high density memory module. The Samsung |
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KMM366F203CK KMM366F213CK KMM366F213CK KMM366F20 300mil 168-pin 100Min | |
NEC cContextual Info: Part Number 64M DRAM 1 x 4 / x 8 /¿PD4264 4 00L E - A 70 NEC CMOS Dynamic RAM —^ 64M Dynamic RAM, Refresh Cycle — 6 4 : 8K Refresh 65 : 4K Refresh O :x 4 8 : x8 Fast Page M o d : TSOP (II)(400mil) |
OCR Scan |
uPD4264400LE-A70 400mil) jUPD4264 300mil) /tPD42 NEC c | |
KMM366F213BK
Abstract: KM48V2104
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KMM366F203BK KMM366F213BK KMM366F213BK KMM366F20 300mil 168-pin KM48V2104 | |
Contextual Info: UG216E3654HKG T 64M Bytes (16M x 36) DRAM 72Pin SIMM based on 16M X 4 General Description Features The UG216E3654HKG(T) is a 16,777,216 bits by 36 SIMM module.The UG216E3654HKG(T) is assembled using 8 pcs of 16Mx4 4K refresh DRAM in 400mil Package and 4 pcs of 16M x 1 |
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UG216E3654HKG 72Pin 16Mx4 400mil 300mil 1000mil) | |
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1M x 16 Advance Information MCM516165BV 16M CMOS Wide DRAM Family EDO,1M x 1 6 ,1K, and 4K Refresh The family of 16M Dynamic RAMs is fabricated using 0.50n CMOS high-speed silicon-gate process technology. It includes devices organized as 1,048,576 |
OCR Scan |
MCM516165BV MCM516165BV) MCM518165BV) MCM518165BV MCM51 xxxxBV-70 MCM516165BV-70 MCM518165BV | |
Contextual Info: UG216C3654HKG T 64M Bytes (16M x 36) DRAM 72Pin SIMM based on 16M X 4 General Description Features The UG216C3654HKG(T) is a 16,777,216 bits by 36 SIMM module.The UG216C3654HKG(T) is assembled using 8 pcs of 16Mx4 4K refresh DRAMs in 400mil Package and 4 pcs of 16M x 1 DRAMs in |
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UG216C3654HKG 72Pin 16Mx4 400mil 300mil 1000mil) | |
Contextual Info: UG216E3661GJG T 64M Bytes (16M x 36 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216E3661GJG(T) is a 16,777,216 bits by 36 SIMM module.The UG216E3661GJG(T) is assembled using 36 pcs of 16Mx1 4K refresh DRAMs in SOJ Package mounted on 72 Pin |
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UG216E3661GJG 72Pin 16Mx1 1250mil) | |
we 510Contextual Info: UG216E3261GJG T 64M Bytes (16M x 32 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216E3261GJG(T) is a 16,777,216 bits by 32 SIMM module.The UG216E3261GJG(T) is assembled using 32 pcs of 16Mx1 4K refresh DRAMs in SOJ Packages mounted on 72 Pin |
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UG216E3261GJG 72Pin 16Mx1 1250mil) we 510 | |
u18 312
Abstract: we 510
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UG216E3211GJG 72Pin 16Mx1 ABT16 1250mil) u18 312 we 510 | |
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Contextual Info: UG216C3611GJG T 64M Bytes (16M x 36 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216C3611GJG(T) is a 16,777,216 bits by 36 SIMM module.The UG216C3611GJG(T) is assembled using 36 pcs of 16Mx1 4K refresh DRAM in SOJ Package and 2 pcs of ABT16 |
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UG216C3611GJG 72Pin 16Mx1 ABT16 1250mil) | |
we 510
Abstract: ras 510 UG216C3261GJG 45388
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UG216C3261GJG 72Pin 16Mx1 we 510 ras 510 45388 | |
ras 510
Abstract: we 510 UG216C3211GJG
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UG216C3211GJG 72Pin 16Mx1 ABT16 ras 510 we 510 | |
Contextual Info: UG216E3611GJG T 64M Bytes (16M x 36 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216E3611GJG(T) is a 16,777,216 bits by 36 SIMM module.The UG216E3611GJG(T) is assembled using 36 pcs of 16Mx1 4K refresh DRAMs in SOJ Package and 2 pcs of ABT16 |
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UG216E3611GJG 72Pin 16Mx1 ABT16 1250mil) | |
UG216C3221GJGContextual Info: UG216C3221GJG T 64M Bytes (16M x 32 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216C3221GJG(T) is a 16,777,216 bits by 32 SIMM module.The UG216C3221GJG(T) is assembled using 32 pcs of 16Mx1 4K refresh DRAMs in SOJ Package and 2 pcs of ABT16 |
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UG216C3221GJG 72Pin 16Mx1 ABT16 | |
Contextual Info: UG216E3621GJG T 64M Bytes (16M x 36 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216E3621GJG(T) is a 16,777,216 bits by 36 SIMM module.The UG216E3621GJG(T) is assembled using 36 pcs of 16Mx1 4K refresh DRAMs in SOJ Package and 2 pcs of ABT16 |
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UG216E3621GJG 72Pin 16Mx1 ABT16 1500mil) | |
Contextual Info: UG216C3661GJG T 64M Bytes (16M x 36 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216C3661GJG(T) is a 16,777,216 bits by 36 SIMM module.The UG216C3661GJG(T) is assembled using 36 pcs of 16Mx1 4K refresh DRAMs in SOJ Package mounted on 72 Pin |
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UG216C3661GJG 72Pin 16Mx1 1250mil) | |
Contextual Info: UG216E3221GJG T 64M Bytes (16M x 32 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216E3221GJG(T) is a 16,777,216 bits by 32 SIMM module.The UG216E3221GJG(T) is assembled using 32 pcs of 16Mx1 4K refresh DRAMs in SOJ Package and 2 pcs of ABT16 |
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UG216E3221GJG 72Pin 16Mx1 ABT16 1500mil) | |
Contextual Info: UG216C3621GJG T 64M Bytes (16M x 36 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216C3621GJG(T) is a 16,777,216 bits by 36 SIMM module.The UG216C3621GJG(T) is assembled using 36 pcs of 16Mx1 4K refresh DRAMs in SOJ Package and 2 pcs of ABT16 |
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UG216C3621GJG 72Pin 16Mx1 ABT16 1500mil) | |
Contextual Info: ESM T F59L1G81A Flash 1 Gbit 128M x 8 3.3V NAND Flash Memory FEATURES Voltage Supply: 2.6V ~ 3.6V Organization - Memory Cell Array: (128M + 4M) x 8bit - Data Register: (2K + 64) x 8bit Automatic Program and Erase - Page Program: (2K + 64) bytes - Block Erase: (128K + 4K) bytes |
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F59L1G81A 200us it/528 |