36AD Search Results

Contextual Info: Revision: 9/26/02 GS816118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS816118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

Contextual Info: GS832118/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

GS8321Z18AD-200V

Abstract: 8321ZXXA_V
Contextual Info: GS8321Z18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • User-configurable Pipeline and Flow Through mode • NBT No Bus Turn Around functionality allows zero wait

Contextual Info: GS832118/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

GS832132AGD-150I

Contextual Info: Preliminary GS832118/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

Contextual Info: Preliminary GS8321Z18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 1.8 V, 2.5 V, or 3.3 V VDD 1.8 V, 2.5 V, or 3.3 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Because it is a synchronous device, address, data inputs, and

Boundary Scan JTAG Logic

Abstract: GS8321E32AGD-250
Contextual Info: GS8321E18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

Contextual Info: Revision: 9/26/02 GS8161Z18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS8161Z18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is

Contextual Info: GS8321Z18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 1.8 V, 2.5 V, or 3.3 V VDD 1.8 V, 2.5 V, or 3.3 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Because it is a synchronous device, address, data inputs, and

Contextual Info: Preliminary GS8321Z18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 1.8 V, 2.5 V, or 3.3 V VDD 1.8 V, 2.5 V, or 3.3 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Because it is a synchronous device, address, data inputs, and

GS881E18AD-133

Abstract: GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
Contextual Info: Revision: 9/26/02 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS88118AD-133

Abstract: GS88118AD-150 GS88118AD-166 GS88118AD-200 GS88118AD-225 GS88118AD-250
Contextual Info: Revision: 9/26/02 GS88118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS88118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

Contextual Info: GS8321E18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

Contextual Info: GS8321E18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

Contextual Info: GS8321Z18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • User-configurable Pipeline and Flow Through mode • NBT No Bus Turn Around functionality allows zero wait

Contextual Info: GS8321Z18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V, or 3.3 V VDD 2.5 V, or 3.3 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Because it is a synchronous device, address, data inputs, and

GS881Z18AT-133

Abstract: GS881Z18AD-133 GS881Z18AD-150 GS881Z18AD-166 GS881Z18AD-200 GS881Z18AD-225 GS881Z18AD-250
Contextual Info: Revision: 9/26/02 GS881Z18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881Z18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

Contextual Info: GS832118/32/36AD-xxxV 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply

Contextual Info: Preliminary GS8321E18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

Contextual Info: Preliminary GS8321Z18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • User-configurable Pipeline and Flow Through mode • NBT No Bus Turn Around functionality allows zero wait

Contextual Info: Revision: 9/26/02 GS8161E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS8161E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is

GS881E18A

Abstract: GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
Contextual Info: Revision: 4/26/02 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS8321Z36AD-400

Contextual Info: GS8321Z18/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V, or 3.3 V VDD 2.5 V, or 3.3 V I/O 36Mb Pipelined and Flow Through Synchronous NBT SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Because it is a synchronous device, address, data inputs, and

Contextual Info: GS832118/32/36AD-400/375/333/250/200/150 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline