34MIL Search Results
34MIL Price and Stock
Vishay Intertechnologies RN55D5112FB14Metal Film Resistors - Through Hole 1/8watt 51.1Kohms 1% 100ppm |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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RN55D5112FB14 | Box | 4,600 | 100 |
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Vishay Intertechnologies RN65C2500BB14Metal Film Resistors - Through Hole 1/2watt 250ohms .1% 50ppm |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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RN65C2500BB14 | Box | 3,200 | 100 |
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Vishay Intertechnologies RWR81S4990FRB12Wirewound Resistors - Through Hole 499 OHM 1% EGS-1-80 |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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RWR81S4990FRB12 | Box | 400 | 100 |
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Vishay Intertechnologies 135D276X9060T12RTantalum Capacitors - Wet 27UF 60V 10% T1R |
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135D276X9060T12R | Tray | 129 | 1 |
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Vishay Intertechnologies 135D686X9100T32RTantalum Capacitors - Wet 68UF 100V 10% T3R |
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135D686X9100T32R | Tray | 60 | 1 |
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34MIL Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Mobile Intel 945 Express Chipset Family Datasheet April 2006 Document Number: 309219-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN |
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945gms | |
MAX3970Contextual Info: Application Note: HFAN-8.0.1 Rev.1; 04/08 Understanding Bonding Coordinates and Physical Die Size Maxim Integrated Products Understanding Bonding Coordinates and Physical Die Size MAX3970 3 1 Introduction When calculating pad coordinates, there is often confusion between the die size specified in the data |
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max3970hf98z | |
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Contextual Info: User's Guide SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM This user's guide describes the characteristics, operation, and use of the TPS6125xEVM-766 evaluation module EVM . This EVM enables test and evaluation of the Texas Instruments' TPS61253, TPS61258, |
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slvu744tps6125xevm-766tps61253tps61258+1 | |
TB245Contextual Info: M March 5, 20155 T TB245 Frequenccy=760-960MHz Pout=140W Gaain=13dB Vd ds=28Vdc Id dq=0.8A Efficciency=40% % L LB2501 PH: 8805 484-4210 FAX:(805)48 84-3393 1110 Avenida Acasso, Camarillo CA C 93012 ww ww.polyfet.com m March 5, 2015 160.0 16.0 120.0 15.0 80.0 |
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tb245760-960mhz28vdclb2501+2 | |
MIP 2F4
Abstract: 940GML intel 943gml 1466 ball FCBGA 945GMS LE1A pci express x16 graphics bga ballout 943G CEF H32 str w 6251
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945gms945gu593-mm893-mm+10 | |
a13 sot23-5
Abstract: sine wave generator using LM358 EME-7351 A14* marking sot23-5 SOT23 M7 simple LM324 COMPARATOR CIRCUIT a13 marking sot23 Analog devices marking Information PACKAGE SOIC eme marking sot23 LMV321M5
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lmv821lmv358lmv393lmv822+13 | |
TB230
Abstract: a/SMD resistor 805
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tb23020-1000mhz28vdclb2401+4 | |
TB234
Abstract: 1111X104KW500
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tb234500-1000mhz28vdclb2401+5 | |
TB229
Abstract: amidon BN-61-202
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tb229100-1000mhz28vdclb2401+7 | |
MIP 2F4
Abstract: intel 943gml ic MIP 2F4 generation of PWM for inverter pic 18f 940GML 945PM 1466 ball FCBGA 945GM 945GT 82801GBM ICH7M
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945gms/gse945gu593-mm893-mm+11 | |
MAX3970Contextual Info: Application Note: HFAN-8.0.1 Rev 0; 7/01 Understanding Bonding Coordinates and Physical Die Size MAXIM High-Frequency/Fiber Communications Group Maxim Integrated Products 2hfan801.doc 08/03/01 Understanding Bonding Coordinates and Physical Die Size MAX3970 |
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2hfan801max3970hf98z | |
TB219
Abstract: lq801
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tb21930-512mhz28vdc200ma+1 | |
TTL 7400 national semiconductor
Abstract: sine wave generator using LM358 a13 marking sot23 eme marking sot23 lm358 sum LMV321 LMV321M5 LMV324 MAL LM393 LMV339
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lmv321lmv331lmv821lmv358+12 | |
MIP 2F4
Abstract: 940GML 943GML ic MIP 2F4 generation of PWM for inverter pic 18f intel 943gml 82801gb 943gml cpu 945GM C30-A38
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945gmsmip 2f4940gml943gml+7 | |
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