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    324 BGA THERMAL Search Results

    324 BGA THERMAL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER
    		Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical PDF
    TCTH022AE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Datasheet
    TCTH011AE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Datasheet
    TCTH011BE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type Datasheet
    TCTH012AE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Datasheet

    324 BGA THERMAL Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SMBD1

    Contextual Info: SLC90E46 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E46 SouthBridge Member of High Performance TeXas Chipset FEATURES • • • • • • • • • 324 Pin BGA South Bridge Chip Supports Pentium Com patible Processor With SLC90E42 North Bridge Chip


    OCR Scan     		SLC90E46 SLC90E46 SLC90E42 DMA/33â 13/Default 13/Description 28/Bit 31/Description SMBD1 PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: C5200 C52006-1 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20
    Contextual Info: 15. Package Information for Cyclone Devices C52006-1.2 Introduction This data sheet provides package information for Altera devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . 15–1


    Original     		C52006-1 EP1C12 EP1C20 BGA 256 PACKAGE thermal resistance C5200 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20 PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance C52006-1 EP1C12 BGA400 EP1C6 C5200
    Contextual Info: 15. Package Information for Cyclone Devices C52006-1.3 Introduction This data sheet provides package information for Altera devices. It includes the following sections: • ■ ■ “Device and Package Cross Reference” on page 15–1 “Thermal Resistance” on page 15–2


    Original     		C52006-1 EP1C20 BGA 256 PACKAGE thermal resistance bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance EP1C12 BGA400 EP1C6 C5200 PDF

    altera cyclone 3

    Abstract: C52006-1 EP1C12 table 15
    Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications. This section includes the following chapter:


    Original     		EP1C12 EP1C20 altera cyclone 3 C52006-1 EP1C12 table 15 PDF

    altera cyclone 3

    Abstract: C5200 C52006-1 EP1C12 BGA256 altera cross reference EP1C6
    Contextual Info: Section VII. Cyclone Device Package Information This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


    Original     		EP1C20 altera cyclone 3 C5200 C52006-1 EP1C12 BGA256 altera cross reference EP1C6 PDF

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance PDF

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    bu61740b

    Abstract: BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal
    Contextual Info: Micro-ACE , Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 bu61740b BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal PDF

    BU-6474XB

    Abstract: BU-64840R3 BU-64860B3
    Contextual Info: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3 PDF

    BU-64843B8

    Abstract: BU-64863B8-E02 BU-64860B3-E02 BU-65863B8-E02 BU-64840B3-E02 BU-64840B3 BU-64843B8-E02 BU-65864B3-E02 BU-6XXXXB3-E02 BU-65863B8-E
    Contextual Info: Micro-ACE TE and PCI Micro-ACE TE MODEL: BU-6484XB / 6486XB / 6584XB / 6586XB www.ddc-web.com This Preliminary Product Brief provides detailed functional capabilities for product currently in prototype production. These specifications are being provided to allow for electrical design,


    Original     		BU-6484XB 6486XB 6584XB 6586XB 553A/B A5976 1-800-DDC-5757 BU-64843B8 BU-64863B8-E02 BU-64860B3-E02 BU-65863B8-E02 BU-64840B3-E02 BU-64840B3 BU-64843B8-E02 BU-65864B3-E02 BU-6XXXXB3-E02 BU-65863B8-E PDF

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    pin information ep3c10

    Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
    Contextual Info: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55 PDF

    Micro-ACE-TE

    Contextual Info: Micro-ACE , Micro-ACE-TE, and PCI Micro-ACE-TE Product Brief Models: BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 DDC's Micro-ACE series of MIL-STD-1553 terminals with 1553 protocol, memory, and either +3.3V or +5V transceiver, in a small plastic BGA. This series is ideal for use in mixed voltage applications where PC board space is limited.


    Original     		BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 MIL-STD-1553 MIL-STD-1760 128-ball 324-ball AS9100 Micro-ACE-TE PDF

    pin information ep3c10

    Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
    Contextual Info: Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		EP3C25 EP3C10 pin information ep3c10 u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164 PDF

    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 PDF

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray PDF

    micro fineline BGA

    Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
    Contextual Info: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1


    Original     		MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z PDF

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Contextual Info: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


    Original     		PDF