3216T Search Results

w13002

Abstract: 03352 W1-300
Contextual Info: NM1-3216TWC4-01 Feature ◆ ◆ ◆ ◆ Viewing angle:140 deg The materials of the LED dice is InGaN/GaN 3.20mmx1.60mm×0.70mm SMT-LED RoHS compliant lead-free soldering compatible Package Outline RESIN: EPOXY BONDING WIRE:Φ25um Au LED DICE 1 2 PRINTED CIRCUIT BOARD: BT

Contextual Info: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS

smd fuse p

Abstract: smd fuse m smd fuses fuse 12a smd 3216TD 3216FF backlight fuse
Contextual Info: 3216TD Series Time Delay Chip Fuse Provides Superior Protection Against Inrush Currents TM Offering the Highest I2T Rating in its Class, the 3216TD Series is Available up to 12 Amps 1. Superior Inrush Withstand Performance The 3216TD provides top notch protection against nuisance

3216TD

Abstract: IEC-286-3 3216TD10 3216TD10-R
Contextual Info: HALOGEN Time-Delay Chip Fuses HF FREE 3216TD Series Pb Dimensions - mm in Drawing Not to Scale Description • Time-delay, surface mount fuse • RoHS compliant, lead-free and halogen-free • High inrush withstand capability • Wire-in-Air performance

KPK-3216TGC

Contextual Info: 3.2X1.6mm SMD CHIP LED LAMP KPK-3216TGC GREEN Features Description !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. The Green source color devices are made with !LOW POWER CONSUMPTION. InGaN on SiC Light Emitting Diode. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR.

Contextual Info: Overcurrent Protection Group TABLE OF CONTENTS Fuse Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .OC-3 Printed Circuit Board Fuses Surface Mount Fuses 0603FA Chip Fuses 3216TD Chip™ Fuses

M1207

Contextual Info: Chip Fuses 3216TD Series, Time-Delay Dimensions - mm in Drawing Not to Scale 3.2±0.1 (0.125) 5A 1.0±0.1 (0.038) 1.6±0.1 (0.063) th. 0.1mm Description • Time-delay, surface mount fuse • Protects against harmful overcurrents in secondary applications

Contextual Info: Chip Fuses 3216TD Series, Time-Delay Dimensions - mm in Drawing Not to Scale 3.2±0.1 (0.125) 5A 1.0±0.1 (0.038) 1.6±0.1 (0.063) th. 0.1mm Description • Time-delay, surface mount fuse • Protects against harmful overcurrents in secondary applications

Contextual Info: Chip Fuses 3216TD Series, Time Delay Printed Circuit Board Fuses - Surface Mount Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow

Contextual Info: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS

Contextual Info: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS

Contextual Info: Chip Fuses 3216TD Series, Time Delay Description • Protects against harmful overcurrents in secondary applications • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder ELECTRICAL CHARACTERISTICS

Contextual Info: 3.2x1.6 mm SMD CHIP LED LAMP ATTENTION P/N: KPK-3216TGC GREEN OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features O3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. OLOW POWER CONSUMPTION. Description The Green source color devices are made with InGaN

Contextual Info: 3.2x1.6 mm SMD CHIP LED LAMP ATTENTION KPK-3216TGC GREEN OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. The Green source color devices are made with InGaN LOW POWER CONSUMPTION.

Cross Reference

Abstract: CF06V CF04V 0603SB 3216TD FHC32 1206FA CF12V 0603FA BEL 5a
Contextual Info: Chip Fuse Cross Reference 1206 AEM slow blow fast action high inrush slow blow fast action 1206FA 0.5-8A 1206HI 1-5A 0603FA 0.5-6A 0603HI 1-5A 0603SB 1-5A 0402FA 0.5-4A USF1206 0.375-4A 1206SB 1-8A 468/430 0.5-3A 3216TD 1-5A CIS 0.75-5A USI1206 0.5-6.3A FCC/FHC32-AD

KPK-3216TGC

Contextual Info: 3.2x1.6 mm SMD CHIP LED LAMP Part Number: KPK-3216TGC Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. The Green source color devices are made with InGaN on

TR/3216TD

Abstract: 3216TD1-R IEC-286-3 3216TD 3216TD7-R 3216TD8-R 3216TD10-R 3216TD5-R 3216TD6
Contextual Info: Chip Fuses 3216TD Series, Time-Delay Dimensions - mm in Drawing Not to Scale 1.6±0.1 (0.063) 3.2±0.1 (0.125) 5A 1.0±0.1 (0.039) 1.6±0.1 (0.063) th. 0.1mm Description • Time-delay, surface mount fuse • RoHS compliant and Lead Free • High inrush withstand capability

NS 12575T 6R8MN

Abstract: hioki 3200 hp 4192a nrs8030 NRS4018 NRV2012T NRS4018T220MDGJ 470MN NRS5024T4R7MMGJ NS 12565T 680MN
Contextual Info: Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS • Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products.

lL33

Abstract: VOAC-7512 HM-75
Contextual Info: Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS • Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products.

VK105

Abstract: 55VRMS UJ-750 TK-470
Contextual Info: Notice for TAIYO YUDEN products 1 Please read this notice before using the TAIYO YUDEN products. • Product information in this catalog is as of October 2008. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the

Contextual Info: No. MLPGE11010 PRODUCT SPECIFICATION P/N: FI212L062009-T Type: MULTILAYER FILTER Soldering : Reflow only Issue date: 14.Feb.2011 Applicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System

Contextual Info: NO.MLPGE10021 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER Fl 168D087018-T TAIYO YUDEN CO., LTD. Date :4.Aug.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics

Contextual Info: NO.MLPGE10028 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER FI 212B448802-T TAIYO YUDEN CO., LTD. Date: 20.0ct.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics

Contextual Info: No. MLPGE11007 PRODUCT SPECIFICATION P /N : FI 212C 245036-T T yp e: M U LTILAY E R FILTER S o ld e rin g : R eflow only Issue date: 14.Feb.2011 A pplicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System