30A04902 Search Results

Contextual Info: □PM Dense-Pac Microsystems. Inc. <T DPV32X16A 32K X 16 UVEPROM PGA MODULE O PRELIM IN ARY DESCRIPTION: The DPV32X16A is a 40-pin Pin G rid Array PGA consisting o f tw o 32K X 8 UVEPROM devices in ceram ic LCC packages surface m ounted on a co-fired ceram ic substrate w ith m atched thermal coefficients.

0-32k

Abstract: CERAMIC PIN GRID ARRAY 120 pins 6A14
Contextual Info: £ n jS ¡^ DPV32X16A Dense-Pac Microsystems, Inc. 0 _ 32K X 16 UVEPROM PGA MODULE PRELIMINARY DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired

Contextual Info: □PM D P V 3 2 X 1 6 A Dense-Pac Microsystems. Inc. 32K X 16 UVEPROM PGA MODULE O PRELIMINARY DESCRIPTION: The D PV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 U VEPRO M devices in ceramic LC C packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

MEAB

Contextual Info: DENSE-PAC 0,5 Megabit UVEPROM DPV32X16A M I C R O S Y S T E M S DESCRIPTION: The D PV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 U VEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: _ ' / f ' _ DENSE-PAC 0.5 Megabit UVEPROM D P V3 2 X 16A MICROSYSTEMS DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired