300DIP Search Results

Contextual Info: b i l l 5 4 e! 0 0 0 2 0 4 1 3ÔE D MI CR ON T E C H N O L O G Y INC 3 « Í1 R N T - 4 4 .- 2 1 - /2 •j»-. iififttftllìì—xrtiì'' 2K X 8 SRAM SRAM FEATURES PIN ASSIGNMENT Top View OPTIONS M A R K IN G • Timing 12ns access 15ns access 20ns access

Contextual Info: FIC SERIES IDC ~ DIP Flat Cable Connector MATERIAL Insulator: Contact: Contact Plating: Black PBT UL 94V-0 Copper Alloy Tin or Gold Over Nickel (see "Plating Option" below) S P E C IF IC A T IO N S Current Rating: Insulator Resistance: Contact Resistance:

Contextual Info: MICRON TECHNOLOGY INC 3fiE D b l U S M T D0027ÖS fi BiflRN m T -M -ii-o Ç t [iUiiW 4K X 4 SRAM SRAM WITH SEPARATE INPUTS AND OUTPUTS FEATURES PIN ASSIGNMENT Top View « High speed: 12,15,20,25,30 and 35ns • High-performance, low-power, CMOS double metal

A10C

Abstract: HD4 marking
Contextual Info: CRGN M T 5C 1606/7 SRAM 4K x 4 SRAM WITH SEPARATE INPUTS AND OUTPUTS FEATURES PIN ASSIGNMENT Top View OPTIONS M ARKING • Tim ing 12ns access 15ns access 20ns access 25ns access 30ns access 35ns access -12 -15 -20 -25 -30 -35 • Packages Plastic DIP (300 m il)

Contextual Info: |U |C = R O IV J MT5C1606/7 SRAM 4K x 4 SRAM WITH SEPARATE INPUTS AND OUTPUTS FEATURES • High speed: 12,15,20,25,30 and 35ns • High-performance, low-power, CMOS double metal process • Single +5V ±10% power supply • Easy memory expansion with CE option