300MIL Search Results

zif socket

Abstract: SOIC16 socket zif soic16 socket SOIC-16
Contextual Info: DIL16W/SOIC16 ZIF 300mil ord.no. 70-0881 universal adapter, assigned for SOIC devices up to 16-pins operation (mechanical) life of ZIF socket - 10.000 actuations made in Slovakia Ord. no 70-0881 Socket ZIF SOIC16, open top type Bottom 2 rows, 2x 8 pins, square, 0.6x0.6mm, rows spacing

DIP20

Contextual Info: SANYO Semiconductor Dual In-line Package 20Pin Plastic DIP20 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Shrink Dual In-line Package 10Pin Plastic DIP10S 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

DIP14

Abstract: 300mil
Contextual Info: SANYO Semiconductor Dual In-line Package 14Pin Plastic DIP14T 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Small Outline Package 18Pin Plastic MFP18 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Dual In-line Package 14Pin Plastic DIP14TD 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 26 PIN PLASTIC FPT-26P-M02 Lead pitch 50mil Package width 300mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 26-pin plastic TSOP II (FPT-26P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)

FPT-24P-M01

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M01 EIAJ code : ∗SOP024-P-0300-1 Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold 24-pin plastic SOP FPT-24P-M01 24-pin plastic SOP

Contextual Info: UG9M43722 4 KBG(T) 16M Bytes (4M x 36) DRAM 72Pin SIMM w/ECC based on 4M X 4 General Description Features The UG9M43722(4)KBG(T) is a 4,149,304 bits by 36 SIMM module.The UG9M43722(4)KBG(T) is assembled using 9 pcs of 4Mx4 2K/4K refresh DRAMs 300mil SOJ Package mounted on 72 Pin

Contextual Info: UG54W742 4 4GJ(T)G 32M Bytes (4M x 72) DRAM 168Pin DIMM With ECC based on 4M x 4 General Description Features The UG54W742(4)4GJ(T)G is a 4,194,304 bits by 72 EDO DRAM module. The UG54W742(4)4GJ(T)G is assembled using 18 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in

Contextual Info: UG54W662 4 4GJ(T)G 32M Bytes (4M x 64) DRAM 168Pin DIMM based on 4M x 4 General Description Features The UG54W662(4)4GJ(T)G is a 4,194,304 bits by 64 EDO DRAM module. The UG54W662(4)4GJ(T)G is assembled using 16 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in

we 510

Abstract: UG9M
Contextual Info: UG9M13621DBG T 4M Bytes (1M x 36 ) DRAM w/Parity 72Pin SIMM based on 1M X 4 General Description Features The UG9M13621DBG(T) is a 1,048,576 bits by 36 SIMM module.The UG9M13621DBG(T) is assembled using 8 pcs of 1Mx4 1K refresh in 300mil package, and 1 pc of 1Mx4 Quad-CAS

Contextual Info: UG58E642 4 4GJ(T)L 64M Bytes (8M x 64) DRAM 168Pin DIMM based on 4M x 4 General Description Features The UG58E642(4)4GJ(T)L is a 8,388,608 bits by 64 EDO DRAM module. The UG58E642(4)4GJ(T)L is assembled using 32 pcs of 4Mx4 2K/4K refresh DRAMs in 300mil SOJ/TSOP package, and

1Mx4

Contextual Info: UG8M13201DBJ N 4M Bytes (1M x 32 ) DRAM 72Pin SIMM based on 1M X 4 General Description Features The UG8M13201DBJ(N) is a 1,048,576 bits by 32 SIMM module.The UG8M13201DBJ(N) is assembled using 8 pcs of 1Mx4 1K refresh in 300mil package,mounted on a 72 Pin unbuffered

KSZ8721B

Abstract: sn0736 "sn 0732" KSZ8721BL SN0726 ksz8721bla4 ksz8721bt SSOP-300mil spnz801 KSZ8721CL
Contextual Info: 2007 ETHERNET PACKAGE RELIABILITY High Temperature Storage Life +150 deg C, 1000 hours Device Lot No Pkg Pin Pre-con. KSZ8721SL A4TR GDN2621 SSOP 300mil 48L N/A KSZ8721BL GDN2631 LQFP(7*7mm) 48L N/A KSZ8721BLA4 GDN2619 LQFP(7*7mm) 48L N/A KSZ8721SL TR GDN3785

motorola mc146818B crystal

Abstract: motorola mc146818B DS12885S MC146818B DS1285 DS12885 DS12885N DS12885Q DS12885QN DS12885T
Contextual Info: www.maxim-ic.com DS12885/DS12885Q/DS12885T Real-Time Clock www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § § § § DS12885, 24 DIP DS12885S, 24 SO 300mil § PIN ASSIGNMENT Top View Drop- in replacement for IBM AT computer clock/calendar

20P2N-A

Abstract: 20P2N SOP20 Package
Contextual Info: 20P2N-A Plastic 20pin 300mil SOP EIAJ Package Code SOP20-P-300-1.27 JEDEC Code – Weight g 0.26 Lead Material Cu Alloy e 11 E Recommended Mount Pad 1 Symbol F 10 A D A2 A1 b y L e L1 HE e1 I2 20 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

SSOP24-P-300-0

Abstract: 24P2Q 24p2q-a
Contextual Info: 24P2Q-A Plastic 24pin 300mil SSOP EIAJ Package Code SSOP24-P-300-0.80 JEDEC Code – Weight g 0.2 Lead Material Cu Alloy e I2 13 E F Recommended Mount Pad Symbol 1 12 A A2 A1 D L L1 HE e1 24 b2 e y c b Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

20PIN

Abstract: P20C
Contextual Info: 20PIN PLASTIC DIP 300mil 20 11 1 10 A K L H G J I P F D N M C B M 0~15° P20C - 100 - 300SA NOTE 1) Each lead centerline is located within 0.25 mm(0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed

DIP12F

Abstract: DIP-12F
Contextual Info: SANYO Semiconductor Dual In-line Package 12Pin Plastic DIP12F 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

DIP22S

Contextual Info: SANYO Semiconductor Shrink Dual In-line Package 22Pin Plastic DIP22S 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

DIP-24

Contextual Info: SANYO Semiconductor Dual In-line Package 24Pin Plastic DIP24 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: SANYO Semiconductor Dual In-line Package 8Pin Plastic DIP8 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

DIP20

Abstract: DIP-20
Contextual Info: SANYO Semiconductor Dual In-line Package 20Pin Plastic DIP20 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。