2X2MX32 Search Results

Contextual Info: MITSUBISHI MEM OR Y CARD D Y N A M I C R A M C AR D S 1x2Mx32bit DRAM Card M F 1 8 M M F 1 1 6 1 M - J 5 7 A T X X - J 5 7 A T X X 2x2Mx32bit D R A M Card C o n n e c to r T y p e T w o -p ie c e 8 8 -p in D E S C R IP T IO N These DRAM CARDs are develo ped

Contextual Info: MITSUBISHI MEMORY CARD DYNAMIC RAM CARDS 1x2Mx32bit D R A M Card 2x2Mx32bit D R A M Card MF18M1-J57ATXX MF116M- J 5 7 A T X X Connector Type T w o-piece 88-p in / 7 DESCRIPTION These DRAM CARDs a re developed based on J E I D A D R A M C A R D G U I D E L I N E V e r . 2.1.

Contextual Info: a WHITE /MICROELECTRONICS 2x2Mx32 5V FLASH S IM M WPF4M32XA-90PSC5 PRELIMINARY* FEATURES • ■ A cce ss T im e o f 90ns ■ 1 00 ,00 0 E ra se/P ro gra m C ycles Packaging: ■ O rganized as tw o banks o f 2 M x3 2 • 8 0-p in S IM M ■ C o m m e rcia l T e m p e ra tu re Range

Am29f

Contextual Info: I/VHITE /M ICROELECTRONICS ç a 2x2Mx32 5V FLASH SIMM WPF4M32XA-90PSC5 P R ELIM IN A R Y * FEATURES • A ccess Tim e o f 90ns ■ 100,000 Erase/Program Cycles ■ Packaging: ■ Organized as tw o banks o f 2 M x 3 2 • 80-pin S IM M ■ C om m ercial Te m p e ra tu re Range

80 pin simm flash

Abstract: AM29LV017B EDI7F332MV
Contextual Info: White Electronic Designs EDI7F332MV 2Mx32 FLASH MODULE FEATURES 2Mx32 and 2x2Mx32 Densities Data Polling and Toggle Bit feature for detection of program or erase cycle completion Based on AMD - AM29LV017B Flash Device Low Power Dissipation Fast Read Access Time - 90ns

29F016-90

Contextual Info: WPF4M32XA-90PSC5 2x2Mx32 5V FLASH SIMM p r e l im in a r y * FEATURES • ■ 100,000 Erase/Program Cycles A cce ss Time of 90ns Packaging: Organized as two banks of 2M x32 • 80-pin SIM M Com m ercial Temperature Range • The module is m anufactured w ith eight 2M x8 CM O S Flash

Contextual Info: MITSUBISHI M EM ORY CARD DYNAMIC RAM CARDS 1x2Mx32bit D RAM Card M F 1 8 M 1 - L 5 7 A T X X M F 1 1 6 M - L 5 7 A T X X 2x2Mx32bit DRAM Card Connector Type T w o - p ie c e 8 8 -p in ✓ """ D E S C R IP T IO N These D R A M C A R D s are developed based

L88-Pin

Abstract: 24D40
Contextual Info: MITSUBISHI M EM O RY CAR D D Y N A M I C R A M CARDS 1x2Mx32bit D R A M Card MF18M1-L57ATXX MF116M-L57ATXX 2x2Mx32bit D R A M Card Connector Type T w o - p ie c e 8 8 - p i n / — ^ DESCRIPTION These D R A M C A R D s are developed based on J E I D A D R A M C A R D G U I D E L I N E Ver. 2. 1.

AM29F016

Abstract: EDI7F332MC
Contextual Info: White Electronic Designs EDI7F332MC 2Mx32 FLASH MODULE FEATURES „ „ 2Mx32 and 2x2Mx32 Densities „ Based on AMD - AM29F016 Flash Device „ Fast Read Access Time - 90ns „ Data Polling and Toggle Bit feature for detection of program or erase cycle completion

AM29LV017B

Abstract: EDI7F332MV
Contextual Info: White Electronic Designs EDI7F332MV 2Mx32 FLASH MODULE FEATURES „ Data Polling and Toggle Bit feature for detection of program or erase cycle completion „ Low Power Dissipation „ 2Mx32 and 2x2Mx32 Densities „ Based on AMD - AM29LV017B Flash Device „ Fast Read Access Time - 90ns

Contextual Info: WHITE /MICROELECTRONICS 2x2Mx325V FLASH SIMM W PF4M 32XA-90PSC5 PRELIMINARY* FEATURES • A ccess Tim e of 90ns ■ Packaging: • 80-pin S IM M • The m odule is m a nufa cture d w ith eigh t 2 M x8 CMOS Rash ■ 100,000 E rase/Program Cycles ■ O rganized as tw o banks of 2M x32

Contextual Info: c H/HITE /MICROELECTRONICS a 2x2Mx32 5V FLASH S IM M WPF4M32XA-90PSC5 PRELIMINARY* FEATURES • ■ A c c e s s Tim e of 9 0 n s ■ 100,000 Erase/Program C ycles Packaging: ■ O rganized a s tw o b a n ks of 2 M x 3 2 • 80-pin S I M M ■ Com m ercial Tem perature R ange

SIMM 80 jedec

Abstract: 80 pin simm flash Flash SIMM 80 E28F016S5 EDI7F342MC
Contextual Info: EDI7F342MC White Electronic Designs 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's E28F016S5 2Mx8 Flash device in TSOP packages which are mounted on an

28F016S3

Abstract: EDI7F342MV 80pin-SIMM
Contextual Info: EDI7F342MV White Electronic 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3 2Mx8 Flash device in TSOP packages which are mounted on an

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

bsc 60h

Contextual Info: White Electronic Designs W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Advanced FEATURES • Access Times of 100, 120, 150ns ■ Unlock Bypass Program command ■ Packaging • • 159 PBGA, 13x22mm - 1.27mm pitch Reduces overall programming time when issuing

AM29LV017B

Abstract: EDI7F332MV 15607
Contextual Info: EDI7F332MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MV and EDI7F2332MV are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29LV017B- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

SIMM 80 jedec

Abstract: E28F016S5 EDI7F342MC
Contextual Info: EDI7F342MC White Electronic 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's E28F016S5 2Mx8 Flash device in TSOP packages which are mounted on an

W72M64VK-XBX

Abstract: W72M64V-XBX
Contextual Info: White Electronic Designs W72M64VK-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • Reduces overall programming time when issuing multiple program command sequences

AM29F016

Abstract: 80 pin simm flash EDI7F332MC
Contextual Info: EDI7F332MC White Electronic Designs 2Mx32 FLASH MODULE FIG. 1 DESCRIPTION BLOCK DIAGRAMS The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on a FR4 substrate.

Contextual Info: White Electronic Designs W72M64VB-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES  Access Times of 90, 100, 120ns  Packaging  • Write protect WP# function allows protection two outermost boot sectors, regardless of sector

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV White Electronic Designs 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3 2Mx8 Flash device in TSOP packages which are mounted on an

MARK J3

Abstract: AM29F016 EDI7F332MC amd AM29F016
Contextual Info: EDI7F332MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS