28-PIN CERDIP Search Results

50-mil

Abstract: 28-PIN CERDIP FPT-28C-C03
Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-C03 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-28C-C03 28-pin ceramic SOP (FPT-28C-C03) 9.53±0.64

1201020

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-C02 28-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Cerdip FPT-28C-C02 28-pin ceramic SOP (FPT-28C-C02)

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC FPT-28C-C03 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-28C-C03 28-pin ceramic SOP (FPT-28C-C03) 9.53±0.64 (.375±.025) +0.33 9.83 –0.30 +.013

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC FPT-28C-C07 28-pin ceramic SOP Lead pitch 30 mil Lead shape Straight Sealing method Cerdip FPT-28C-C07 28-pin ceramic SOP (FPT-28C-C07) 0.13(.005)MAX OFFSET & glass seal 3.94±0.25 (.155±.010)

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC FPT-28C-C02 28-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Cerdip FPT-28C-C02 28-pin ceramic SOP (FPT-28C-C02) 0.05(.002) MIN 13.335(.525) TYP R0.51(.020)

28-PIN CERDIP

Contextual Info: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-C07 Lead pitch 30mil Lead shape Straight Sealing method Cerdip 28-pin ceramic SOP FPT-28C-C07 28-pin ceramic SOP (FPT-28C-C07) 0.13(.005)MAX OFFSET & glass seal 3.94±0.25 (.155±.010) 0.76±0.05 (.030±.002)

c03 diode

Contextual Info: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-C03 Lead pitch 50mil Lead shape Straight Sealing method Cerdip 28-pin ceramic SOP FPT-28C-C03 28-pin ceramic SOP (FPT-28C-C03) 9.53±0.64 (.375±.025) +0.33 9.83 –0.30 +.013 .387 –.012 INDEX AREA 27.94(1.100)

28 pin ceramic dip

Abstract: DIP28C-C02
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-C02 EIAJ code : ∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38 (1.450 +– .050 .015 ) R0.64 (.025)

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 28 PIN CERAMIC FPT-28C-C02 Lead pitch 50mil Lead shape Gullwing Sealing method Cerdip 28-pin ceramic SOP FPT-28C-C02 28-pin ceramic SOP (FPT-28C-C02) 0.05(.002) MIN 13.335(.525) TYP R0.51(.020) 11.40 .449 1.27±0.13 (.050±.005)

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-C07 28-pin ceramic SOP Lead pitch 30 mil Lead shape Straight Sealing method Cerdip FPT-28C-C07 28-pin ceramic SOP (FPT-28C-C07) 0.13(.005)MAX OFFSET & glass seal

Contextual Info: HV18 inc. 8-Channel High Voltage Analog Switch Ordering Information_ Package Options Vpp Vnn +70V +80V VsiG 28-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 28-pin Plastic DIP 28-lead Plastic Chip Carrier

Contextual Info: XL2864A MICROELECTRONICS ExctBtnce Itt Ê* 8K X 8 Electrically Erasable PROM FEATURES PIN CONFIGURATION Fast Read Access Times — 250ns, 300ns, 350ns, 450ns 28 Pin CERDIP Type "C" Package 28 Pin PDIP Type "P" Package 5 Volt-only Operation Including Write

intel PLCC packaging draw

Contextual Info: Page 1 of 12 IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier

Contextual Info: MICROELECTRONICS XL2865A 8K X 8 Electrically Erasable PROM PIN CONFIGURATION FEATURES 28 Pin PDIP Type "P" Package • Fast Read Access Times — 250ns, 300ns, 350ns, 450ns 28 Pin CERDIP Type "C" Package ■v ^ r , ■ 5 Volt-only Operation — Including Write

Contextual Info: HV227 inc. HV228 Low Charge Injection 8-Channel High Voltage Analog Switch Ordering Information Package Options Operating V p p -V NN 28-pin ceramic* side-brazed DIP Die in waffle pack 28-pin plastic DIP 28-lead plastic chip carrier 28-lead SOW 140V HV22714C

Contextual Info: ISO-CMOS MT8808 8 x 8 Analog Switch Array M IT E L • Features ISSUE 2 Internal control latches and address decoder Short set-up and hold times November 1988 O rdering Inform ation MT8808AC 28 Pin Ceramic DIP MT8808AE 28 Pin Plastic DIP MT8808AP 28 Pin PLCC

B-3067

Abstract: B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120
Contextual Info: INDUSTRY CROSS REFERENCE GUIDE ARINC 429 PACKAGE HOLT PART DEI LINE DRIVER 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 28-PIN CERAMIC LEADLESS CHIP CARRIER 28-PIN CERAMIC LEADLESS CHIP CARRIER

Contextual Info: v, MICROELECTRONICS XL2864A E x c tB m c f in E1 8K X 8 Electrically Erasable PROM FEATURES PIN CONFIGURATION Fast Read Access Times — 250ns, 300ns, 350ns, 450ns 28 Pin CERDIP Type "C" Package 28 Pin PDIP Type "P" Package NC [ 1 5 Volt-only Operation Including Write

2216P

Contextual Info: ^ Super tex inc. H V22 8-Channel High Voltage Analog Switch Ordering information_ Package Options V - V NN Y PP 28-pin ceram ic*’ side-brazed DIP 140 V 160 V 28-pin plastic DIP Die in waffle pack 28-lead plastic chip carrier

XL28C256

Abstract: XLS28C256
Contextual Info: XL28C256 MICROELECTRONICS Excêtonctlnf? Preliminary 32K X 8 CMOS Electrically Erasable PROM 5ms Nonvolatile Write Cycle FEA T U R E S PIN C O N F IG U R A TIO N S 28 Pin Plastic DIP Type "P" Package 28 Pin CERDIP Type "C" Package • Fast Read A ccess Tim es

Contextual Info: CY7B339 PRELIMINARY CYPRESS SEMICONDUCTOR • Available in 28-pin 300-mil PDIP and CerDIP, and in SOJ, PLCC, and LCC packages • Very high performance decoder with latched outputs — tpD = 7 ns Functional Description The CY7B339 is a 7-ns, 28-pin program­

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat