22MIL Search Results

Contextual Info: TPCS8201 TO SHIBA TOSHIBA FIELD EFFECT TRANSISTOR SILICON N CHANNEL MOS TYPE U-M O SH TPCS8201 LITHIUM ION BATTERY NOTE BOOK PC INDUSTRIAL APPLICATIONS Unit in mm 8 PORTABLE MACHINES AND TOOLS • • • • Low Drain-Source ON Resistance : RßS (ON)= 22mil (Typ.)

Contextual Info: SN65LVCP402 www.ti.com SLLS699 – JUNE 2007 Gigabit 2x2 CROSSPOINT SWITCH • • • • • • • • • • Up to 4.25 Gbps Operation Non-blocking Architecture Allows Each Output to be Connected to Any Input 30 ps of Deterministic Jitter Selectable Transmit Pre-Emphasis Per Lane

CDCP1803

Abstract: CDCP1803RTHR JESD51-7 SLUA271
Contextual Info: CDCP1803 1:3 LVPECL CLOCK BUFFER WITH PROGRAMMABLE DIVIDER SCAS727B − NOVEMBER 2003 − REVISED FEBRUARY 2004 D Distributes One Differential Clock Input to S2 Vdd0 /Y0 Y0 Vdd0 S1 24 23 22 21 20 19 18 S0 VddPECL 2 17 Vdd1 IN 3 16 Y1 IN 4 15 Y1 VddPECL 5 14

Contextual Info: SN65LVCP402 www.ti.com. SLLS699A – JUNE 2007 – REVISED JANUARY 2009 Gigabit 2x2 CROSSPOINT SWITCH FEATURES

Contextual Info: User's Guide SLVU304C – April 2009 – Revised November 2011 TPS23754EVM-383 EVM: Evaluation Module for TPS23754 This User’s Guide describes the TPS23754 EVM TPS23754EVM-383 . TPS23754EVM-383 contains evaluation and reference circuitry for the TPS23754. The TPS23754 is an IEEE 802.3at compliant

440MX

Abstract: 443BX Pentium III Developer geyserville
Contextual Info: Mobile Intel Pentium III Processor in BGA2 and MicroPGA2 Packages Featuring Intel SpeedStep Technology at 850 MHz, 800 MHz, 750 MHz, 700 MHz, and Low-voltage 600 MHz Datasheet Product Features ! Processor core/bus speeds: − − − − − Featuring Intel® SpeedStepTM

Contextual Info: CDCP1803 www.ti.com SCAS727F – NOVEMBER 2003 – REVISED DECEMBER 2013 1:3 LVPECL CLOCK BUFFER WITH PROGRAMMABLE DIVIDER Check for Samples: CDCP1803 FEATURES 1 S1 VDD0 Y0 Y0 VDD0 24 23 22 21 20 19 18 VDDPECL 2 17 VDD1 IN 3 16 Y1 IN 4 15 Y1 VDDPECL 5 14 VDD1

440MX

Abstract: 443BX X5R CAPACITOR TDK
Contextual Info: R Mobile Intel Pentium III Processor in BGA2 and MicroPGA2 Packages Featuring Intel SpeedStep Technology at 1 GHz, 900 MHz, 850 MHz, 800 MHz, 750 MHz, 700 MHz, Low-voltage 750MHz, Low-voltage 700MHz, Low-voltage 600 MHz, Ultra Lowvoltage 600 MHz and Ultra Low-voltage 500

Tektronix 2245a

Abstract: 2M3866 s2 umi 250v 1a Tektronix 2246a s 2 umi 1A 130 degree 250V 2N2369 transistor pulse generator PNP TRANSISTOR 1A 60V s 2 umi 1A 250V LARE RTL 1000 AVS Ralph Morrison Wiley
Contextual Info: um A pplication Note 47 August 1991 TECHNOLOGY High Speed Amplifier Techniques A Designer's Companion for W ideband Circuitry Jim Williams PREFACE This publication represents the largest LTC commitment to an application note to date. No other application note

gsm signal amplifier circuit diagram

Abstract: abstract for wireless communication system gsm with pic 48vdc schematic diagram TRF7003 Architecture of TMS320C54X with diagram trf8xxx AUDIO MOSFET POWER AMPLIFIER SCHEMATIC schematic diagram TRF8011 AUDIO MOSFET POWER AMPLIFIER SCHEMATIC
Contextual Info: Evaluation Board Documentation TRF8011 and 2 X TRF7003 RF Power Amplifier 4.8 Volts GSM Application APPLICATION BRIEF: SWRA013 Wireless Communication Business Unit Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

EPF10K50E

Contextual Info: Designing with FineLine BGA Packages November 1999, ver. 1.03 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the

Contextual Info: CDCM1804 www.ti.com SCAS697E – JULY 2003 – REVISED MAY 2005 1:3 LVPECL CLOCK BUFFER + ADDITIONAL LVCMOS OUTPUT AND PROGRAMMABLE DIVIDER S1 VDD0 17 VDD1 IN 3 16 Y1 IN 4 15 Y1 VDDPECL 5 14 VDD1 VBB 6 VDD3 1 VSS(1) 7 8 9 13 10 11 12 Thermal pad must be connected to VSS.

SLUA271

Abstract: QFN PACKAGE thermal resistance JESD51-7 QFN PACKAGE Junction to PCB thermal resistance CDCM1802 CDCM1802RGTR SCAA062 SLUA
Contextual Info: CDCM1802 CLOCK BUFFER WITH PROGRAMMABLE DIVIDER, LVPECL I/O + ADDITIONAL LVCMOS OUTPUT SCAS759 − APRIL 2004 D Distributes One Differential Clock Input to EN S1 Vss S0 16 15 14 13 11 Y0 IN 3 10 Y0 VBB 4 9 VDD0 8 2 Vdd1 IN 7 VDD0 Y1 D D 12 6 D 1 Vss D D VDDPECL

Contextual Info: RF5375 RF5375 2.4GHz to 2.5GHz, 802.11b/g/n WiFi Front End Module 2.4GHz TO 2.5GHz, 802.11b/g/n WiFi FRONT END MODULE VCC PDet 12 11 10 TX_IN 1  Single Supply Voltage 3.0V to 4.8V  Output Power: 11b=21dBm Meeting Spectral Mask 11n=18dBm at <2.5% EVM

QFN-24 reflow

Contextual Info: CDCP1803-EP www.ti.com. SCAS864 – DECEMBER 2008 1:3 LVPECL CLOCK BUFFER WITH PROGRAMMABLE DIVIDER

Contextual Info: CDCP1803 www.ti.com SCAS727E – NOVEMBER 2003 – REVISED JANUARY 2007 1:3 LVPECL CLOCK BUFFER WITH PROGRAMMABLE DIVIDER FEATURES S1 VDD0 Y0 Y0 VDDPECL 2 17 VDD1 IN 3 16 Y1 IN 4 15 Y1 VDDPECL 5 14 VDD1 VBB 6 1 VSS(1) 9 13 10 11 12 S0 VSS NC 8 VDD2 7 Thermal pad must be connected to VSS.

Contextual Info: CDCP1803 www.ti.com SCAS727D – NOVEMBER 2003 – REVISED NOVEMBER 2005 1:3 LVPECL CLOCK BUFFER WITH PROGRAMMABLE DIVIDER FEATURES S1 VDD0 Y0 Y0 VDDPECL 2 17 VDD1 IN 3 16 Y1 IN 4 15 Y1 VDDPECL 5 14 VDD1 VBB 6 1 VSS(1) 9 13 10 11 12 S0 VSS NC 8 VDD2 7 Thermal pad must be connected to VSS.

C101

Abstract: JESD51-7 LVCP402 SN65LVCP402 SN65LVCP402RGER
Contextual Info: SN65LVCP402 www.ti.com SLLS699 – JUNE 2007 Gigabit 2x2 CROSSPOINT SWITCH • • • • • • • • • • Up to 4.25 Gbps Operation Non-blocking Architecture Allows Each Output to be Connected to Any Input 30 ps of Deterministic Jitter Selectable Transmit Pre-Emphasis Per Lane

wifi RECEIVER CIRCUIT DIAGRAM

Abstract: wifi 2.4ghz DETECTOR CIRCUIT DIAGRAM
Contextual Info: RF5765 2.4GHz 802.11b/g/n WiFi FRONT-END MODULE Features    Integrated 2.4GHz b/g/n Amplifier, LNA, SP3T Switch, and Power Detector Coupler Single Supply Voltage 3.0V to 4.8V POUT =20dBm, 11g, OFDM at <4% EVM, 23dBm 11b Meeting 11b Spectral Mask Tx In

BGA NSMD ball

Abstract: EPF10K50E BGA15
Contextual Info: FineLine BGAパッケージを 使用したPCBの設計 1999年 11 月 ver. 1.03 イントロダク ション Application Note 114 プログラマブル・ロジック・デバイス（PLD）の集積度とI/Oピン数が増加 すると共に小さいサイズのパッケージとさらに幅広いパッケージ・オプ

RF5375TR7

Abstract: schematic wifi board wifi RECEIVER CIRCUIT DIAGRAM wifi amplifier circuit diagram 11N-50
Contextual Info: RF5375 RF53753.3V, 2.4GHz 802.11b/g/n WiFi Front End Module 3.3V, 2.4GHZ 802.11b/g/n WiFi FRONT END MODULE Features VCC PDet TX_IN 1 Integrated 2.5GHz b/g/n Amplifier, SP3T Switch, and Power Detector Coupler Vreg Single Supply Voltage 3.0V to 4.8V Output Power: 11b=21dBm

Contextual Info: CDCM1802 CLOCK BUFFER WITH PROGRAMMABLE DIVIDER, LVPECL I/O + ADDITIONAL LVCMOS OUTPUT SCAS759 − APRIL 2004 D Distributes One Differential Clock Input to EN S1 Vss S0 16 15 14 13 11 Y0 IN 3 10 Y0 VBB 4 9 VDD0 8 2 Vdd1 IN 7 VDD0 Y1 D D 12 6 D 1 Vss D D VDDPECL

Contextual Info: CDCM1804 1:3 LVPECL CLOCK BUFFER + ADDITIONAL LVCMOS OUTPUT AND PROGRAMMABLE DIVIDER SCAS697 – JULY 2003 D Distributes One Differential Clock Input to VSS VDD0 Y0 Y0 VDD0 S1 24 23 22 21 20 19 15 Y1 VDDPECL 5 14 VDD1 VBB 6 13 VDD3 12 4 Y3 Y1 IN VDD2 IN 11

Contextual Info: RF5755 3.3V, 2.4GHz 802.11b/g/n WLAN FRONT-END MODULE Features „ „ C_RX N/C BT 13 LNA VDD 1 Integrated 2.5GHz b/g/n Amplifier, LNA, SP3T Switch, and Power Detector Coupler Single Supply Voltage 3.0V to 4.8V POUT =20dBm, 11g, OFDM at <4% EVM, 23dBm 11b Meeting 11b Spectral Mask