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    225FA Search Results

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    Panduit Corp S100X225FAL

    LABEL SELF LAMINATNG 1X2.25" WHT
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    DigiKey S100X225FAL Bulk 1,000 1,000
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    Bourns Inc PTV09A-4225F-A503

    POT 50K OHM 1/20W CARBON LOG
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    DigiKey PTV09A-4225F-A503 Tray 751 1
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    Avnet Americas PTV09A-4225F-A503 Tray 14 Weeks 1,000
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    Mouser Electronics PTV09A-4225F-A503 1,064
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    Master Electronics PTV09A-4225F-A503 700
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    ams OSRAM Group SFH-225-FA

    SENSOR PHOTODIODE 900NM RADIAL
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    Matrix Orbital LK202-25-FA

    LCD MODULE 40 DIG 20 X 2
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    DigiKey LK202-25-FA Bulk 1
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    Master Electronics LK202-25-FA 35
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    Panduit Corp S200X225FAL

    LABEL SELF LAMINATING WHT 16/SHT
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    225FA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: SIEMENS Silicon PIN Photodiode Daylight Filter Dimensions in inches mm ; (35 5) .020 (.5) 1.317(33.5) .100 (254) j J_ , Cathode 1 .206(5.1) .181 (4.6) f-r .031 (.8) .016 (.4) ,.071 (1.8) rt)47(1.2) ,283 (7.2) .259(6.6) .043(1.1) .028(0.7) FEATURES • Especially suitable for application* of


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    225FA SFH225FA PDF

    Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


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    PDF

    Contextual Info: Hi-Flow 225F-AC Reinforced,Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225F-AC PROPERTY Color • Thermal impedance: 0.10°C-in 2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature


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    225F-AC D3418 PDF

    TRANSISTOR REPLACEMENT GUIDE d882

    Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
    Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,


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    PDF

    ASTM D374

    Abstract: D374 ASTM D5470
    Contextual Info: Hi-Flow 225F-AC Reinforced, Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.10°C-in2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature heat sinks • Foil reinforced, adhesive-coated


    Original
    225F-AC 225FAC ASTM D374 D374 ASTM D5470 PDF