225FAC Search Results

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

Contextual Info: Hi-Flow 225F-AC Reinforced,Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225F-AC PROPERTY Color • Thermal impedance: 0.10°C-in 2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,

ASTM D374

Abstract: D374 ASTM D5470
Contextual Info: Hi-Flow 225F-AC Reinforced, Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.10°C-in2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature heat sinks • Foil reinforced, adhesive-coated