225-PIN BGA Search Results

Contextual Info: Product Number: 587-10-225-07-006437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 225-07-006 15 X 15 # Of Pins Mill-Max Part Number 225 587-10-225-07-006437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737

Contextual Info: Preliminary GS816218/36/72B-225/200/180/166/150/133 1M x 18, 512K x 36, 256K x 72 16Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp 225 MHz–133MHz 2.5 V VDD 2.5 V or 3.3 V I/O Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation

CY7C1354BV25-200BZI

Abstract: CY7C1354BV25 CY7C1354BV25-166 CY7C1354BV25-200 CY7C1354BV25-225 CY7C1356BV25 CY7C1356BV25-200 CY7C1356BV25-225
Contextual Info: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz

Contextual Info: CY7C1354B CY7C1356B 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz

Contextual Info: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz

CY7C1354B

Abstract: CY7C1356B
Contextual Info: CY7C1354B CY7C1356B 9-Mb 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz

CY7C1354BV25

Abstract: CY7C1354BV25-166 CY7C1354BV25-200 CY7C1354BV25-225 CY7C1356BV25 CY7C1356BV25-200 CY7C1356BV25-225
Contextual Info: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz

CY7C1354B

Abstract: CY7C1356B 38T5 c12761
Contextual Info: CY7C1354B CY7C1356B 9-Mb 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz

Contextual Info: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz

CY7C1354B

Abstract: CY7C1356B
Contextual Info: CY7C1354B CY7C1356B 9-Mb 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz

Contextual Info: BGA IC264 Series IC264-22501-1- *-* Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No Mark: Both Pins 1 & 2 PN: Only Pin 1 NP: Only Pin 2 NN: No Pins Pin Count 225 Material PEI Glass Filled UL94V-0

CY7C1354C-200BGXC

Abstract: CY7C1354C CY7C1356C CY7C1356C-200AXC B8265
Contextual Info: CY7C1354C CY7C1356C PRELIMINARY 9-Mbit 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz

f6 diode

Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
Contextual Info: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27

Contextual Info: Preliminary GS816273C-250/225/200/166/150/133 256K x 72 18Mb S/DCD Sync Burst SRAMs 209-Pin BGA Commercial Temp Industrial Temp Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive

676 BGA package tray

Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Contextual Info: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)

Contextual Info: Preliminary GS815218/36/72B-225/200/180/166/150/133 1M x 18, 512K x 36, 256K x 72 16Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

Contextual Info: Preliminary GS816218/36/72B-250/225/200/166/150/133 1M x 18, 512K x 36, 256K x 72 16Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

GS816273

Abstract: GS816273C GS816273C-225 GS816273C-225I GS816273C-250 GS816273C-250I
Contextual Info: GS816273C-250/225 209-Pin BGA Commercial Temp Industrial Temp 256K x 72 18Mb S/DCD Sync Burst SRAMs Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 2.5 or 3.3 V +10%/–10% core power supply

Contextual Info: Preliminary GS8162Z18/36/72B-250/225/200/166/150/133 18Mb Pipelined and Flow Through Synchronous NBT SRAM 119 and 209 BGA Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

Contextual Info: Preliminary GS88218/36AB-250/225/200/166/150/133 119-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

Contextual Info: Preliminary GS8162Z18/36/72B-250/225/200/166/150/133 16Mb Pipelined and Flow Through Synchronous NBT SRAM 119 and 209 BGA Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

13007B

Abstract: GS882V37A GS882V37AB-200 GS882V37AB-225 GS882V37AB-250
Contextual Info: GS882V37AB/D-250/225/200 119- and 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive

GS88237BB-200

Abstract: GS88237B GS88237BB GS88237BB-166 GS88237BB-225 GS88237BB-250 GS88237BB-250I
Contextual Info: Preliminary GS88237BB-333/300/275/250/225/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive

Contextual Info: Preliminary GS88218/36AB/D-250/225/200/166/150/133 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs 119- and 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable