21X21 Search Results

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: HI-TEMP FAN HEAT SINK – FHE Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6

net eN8

Abstract: TDN01 crpa 8B10B P802 TLK3118 XGXS quad video processor
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

Contextual Info: Product: XRT83VSH316IB-F Package: 316L L‐fpBGA 21x21 Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight (g) Element/Compound CAS No. 1 Die 0.0360 Silicon 7440‐21‐3 0.0360

K297

Abstract: net eN8 TDN01
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)

8B10B

Abstract: P802 TLK3118 RXD17
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

5060A

Abstract: Shenzhen ditelong industrial Co., Ltd 1800X1
Contextual Info: NO.：QB/SPS 73 PS 5060A SPECIFICATIONS NAME: 21X21 FULL COLOR LED CLUSTER TYPE: LCS21121Q4A-121 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China

prbs parity checker and generator

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

PRBG0268FB-A

Contextual Info: JEITA Package Code P-BGA268-21x21-1.00 RENESAS Code PRBG0268FB-A D MASS[Typ.] 1.3g A b A D1 ZD A1 S AB e y S Index mark S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 268F7X-C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

PRBG0272FA-A

Abstract: BGA272 PBGA272 P-BGA272-21x21-1 P-BGA-272
Contextual Info: JEITA Package Code P-BGA272-21x21-1.00 RENESAS Code PRBG0272FA-A Previous Code BP-272/BP-272V MASS[Typ.] 1.3g D w S B E w S A 4x v y1 S y A1 A S S e ZD A e Y W V U T R Reference Symbol P B N Dimension in Millimeters Min Nom Max D 21.0 K E 21.0 J v 0.20 w

Contextual Info: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1

5032A

Abstract: LCS-21036Q3A-033
Contextual Info: NO.：QB/SPS 73 PS 5032A SPECIFICATIONS NAME: 21X21 DUAL COLOR LED CLUSTER TYPE: LCS21036Q3A-033 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China

5023a

Abstract: LCS-21008
Contextual Info: NO.：QB/SPS 73 PS 5023A SPECIFICATIONS NAME: 21X21 SINGLE COLOR LED CLUSTER TYPE: LCS21008 Y Q2A-004 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China

TDN01

Abstract: TDP01/TDN01 net eN8 acq2 RDN01 130nm CMOS
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1

j 6810

Abstract: J 6810 D PGA zif socket 289 ASTM B545 amp pga socket
Contextual Info: ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid FEATURES • A strong, metal cam activates the normally closed contacts, preventing dependency on plastic for contact force • The handle can be provided on right or left hand side

PRBG0449GA-A

Abstract: BP-449V
Contextual Info: JEITA Package Code P-FBGA449-21x21-0.80 RENESAS Code PRBG0449GA-A Previous Code BP-449V MASS[Typ.] 1.4g D w S B E w S A 4x v y1 S y A1 A S S e ZD A e AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Reference Symbol B Dimension in Millimeters Min Nom

BGA 15X15

Contextual Info: Daisy Chain Package Design 15mm, 321 MAP BGA, 0.65mm Pitch 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 A B C D E F G H * 0.65 mm Pitch * 21x21 Array * 9 Thermal Balls * 15x15 mm Body Size * 0.3 mm Solder Ball Diameter J K L M N P R T U V W Y AA Slide 1

PGA zif socket 289

Contextual Info: ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid FEATURES • A strong, metal cam activates the normally closed contacts, preventing dependency on plastic for contact force • The handle can be provided on right or left hand side

Contextual Info: FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6

Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

TDP01/TDN01

Abstract: TDN21 XAUI 8B10B P802 TLK3118 c20d10
Contextual Info: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)

Contextual Info: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm

PRBG0268FA-A

Contextual Info: JEITA Package Code P-BGA268-21x21-1.00 RENESAS Code PRBG0268FA-A D A D1 MASS[Typ.] 1.6g b A ZD A1 S AB e y S Index mark S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 268F7X-B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference