214025 Search Results

taiyo PSR4000

Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

Contextual Info: 2010-12-15 OSRAM OSTAR Observation 850nm Version 1.0 SFH 4740 Features: Besondere Merkmale: • • • • • • White frame to achieve high optical power 4.3 W optical power at IF=1A Active chip area 2.1 x 5.4 mm2 Max. DC-current 1 A Low thermal resistance (2.8 K / W)

Contextual Info: Ostar Observation 850nm Lead (Pb) Free Product - RoHS Compliant SFH 4730, SFH 4740 SFH 4740 SFH 4740 SFH 4730 Vorläufige Daten / Preliminary Data SFH 4730 SFH 4730 • Schwarzer Rahmen zur Streulichtminimierung • 3.6 W optische Leistung bei IF=1A • Black frame to minimize scattered light

erni 214025

Abstract: erni 224394 erni 234458 erni minibridge 1.27 ERNI 214038 SFX6 ERNI 224396 erni 234459 erni 224399 224399
Contextual Info: Connector #2 Note: wire #1 is always in front of all views 8 PIN SPX A 6 PIN APU 3 12,7 SF X SF X wire count Pin pitch 1,27 SPX Wire Counting & Ribbon Cable Specification 15,24 Connector #1 Connector typical dimension 1 Attachment, Connector Coding & Locking Specification

fBGA package tray 12 x 19

Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

214-097X

Abstract: AWM VW-1 21411 214-3780 214-3782 214-3784 214-3786 AWM 1015 vw-1
Contextual Info: Belden Hook-Up Wire and Kits PVC Insulated Hook-Up Wire High Temperature Teflon Insulated Hook-Up Wire All hook-up wire has either tinned copper conductor insulated with extruded PVC or stranded silver-coated conductor insulated with extruded TFE Teflon ¨. PVC is flame and ozone resistant, as

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

SFH 4740

Abstract: JESD22-A114-E NTC Thermistor smd 10k erni 214025
Contextual Info: OSRAM OSTAR Observation 850nm Lead (Pb) Free Product - RoHS Compliant SFH 4730, SFH 4740 SFH 4740 SFH 4740 SFH 4730 SFH 4730 SFH 4730 • Schwarzer Rahmen zur Streulichtminimierung • 3.6 W optische Leistung bei IF=1A • Black frame to minimize scattered light

erni rel 14

Abstract: erni 214025 214025-4 214025 ERNI REL 20 OHL01714 thermistor tp
Contextual Info: Ostar Observation Lead Pb Free Product - RoHS Compliant SFH 4730, SFH 4740 SFH 4740 SFH 4740 SFH 4730 SFH 4730 SFH 4730 • Schwarzer Rahmen zur Streulichtminimierung • 3 W optische Leistung • Black frame to minimize scattered light • 3 W optical power

erni rel 20

Abstract: erni rel 19 ERNI rel 30 erni rel 35 SMD 214012 erni 214025 OHF04132 JESD22-A114E JESD22-A114-E NTC Thermistor smd 10k 0603
Contextual Info: OSRAM OSTAR Observation 850nm Lead (Pb) Free Product - RoHS Compliant SFH 4761 SFH 4761 SFH 4761 • Weißer Rahmen für hohe Lichtleistung • 4.3 W optische Leistung bei IF=1A • White frame to achieve high optical power • 4.3 W optical power at IF=1A

ERNI rel 14

Abstract: erni rel 19
Contextual Info: Ostar Observation Lead Pb Free Product - RoHS Compliant SFH 4730, SFH 4740 SFH 4740 SFH 4740 SFH 4730 Vorläufige Daten / Preliminary Data SFH 4730 SFH 4730 • Schwarzer Rahmen zur Streulichtminimierung • 3 W optische Leistung • Black frame to minimize scattered light

erni 214025

Abstract: erni 224394 ERNI 234466 ERNI 224396 ERNI 214038 erni minibridge 1.27 214025 20 pin flat cable connector erni 234458 224399
Contextual Info: Connector typical dimension Attachment, Connector Coding & Locking Specification Note: wire #1 is always in front of all views Connector #2 1 Connector #1 Wire Counting & Ribbon Cable Specification SPX SF X 1 1 Pin pitch 1,27 SPX wire count SFX A A APU 2 3

osram sfh

Contextual Info: 2010-12-15 OSRAM OSTAR Observation 850nm Version 1.0 SFH 4761 Features: Besondere Merkmale: • • • • • • White frame to achieve high optical power 4.3 W optical power at IF=1A Active chip area 2.1 x 5.4 mm2 Max. DC-current 1 A Low thermal resistance (2.8 K / W)