20P 2.54 Search Results

ZIP-20P-M01

Abstract: ZIP020-P-0325-1
Contextual Info: ZIG-ZAG IN-LINE PACKAGE 20 PIN PLASTIC ZIP-20P-M01 EIAJ code : ∗ZIP020-P-0325-1 20-pin plastic ZIP Lead pitch 50mil Row spacing 100mil Sealing method Plastic mold ZIP-20P-M01 20-pin plastic ZIP (ZIP-20P-M01) +0.20 +.008 25.88 –0.30 1.019 –.012 2.85±0.20

on 20p

Abstract: ZIP020-P-0400-1
Contextual Info: ZIG-ZAG IN-LINE PACKAGE 20 PIN PLASTIC ZIP-20P-M02 EIAJ code : ∗ZIP020-P-0400-1 20-pin plastic ZIP Lead pitch 50mil Row spacing 100mil Sealing method Plastic mold ZIP-20P-M02 20-pin plastic ZIP (ZIP-20P-M02) +0.20 +.008 25.88 –0.30 1.019 –.012 2.85±0.20

D20011

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC DIP-20P-M03 EIAJ code :∗DIP020-P-0300-3 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M03 20-pin plastic DIP (DIP-20P-M03) +0.20 24.59 –0.30

DIP-20P-M02

Contextual Info: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M02 EIAJ code : ∗DIP020-P-0300-2 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M02 20-pin plastic DIP (DIP-20P-M02) +0.20 24.64 –0.30 .970 +.008 –.012 INDEX-1

Contextual Info: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M03 EIAJ code : ∗DIP020-P-0300-3 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M03 20-pin plastic DIP (DIP-20P-M03) +0.20 24.59 –0.30 .968 +.008 –.012 INDEX-1

DIP-20P-M02

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC DIP-20P-M02 EIAJ code :∗DIP020-P-0300-2 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M02 20-pin plastic DIP (DIP-20P-M02) +0.20 24.64 –0.30

DIP-20P-M01

Contextual Info: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M01 EIAJ code : ∗DIP020-P-0300-1 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M01 20-pin plastic DIP (DIP-20P-M01) +0.20 24.64 –0.30 +.008 .970 –.012 INDEX-1

AQZ102

Abstract: AQZ104 AQZ105 AQZ107 AQZ202 AQZ204 AQZ205 AQZ207
Contextual Info: Power 1 Form A AQZ10P, 20P VDE Slim type with high capacity up to 4A DC load type also available Power 1 Form A (AQZ10P, 20P) AQZ10P, 20P 3.5 .138 21 .827 12.5 .492 mm inch Height includes standoff 1 – 2 3 + 4 – + DC type 1 – 2 3 + 4 AC/DC type FEATURES

DIP-20P-M02

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M02 EIAJ code :∗DIP020-P-0300-2 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M02 20-pin plastic DIP

ZIP020-P-0325-1

Contextual Info: ZIG-ZAG IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index ZIP-20P-M01 EIAJ code :∗ZIP020-P-0325-1 20-pin plastic ZIP Lead pitch 50 mil Row spacing 100 mil Sealing method Plastic mold ZIP-20P-M01 20-pin plastic ZIP

ZIP020-P-0400-1

Contextual Info: ZIG-ZAG IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index ZIP-20P-M02 EIAJ code :∗ZIP020-P-0400-1 20-pin plastic ZIP Lead pitch 50 mil Row spacing 100 mil Sealing method Plastic mold ZIP-20P-M02 20-pin plastic ZIP

968 led

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M03 EIAJ code :∗DIP020-P-0300-3 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M03 20-pin plastic DIP

AQZ102

Abstract: il 100 diode AQZ104 AQZ202 AQZ105 AQZ107 AQZ204 AQZ205 AQZ207
Contextual Info: Power PhotoMOS AQZ10P, 20P High capacity PhotoMOS Relay. (Load current Max. 4A) DC load type is available. 3.5 .138 21 .827 12.5 .492 mm inch 1 2 - 3 + 4 AC/DC type 1 - 2 3 + - 4 + Power PhotoMOS (AQZ10P, 20P) FEATURES TYPICAL APPLICATIONS 1. High capacity PhotoMOS Relay in a

fujitsu

Abstract: 20p 2.54 DIP-20P-M01
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M01 EIAJ code :∗DIP020-P-0300-1 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M01 20-pin plastic DIP

D-42C

Abstract: D37C 47C100
Contextual Info: DIP Type Common Mode signal lines DIP Noise Filters D-37C, 40C, 42C, 45C, 47C Model Number of terminals/ Circuits Rated voltage DC V Rated current DC (mA/Line) DC resistance (m⏲/Line) max. Operating temperature range (˚C) 1 core 20P/10 circuits Common mode

THERMISTOR NTH4G 10K 1 MURATA

Abstract: NTC 4.7K termistor termistor ntc 10K 103 cd 6283 cs md 5406 cd 6283 ic TERMISTOR termistor NTC 104 termistor NTC 103 termistor ntc 16p
Contextual Info: This is the PDF file of catalog No.R44E-3. No.R44E3.pdf 99.12.22 NTC Thermistor NTC THERMISTOR !For Temperature compensation ¡0402/0603/0805 size, Ni barriered SMD NTH5G10P/16P/20P series !For Temperature Sensor ¡Small Hight Precision NTH4G series !For surge Current Suppression

GG1Q

Contextual Info: cP - DS04-13504-6E FUJITSU DATA SHEET LINEAR 1C R-2R TYPE 8-BIT D/A CONVERTER MB88341/MB88342 DESCRIPTION MB88341-P MB88342-P PLASTIC DIP DIP-20P-M02 PLASTIC DIP (DIP-16P-M04) The Fujitsu MB88341 and MB88342 are R-2R type 8-bit resolution digital-to-analog

Contextual Info: SEEEDUINO FILM V1.0 Seeeduino FILM is an Arduino compatible development platform for space-sensitive projects. It’s flexible, super slim, with built-in Li-Po charger, suitable to build wearable applications. FILM and other extension FRAMEs could be simply connected via the 20p universal bus like a chain, native 2.54mm pitch pins also

B471J

Abstract: cd 6283 ic md 5406 cd 6283 cs SK 5207 thermistor tp 8613 cd 6283 audio CI 7408 ic 8279 s 8764 lcd
Contextual Info: This is the PDF file of catalog No.R44E-3. No.R44E3.pdf 99.12.22 I m uRnia NTC THERMISTOR mA Chip NTC Thermistor NTH5G 10P/16P/2 0 P Series Chip NTC Thermistor NTH5G10P/16P/20P Series for Temperature Compensation and Sensing, Suitable for high density mounting in the general circuits.

MB88341-P

Abstract: MB88401 MB88342 r2r resistor ladder MB88342-PF DIP-20P-M02 MB88341 MB88342-P
Contextual Info: cP DS04-13504-6E - FUJITSU DATA SHEET LINEAR 1C R-2R TYPE 8-BIT D/A CONVERTER MB88341/MB88342 DESCRIPTION M B88341-P M B88342-P PLASTIC DIP D IP -20P -M 02 PLASTIC DIP (D IP -16P -M 04) The Fujitsu MB88341 and MB88342 are R-2R type 8-b it resolution digital-to-analog

20P06

Abstract: MTP20P06 ROS 480 AN569 MTM20P06 diode RJ
Contextual Info: Order this data sheet by MTM20P06/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA M TM 20P 06 M TP20P06 Designer's Data Sheet Pow er Field Effect Transistor P-Channel Enhancem ent-Mode Silico n Gate T M O S TMOS POWER FETs 20 AMPERES rDS on = 0.2 OHM 60 VOLTS These TM O S Power FETs are designed for high speed power

Contextual Info: Rev APPROVED: Description AWO# DATE:_ Date 2/21/11 RELEASED • Appr TITLE: .047 [1 .2 0 ] - ■1 0 ° [2 . 5 4 ]“ "1 .228 [5 .8 0 ] i - _ r ~ o oho or — 0.039 [1 .0 0 ] RECOMMENDED PCB LAYOUT 5~20P -1 0 2 i— “ Ì I [2 .6 0 ] .453 [1 1 .5 0 ] I

20P06

Abstract: YLE relay relay yle TP20P06 mtp20p MC14001 motorola 20p
Contextual Info: 6367254 MOTOROLA 96D X S T R S /R F SC Tb MOTOROLA D E p b 3h 7E S 4 r- 29~ ^ j 80096 ÜGßGCHb Order this data sheet by MTM20P06/D (□ SEMICONDUCTOR TECHNICAL DATA M T M 20P 06 M TP20P06 Designer's Data Sheet P o w e r Field E ffe ct T ra n sisto r P-Channel Enhancem ent-M ode

Contextual Info: This is the PDF file of catalog NO.R44E-3. No.R44E3.pdf 99.12.22 N T C T H fflM IS T O R 1 m iR n la C h ip N T C T h e rm is to r N T H 5 G 1 0 P / 1 6 P /2 0 P S e rie s Chip NTC Thermistor NTH5G1OP/16P/20P Series for Temperature Compensation and Sensing, Suitable for high density mounting in the general circuits.