209PIN Search Results

PGA209-C-S17U-2

Contextual Info: 209S8 Metal seal 209pin PGA EIAJ Package Code PGA209-C-S17U-2.54 JEDEC Code – 44.45±0.4 Weight g 24.75 4.55MAX 3.8±0.5 40.64±0.3 2.54TYP U T 40.64±0.3 R P N M L K J H G F E D C B A φ1.0TYP 44.45±0.4 φ0.46±0.05 2.54TYP 17 16 15 14 13 12 11 10 9 8

t10-25 u2

Abstract: G2156 f10107
Contextual Info: Preliminary GS816273AC-300/275/250/225/200 300 MHz–200 MHz 256K x 72 1.8 V or 2.5 V VDD 18Mb S/DCD Sync Burst SRAMs 1.8 V or 2.5 V I/O 209-Pin BGA Commercial Temp Industrial Temp Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

8180S18

Abstract: 8180S36 GS8180S36B-300 GS8180S36B-333 512Kx
Contextual Info: Preliminary GS8180S18/36B-333/300/250 18Mb Σ2x1B2 SDR Separate I/O SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 - 333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • SigmaRAM JEDEC standard pinout and package • Dual Single Data Rate interface

CXK79M36C163GB

Abstract: CXK79M36C163GB-33 CXK79M36C163GB-4 CXK79M36C163GB-5
Contextual Info: SONY ΣRAM CXK79M36C163GB 18Mb 1x2Lp LVCMOS High Speed Synchronous SRAMs 512Kb x 36 33/4/5 Preliminary Description The CXK79M36C163GB is a high speed CMOS synchronous static RAM with common I/O pins. It is manufactured in compliance with the JEDEC-standard 209 pin BGA package pinout defined for SigmaRAM™ devices. It integrates input registers,

CXK79M36C160GB

Abstract: CXK79M36C160GB-33 CXK79M36C160GB-4 CXK79M36C160GB-5 CXK79M72C160GB CXK79M72C160GB-33 CXK79M72C160GB-4 CXK79M72C160GB-5
Contextual Info: SONY ΣRAM CXK79M72C160GB / CXK79M36C160GB 18Mb 1x1Lp HSTL High Speed Synchronous SRAMs 256Kb x 72 or 512Kb x 36 33/4/5 Preliminary Description The CXK79M72C160GB (organized as 262,144 words by 72 bits) and the CXK79M36C160GB (organized as 524,288 words

PCI1131

Abstract: PCI1210 PCI1221 PCI CardBus Controllers PCI4450 BGA and QFP Package PCI1420 ghk diode TI PCI PCI1220
Contextual Info: The world leader in CardBus and 1394 solutions PCIBus Solutions Family Overview PCIBus Solutions TI PCIBus mission To add value to our customers’ products by ensuring the highest level of quality, reliability, cost effectiveness, product services, and fastest time to market

Contextual Info: IS61LSSDH51236 IS61LSSDH102418 ISSI ΣQUAD 18Mb Σ2x2B2 ADVANCE INFORMATION DECEMBER 2002 DDR SEPERATE I/O SRAM FEATURES • Simultaneous Read and Write SigmaQuad Interface • SigmaRAM™ JEDEC standard pinout/package • Dual Double Data Rate interface

GS8644V18

Abstract: GS8644V18B GS8644V18B-250 GS8644V72
Contextual Info: Product Preview GS8644V18 B/E /GS8644V36(B/E)/GS8644V72(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features 250 MHz–133MHz 1.8 V VDD 1.8 V I/O Data Output Register. Holding FT high places the RAM in

GS8644Z

Abstract: GS8644ZV18 GS8644ZV18B GS8644ZV72
Contextual Info: Product Preview GS8644ZV18 B/E /GS8644ZV36(B/E)/GS8644ZV72(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 72Mb Pipelined and Flow Through Synchronous NBT SRAM Features 250 MHz–133MHz 1.8 V VDD 1.8 V I/O Because it is a synchronous device, address, data inputs, and

GS8162V18AB-350

Contextual Info: Preliminary GS8162V18A B/D /GS8162V36A(B/D)/GS8162V72A(C) 119-, 165- & 209-Pin BGA Commercial Temp Industrial Temp 350 MHz–150 MHz 1.8 V VDD 1.8 V I/O 1M x 18, 512K x 36, 256K x 72 18Mb S/DCD Sync Burst SRAMs Features via the FT mode . Holding the FT mode pin low places the RAM in

GW 9n

Abstract: 221-PIN
Contextual Info: ADVANCE ‡ 16Mb: 256K x 72 FLOW-THROUGH ZBT SRAM 16Mb ZBT SRAM MT55L256Y72F, MT55V256V72F, 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD 2.5V I/O FEATURES • • • • • • • • • • • • • • • • 221-PIN FBGA High frequency and 100 percent bus utilization

Contextual Info: GS832218/36/72 B/E/C -xxxV 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the

Contextual Info: Product Preview GS832218 B/E /GS832236(B/E)/GS832272(C) 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation

Contextual Info: Product Preview GS864418 B/E /GS864436(B/E)/GS864472(C) 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation

Contextual Info: ISSI IS61LSSD102418 ΣQUAD 18Mb Σ2x2B4 ADVANCE INFORMATION JUNE 2002 DDR SEPARATE I/O SRAM FEATURES • Simulatneous Read and Write SigmaQuad Interface • JEDEC standard pinout and package • Dual Double Data Rate interface • Echo Clock outputs track data output drivers

HAMR5603

Abstract: M9-CSP64 UTC1117 KX15-50KLD SEAGATE ST340810A PMOSSOT23 ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL 180w subwoofer circuit diagram R101A w31 smd
Contextual Info: SERVICE MANUAL FOR E - 8188 BY: Rain Li TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Apr . 2003 LCD PC E-8188 MAINTENANCE Contents 1. Hardware Engineering Specification - 3

GL3220

Abstract: Compal Electronics Ali 3601 compal k5w12 LA-1421 fdv301
Contextual Info: A B C D E 1 2 1 LA-1421 Schematics Document uFCBGA/uFCPGA for Celeron/ Coppermine-T and Tualatin CPU Ver1.0 2 Almador-M 830-MG + ICH3 + VCH 3 3 4 4 Title Compal Electronics, inc. SCHEMATIC, M/B LA-1421 THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

OZ-165

Abstract: 47uF-0603 PU1A-12 Compal Electronics MP3R LA-1331 compal ATL02
Contextual Info: A B C D E 1 1 ACL10 LA-1331 Schematics Document 2 2 REV 2.0 For 030 INTEL Mobile P4 uFCBGA/uFCPGA Northwood MCH-M(845-MP) + ICH3-M + SQ17 3 3 4 4 Title COMPAL ELECTRONICS, INC SCHEMATIC, M/B LA-1331 THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION . THIS SHEET MAY NOT BE

BTK20

Abstract: la1521 foxconn LA-1521 h1 m6c Compal Electronics VMD20 VMD29 foxcoon ALI C
Contextual Info: A B C D E 1 1 SHANGHAI 100 BTK20 LA-1521 Schematics Document 2 2 REV 1.0A PVT2 INTEL Mobile P4 uFCBGA/uFCPGA Northwood Celeron MCH-M 845MZ + ICH3-M + M6-C(16MB VRAM) 3 3 4 4 Title Compal Electronics, inc. THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

Foxconn L S-36

Abstract: foxconn LA1541 compal 6 pin smd power control ic 18v LA-1541 smd diode sot23 a4 Socket AM2 ce pe SMD switch Compal Electronics
Contextual Info: A B C D E 1 1 2 2 BTS88 LA-1541 REV0.3 Schematics Document Intel Pentium 4 Processor in the 478-pin Package with 845PE / ICH4 / NVIDIA SQ17 chipset 2002-10-26-A For B2-Test 3 3 4 4 Title Compal Electronics, Ltd. BTS88 Cover Sheet Size B Date: A B C D Document Number

Contextual Info: Product Preview GS8324Z18A B/C /GS8324Z36A(B/C)/GS8324Z72A(C) 119- and 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb Sync NBT SRAMs Features • NBT (No Bus Turn Around) functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

GS8322V18B-225

Abstract: GS8322V18B-250 GS8322V72 GS8322V18 GS8322V18B-200
Contextual Info: Preliminary GS8322V18 B/E /GS8322V36(B/E)/GS8322V72(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs Features 250 MHz–133 MHz 1.8 V VDD 1.8 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the

GS864418

Abstract: GS864418B GS864418B-250 GS864472
Contextual Info: Product Preview GS864418 B/E /GS864436(B/E)/GS864472(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs Features 250 MHz–133MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Flow Through/Pipeline Reads

GS8642V18

Contextual Info: Product Preview GS8642V18 B/E /GS8642V36(B/E)/GS8642V72(C) 4M x 18, 2M x 36, 1M x 72 36Mb S/DCD Sync Burst SRAMs 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features 300 MHz–167 MHz 1.8 V VDD 1.8 V I/O Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the