2010 FOOTPRINT DIMENSION Search Results

specification of 330 ohm resistor

Contextual Info: Metal Metal Glaze Glaze™Power PowerPack PackSurface SurfaceMount Mount High Power Power Density Density Ceramic Ceramic Package Package Welwyn Components PPS-1 Series PPS-1 Series 1 watt performance, standard 2010 footprint • 1Flat watt performance, standard 2010 footprint

Contextual Info: Wave soldering footprint Footprint information for wave soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 6.30 4.90 2.70 1.90 2.90 1.70 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of SO20 package SOT163-1 13.40 0.60 20x 1.50 8.00 11.00 11.40 1.27 (18×) solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. placement accuracy ± 0.25

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 5 leads SOT353 4.9 2.25 1.5 1 0.85 2.5 4.5 0.85 1 1.5 1.3 1.3 1.225 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XSON6 package SOT891 1.05 0.5 6x 1.4 0.6 (6×) 0.7 0.15 (6×) 0.25 (6×) 0.35 solder land plus solder paste solder resist occupied area www.nxp.com Dimensions in mm 2010 NXP B.V.

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT416 2.2 1.7 1 0.85 2 0.5 3x 0.6 (3×) 1.3 solder land plus solder paste solder resist occupied area www.nxp.com Dimensions in mm 2010 NXP B.V.

Contextual Info: Wave soldering footprint Footprint information for wave soldering of TSOP6 package SOT457 5.3 1.5 4x 1.475 0.45 (2×) 5.05 1.475 1.45 (6×) 2.85 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. preferred transport direction during soldering

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LGA274 package SOP022-1 Hx A1 index area P P 0.8 1 0.7(2) 28.8 Hy The stencil thickness is 0.15 mm occupied area Dimensions in mm P Hx Hy 1.6 33.0 33.0 www.nxp.com 2010 NXP B.V. sop022-1_fr

DFN4020-14

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN4020-14 package SOT1334-1 D1 14x C (12x) Ay solder land occupied area DIMENSIONS in mm P1 P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 9x C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21

resistor metal GLAZE 120 ohm 2 1W IRC

Abstract: IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736
Contextual Info:  HIGH POWER DENSITY METAL GLAZE SURFACE MOUNT POWER RESISTOR ISO-9001 Registered MRC SERIES Metal GlazeTM thick film element fired at 1000°C to solid ceramic substrate 1/2 watt in 1/8 watt package 1206 footprint 1 watt in 1/2 watt package (2010 footprint)

Contextual Info: METAL GLAZE HIGH POWER DENSITY SURFACE MOUNT POWER RESISTOR MRC ISO-9001 ^Registered, SERIES • • • • 1/2 watt in 1/8 watt package 1206 footprint 1 watt in 1/2 watt package (2010 footprint) MRC1/2: 0.1 ohm to 10,000 ohm MRC1: 0.05 ohm to 1.0 ohm

XTL1024

Abstract: XTL-1024
Contextual Info: SM1612-4 4-Terminal Ceramic Surface-Mount Case 1.6 X 1.2 mm Nominal Footprint Electrical Connections Connection Terminals Input / Output 1 Metal Cover 2 Input / Output 3 No Connection 4 Dimensions in mm www.RFM.com E-mail: info@rfm.com 2009-2010 by RF Monolithics, Inc.

Solder Paste, Indium 5.8

Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Contextual Info: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land

Contextual Info: CSD25301W1015 www.ti.com SLPS210B – AUGUST 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET Check for Samples: CSD25301W1015 FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Small Footprint Low Profile 0.62mm Height

CSD25301W1015

Abstract: G003
Contextual Info: CSD25301W1015 www.ti.com SLPS210B – AUGUST 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET Check for Samples: CSD25301W1015 FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Small Footprint Low Profile 0.62mm Height

Contextual Info: METAL GLAZE POWER PACK SURFACE MOUNT HIGH POWER DENSITY CERAMIC PACKAGE PPS-1 ISO -9001 ^Registered, SERIES 1 Watt performance - standard 2010 footprint Flat ceramic package 0.1Q to 348KQ range Low inductance Superior surge handling capability 150°C maximum operating temperature

Contextual Info: CSD25301W1015 www.ti.com SLPS210B – AUGUST 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET Check for Samples: CSD25301W1015 FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Small Footprint Low Profile 0.62mm Height

Contextual Info: rev. page 1 of 11 date 09/2010 DESCRIPTION: point of load converter PART NUMBER: VPOL5A-5-SMT features * high efficiency topology, typically 94% at 3.3 Vdc * industry standard footprint * wide ambient temperature range, -40C to +85C * cost efficient open frame design

Contextual Info: CSD25201W15 SLPS269A – JUNE 2010 – REVISED JULY 2011 www.ti.com P-Channel NexFET Power MOSFET Check for Samples: CSD25201W15 PRODUCT SUMMARY FEATURES 1 • • • • • • • Low Resistance Small Footprint 1.5-mm x 1.5-mm Gate ESD Protection –3kV

Contextual Info: CSD75205W1015 www.ti.com SLPS222B – OCTOBER 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET FEATURES 1 • • • • • • • • PRODUCT SUMMARY Dual P-Ch MOSFETs Common Source Configuration Small Footprint 1mm x 1.5mm Gate-Source Voltage Clamp

Contextual Info: CSD75205W1015 www.ti.com SLPS222A – OCTOBER 2009 – REVISED OCTOBER 2010 P-Channel NexFET Power MOSFET FEATURES 1 • • • • • • • • PRODUCT SUMMARY Dual P-Ch MOSFETs Common Source Configuration Small Footprint 1mm x 1.5mm Gate-Source Voltage Clamp

CSD23201W10

Contextual Info: CSD23201W10 www.ti.com SLPS209A – AUGUST 2009 – REVISED MAY 2010 P-Channel NexFET Power MOSFET Check for Samples: CSD23201W10 FEATURES 1 • • • • • • • PRODUCT SUMMARY Ultra Low Qg and Qgd Small Footprint 1mm x 1mm Low Profile 0.62mm Height

C1A3B3

Abstract: CSD25201W15
Contextual Info: CSD25201W15 SLPS269A – JUNE 2010 – REVISED JULY 2011 www.ti.com P-Channel NexFET Power MOSFET Check for Samples: CSD25201W15 PRODUCT SUMMARY FEATURES 1 • • • • • • • Low Resistance Small Footprint 1.5-mm x 1.5-mm Gate ESD Protection –3kV