2-CQFP PACKAGE Search Results

RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Contextual Info: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.B 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH E-PAD Rev 2, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 49 64 0.025 (0.635) BSC 1 PIN 1 INDEX AREA

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: WHITE /MICROELECTRONICS WC32P020-XXM 68020 FEATURES • Selection of Processor Speeds: 16.67, 20, 25 MHz ■ M ilita ry Temperature Range: -55 °C to + 1 2 5 °C ■ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Ratpack, CQFP (Q2) ■ High-Performance Asynchronous Bus Is Nonmultiplexed and

Contextual Info: AS8F512K32 512K x 32 FLASH AUSTIN SEMICONDUCTOR, INC. FLASH MODULE AVAILABLE AS MILITARY SPECIFICATIONS PIN A SSIG N M EN T Top View 68 Lead CQFP •SMD 5962-94612 •MIL-STD-883 uo^cuco^-Ln|Coz|^|yvDh'CO C^2‘-) Z<E<C<C<C<CC|UU|o|><E<C<C<E<C> FEATURES

PEAK tray drawing

Abstract: J300
Contextual Info: RECYCLE CQFP 75X75^ WITH S E M I C Y C L E 30V4.10 j j- 3 .0 0 HHÇYXÇZ. dJOO 330A0IH3S HUM 330A03M SECTI ON 0-0 r-u3 r'~- cY N OY E S : 1. MAYERIA L 2. CHAMFER PACKAGE ALL PP1. DIMENSIONS - O R IE N T A T IO N 4. D "EMPERATURE RATING O P AR T NUMRER- ESD

Contextual Info: SRAM & FLASH Mixed Module Austin Semiconductor, Inc. 128K x 16 SRAM & 512K x 16 FLASH AS8SF384K32 PIN ASSIGNMENT Top View SRAM / FLASH MEMORY ARRAY 68 Lead CQFP (QT) NC A0 A1 A2 A3 A4 A5 FCS\1 GND FCS\2 SWE\1 A6 A7 A8 A9 A10 VCC FEATURES • Operation with single 5V supply

Flash

Abstract: AS8F128K32
Contextual Info: FLASH AS8F128K32 128K x 32 FLASH PIN ASSIGNMENT Top View AVAILABLE AS MILITARY SPECIFICATIONS 68 Lead CQFP (Q & Q1) • • NC A0 A1 A2 A3 A4 A5 CS3\ GND CS4\ WE1\ A6 A7 A8 A9 A10 Vcc FLASH MEMORY ARRAY SMD 5962-94716 MIL-STD-883 I/O 0 I/O 1 I/O 2 I/O 3

Contextual Info: SRAM AS8S512K32 A ustin S em iconductor, Inc._ 512K x 32 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY AVAILABLE AS MILITARY SPECIFICATIONS • • 68 Lead CQFP (Q) SMD 5962-94611 MIL-STD-883 j o —l m m ' T L n | i > o z : | ( > o | y M 3 r ' ' . c o c n 2 ' - )

Contextual Info: SRAM & FLASH Mixed Module AS8SF384K32 128K x 16 SRAM & 512K x 16 FLASH PIN ASSIGNMENT Top View SRAM / FLASH MEMORY ARRAY 68 Lead CQFP (QT) NC A0 A1 A2 A3 A4 A5 FCS\1 GND FCS\2 SWE\1 A6 A7 A8 A9 A10 VCC FEATURES • Operation with single 5V supply • High speed: 35ns SRAM, 90ns FLASH

as8sf384k32

Abstract: Mixed Module
Contextual Info: SRAM & FLASH Mixed Module AS8SF384K32 128K x 16 SRAM & 512K x 16 FLASH PIN ASSIGNMENT Top View SRAM / FLASH MEMORY ARRAY 68 Lead CQFP (QT) FEATURES NC A0 A1 A2 A3 A4 A5 FCS\1 GND FCS\2 SWE\1 A6 A7 A8 A9 A10 VCC • Operation with single 5V supply • High speed: 35ns SRAM, 90ns FLASH

Contextual Info: a WHITE /MICROELECTRONICS 512Kx48 SRAM MODULE WS512K48-XG4WX ADVANCED* FEATURES • A c c ess T im e s 17, 20, 25, 35ns ■ 2 V D ata R e te n tio n D evice ■ Packaging: ■ T T L C o m p a tib le In p uts and O u tp uts • 116 Lead, 4 0.0m m H e rm e tic CQFP Package 504

AS8SLC512K32

Abstract: Q1-98
Contextual Info: SRAM AS8SLC512K32 Austin Semiconductor, Inc. 512K x 32 SRAM PIN ASSIGNMENT Top View SRAM Memory Array MCM NC A0 A1 A2 A3 A4 A5 CE\3 GND CE\4 WE\1 A6 A7 A8 A9 A10 Vcc 68 Lead CQFP (Q & Q1) FEATURES OPTIONS • • • • I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5

Contextual Info: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 Built-in Decoupling Caps and M u ltip le Ground Pins fo r Low Noise Operation ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as

AS8SLC512K32

Contextual Info: SRAM AS8SLC512K32 Austin Semiconductor, Inc. 512K x 32 SRAM PIN ASSIGNMENT Top View SRAM Memory Array MCM 68 Lead CQFP (Q) FEATURES • • • • I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 GND I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15*, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP Package 400 .

Contextual Info: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

ACT-F2M32A

Abstract: CQFP 240 Aeroflex
Contextual Info: ACT–F2M32A High Speed 64 Megabit Sector Erase FLASH Multichip Module CIRCUIT TECHNOLOGY Features www.aeroflex.com/act1.htm • 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One ■ Ready/Busy output RY/BY – Hardware method for MCM Package ■ Overall Configuration is 2M x 32

Contextual Info: ACT-F2M32A High Speed 64 Mei ib it M i l l Sector Erase I I I FLASH Multichip Module Q ero flex CIRCUIT TECHNOLOGY www.aeroflex.com/act1 .htm Features • 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package ■ Overall Configuration is 2M x 32 ■ +5V Power Supply / +5V Programing Operation

WF128K32-XXX5

Abstract: 5962-9471604HAX
Contextual Info: White Electronic Designs WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400

DSP56001A

Abstract: PB10 PB12 1147 x motorola DIMENSIONS PQFP 132 FE 132-CQFP
Contextual Info: Pin-out and Package General Purpose I/O Pin Tables The DSP56001A signals which may be programmed as general purpose I/O are listed with their primary function in Table 18. Table 19 and Table 20 identify pins on each package in numeric order. Table 21 identifies each signal name in order while giving the pin number for each

Contextual Info: WF128K32-XXX5 128KX 32 5V FL ASH MODULE, SMD 5962-94716 FEATURES n Access Times of 50*, 60, 70, 90, 120, 150ns n 5 Volt Programming. 5V ± 10% Supply n Packaging: n Low Power CMOS, 1mA Standby Typical •66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400