2-CQFP PACKAGE Search Results

RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Contextual Info: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note

RTAX1000S

Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Contextual Info: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5

CERAMIC QUAD FLATPACK CQFP

Contextual Info: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997

QL16X24B1PF144C

Abstract: CF160 PF100 PF144 PL84 QL16X24B-1PF144C cg144
Contextual Info: Appendix E - QL16x24B Pinout Diagrams Appendix E: QL16x24B Pinout Diagrams QL16x24B Packages Summary Total # Pins 84 100 144 144 160 Package Type PLCC TQFP TQFP CPGA CQFP No Connect 2 2 18 VCC and GND 8 12 20 20 20 Clock 2 2 2 2 2 User Pins Input-Only Input/Output

QL24X32B-1PQ208C

Abstract: ql24x32b PF144 PQ208 QL24X32B-1PF144C
Contextual Info: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F

CF160

Abstract: PF100 PF144 PL84 QL16X24B-1PF144C
Contextual Info: Appendix E - QL16x24B Pinout Diagrams Appendix E: QL16x24B Pinout Diagrams QL16x24B Packages Summary Total # Pins 84 100 144 144 160 Package Type PLCC TQFP TQFP CPGA CQFP No Connect 2 2 18 VCC and GND 8 12 20 20 20 Clock 2 2 2 2 2 User Pins Input-Only Input/Output

QL24X32B-1PF144C

Abstract: OPTOCOUPLER 817c data sheet 77-I PF144 PQ208 QL24X32B-1PQ208C
Contextual Info: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.B 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH E-PAD Rev 2, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 49 64 0.025 (0.635) BSC 1 PIN 1 INDEX AREA

schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

FBGA-484

Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Contextual Info: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly

CQFP 240

Contextual Info: a 240-Lead CQFP Package Mount with Heat Slug Up and Unformed Leads QS-240 Dimensions shown in inches and (mm) 0.665 (16.88) 8 ؋ 0.650 (16.50) 0.635 (16.12) 2.953 (75.00) SQ 1.161 (29.50) BSC 61 120 121 60 61 120 60 121 SEAL RING 2؋ 2.594 (65.90) TOP VIEW

Contextual Info: ç M/HITE /MICROELECTRONICS a 1Mx32 3.3V FLASH MODULE WF1M32B-XXX3 PRELIMINARY* FEATURES • A cce ss Times of 1 0 0 ,1 2 0 ,150ns ■ Packaging ■ • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180 inch)

CQFP 240

Contextual Info: a 240-Lead CQFP Package Mount with Heat Slug Down and Unformed Leads QS-240A Dimensions shown in inches and (mm) 0.665 (16.88) 8 ؋ 0.650 (16.50) 0.635 (16.12) 2.953 (75.00) SQ 1.161 (29.50) BSC 120 60 60 SEAL RING 2؋ 2.594 (65.90) 120 61 61 121 121 LID

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

Contextual Info: WHITE /MICROELECTRONICS WC32P020-XXM 68020 FEATURES • Selection of Processor Speeds: 16.67, 20, 25 MHz ■ M ilita ry Temperature Range: -55 °C to + 1 2 5 °C ■ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Ratpack, CQFP (Q2) ■ High-Performance Asynchronous Bus Is Nonmultiplexed and

Contextual Info: AS8F512K32 512K x 32 FLASH AUSTIN SEMICONDUCTOR, INC. FLASH MODULE AVAILABLE AS MILITARY SPECIFICATIONS PIN A SSIG N M EN T Top View 68 Lead CQFP •SMD 5962-94612 •MIL-STD-883 uo^cuco^-Ln|Coz|^|yvDh'CO C^2‘-) Z<E<C<C<C<CC|UU|o|><E<C<C<E<C> FEATURES

Contextual Info: a WS1M32-XG3X M/HITE /MICROELECTRONICS 1Mx32 SRAM MODULE p r e lim in a r y * FEATURES • A cce ss Tim es o f 17, 20, 25ns ■ 84 lead, 2 8m m CQFP, Package 511 ■ Organized as t w o banks o f 5 1 2Kx32, User C o n fig u ra b le as 2 M x 1 6 or 4 M x 8

BU-64863

Abstract: BU-64843B8 bu64863 BU-64860 bu64863g8
Contextual Info: Make sure the next Card you purchase has. BU-64743/64843/64863 Mini-ACE Mark3/Micro-ACE-TE FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • Worlds First all 3.3 Volt Terminal • Transceiver Power-down Options • World’s Smallest CQFP MIL-STD-1553

Micro-ACE-TE

Abstract: BU-64860B3
Contextual Info: Make sure the next Card you purchase has. BU-6474X/6484X/6486X Mini-ACE Mark3/Micro-ACE-TE FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-down Options • World’s Smallest CQFP MIL-STD-1553

dss-1005 bu6484

Abstract: dss-1003 bu64863
Contextual Info: Make sure the next Card you purchase has. BU-6474X/6484X/6486X Mini-ACE Mark3/Micro-ACE®*-TE ® FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-Down Options • World’s Smallest CQFP MIL-STD-1553

BU-64863B

Abstract: bu64863 BU-64840B3-E02 DSS-3330 mark s07 BU-61860 BU-64863E8
Contextual Info: Make sure the next Card you purchase has. BU-6474X/6484X/6486X MINI-ACE MARK3/MICRO-ACE®*-TE ® FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-Down Options • World’s Smallest CQFP MIL-STD-1553

PEAK tray drawing

Abstract: J300
Contextual Info: RECYCLE CQFP 75X75^ WITH S E M I C Y C L E 30V4.10 j j- 3 .0 0 HHÇYXÇZ. dJOO 330A0IH3S HUM 330A03M SECTI ON 0-0 r-u3 r'~- cY N OY E S : 1. MAYERIA L 2. CHAMFER PACKAGE ALL PP1. DIMENSIONS - O R IE N T A T IO N 4. D "EMPERATURE RATING O P AR T NUMRER- ESD

Contextual Info: SRAM & FLASH Mixed Module Austin Semiconductor, Inc. 128K x 16 SRAM & 512K x 16 FLASH AS8SF384K32 PIN ASSIGNMENT Top View SRAM / FLASH MEMORY ARRAY 68 Lead CQFP (QT) NC A0 A1 A2 A3 A4 A5 FCS\1 GND FCS\2 SWE\1 A6 A7 A8 A9 A10 VCC FEATURES • Operation with single 5V supply