17MMX17MM Search Results

Contextual Info: DATASHEET Dual 20A/Single 40A Step-Down Power Module ISL8240M Features The ISL8240M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mmx17mm PCB footprint. The two 20A outputs may be used independently or combined to deliver a single output

Contextual Info: Dual 20A/Single 40A Step-Down Power Module ISL8240M Features The ISL8240M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mmx17mm PCB footprint. The two 20A outputs may be used independently or combined to deliver a single output

Contextual Info: Dual 20A/Single 40A Step-Down Power Module ISL8240M Features The ISL8240M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mmx17mm PCB footprint. The two 20A outputs may be used independently or combined to deliver a single output

PM4359

Contextual Info: 08 an u ar y, 20 06 PM4358 COMET OCTAL :3 8: 26 PM COMET OCTAL and COMET TETRA Product Overview Preliminary co n Mo nd ay ,0 2J Eight Channel Combined E1/T1/J1 Transceiver and Framer Pa rtm in er In PM4359 COMET TETRA Product Overview Preliminary Issue No. 3: December 2005

mpeg 2 to mpeg 4 transcoder

Abstract: H.264
Contextual Info: MPEG-2 to H.264 Transcoder LSI This LSI implements MPEG-2 to H.264 transcoding in a single chip. It can reduce the bit rate by half and double the compression ratio allowing HDTV or SDTV content in MPEG-2 format to be easily stored and transmitted while retaining premium video quality.

Contextual Info: 02 m be r, 20 06 PM4358 COMET OCTAL :4 4: 56 AM COMET OCTAL and COMET TETRA Product Overview Released n Fr id ay ,0 1S ep te Eight Channel Combined E1/T1/J1 Transceiver and Framer Pa rtm in er In co PM4359 COMET TETRA Product Overview Released Issue No. 4: June 2006

Contextual Info: DATASHEET Dual 15A/Single 30A Step-Down Power Module ISL8225M Features The ISL8225M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A

tetra system block diagram

Contextual Info: 08 ov em be r, 20 05 PM4358 COMET OCTAL :3 3: 08 PM COMET OCTAL and COMET TETRA Product Overview Preview Th ur sd ay ,1 7N Eight Channel Combined E1/T1/J1 Transceiver and Framer tm in er In co n PM4359 COMET TETRA Product Overview Preview Issue No. 2: September 2005

TP182

Abstract: tp394 xo 640c TP463 power designs tp330 marking code diode R12 sot23-6 tp192 HDR10X1 N4 SOT23-6 marking K1 sot23-6
Contextual Info: MachXO Standard Evaluation Board - Revisions 001 & 002 User’s Guide March 2008 Revision: EB21_01.6 MachXO Standard Evaluation Board Revisions 001 & 002 User’s Guide Lattice Semiconductor Introduction The MachXO Standard Evaluation board provides a convenient platform to evaluate electrical characteristics of the

tp394

Abstract: tp182 marking code diode R12 sot23-6 tp154 tp230 Lattice Semiconductor Package Diagrams 256-Ball fpBGA marking F3 sot23-6 TP147 TP265 HDR10X1
Contextual Info: MachXO Standard Evaluation Board - Revision 000 User’s Guide April 2007 Revision: EB20_01.2 Lattice Semiconductor MachXO Standard Evaluation Board - Revision 000 User’s Guide Introduction The MachXO Standard Evaluation board provides a convenient platform to evaluate electrical characteristics of the

Contextual Info: 1/3 Serial ATA 3Gbps Compatible One Package Solid State Drive eSSD Series 1GB to 4GB Conformity to RoHS Directive TDK's SSD Controller IC GBDriver RS3 and SLC NAND-type flash memory have been integrated into one package through multi-chip packaging (MCP) technology, providing

Contextual Info: 03 ,0 6J ul y, 20 06 PM4358 COMET OCTAL :3 6: 07 AM COMET OCTAL and COMET TETRA Product Overview Released co n Th ur sd ay Eight Channel Combined E1/T1/J1 Transceiver and Framer of Pa rtm in er In PM4359 COMET TETRA Product Overview Released Issue No. 4: June 2006

ZTE DSLAM configuration

Abstract: BCM56800 INVENTEC ericsson atca HUAWEI Base Station alcatel fan tray PI7C9X20505GP PI7C9X20505 broadcom serdes data eye HT1000
Contextual Info: ATCA, MTCA & AMC Systems Solution of the Month – November 2007 Corporate Overview Public U.S.A. Company ƒ Founded in 1990 ƒ IPO in 1997 ƒ NASDAQ: PSEM Headquarters in San Jose, California Silicon Valley ƒ ~600 Employees ƒ Global Sales & Support Offices

b69000 chips

Abstract: b69000 B65555 chips m69000 m69000 chips 69000 B65554 69000 agp to video converter B69000 intel
Contextual Info: Product Overview HiQVideo 69000 CHIPS SYNCHRONOUS DRAM 2MB YUVa RGB YUVb 69000 ANALOG NTSC/PAL PCMCIA PORT/ CONTROLLER ZV PORT 16 CAPTURE AND SCALING YUV / RGB TELEVISION MEMORY CONTROLLER UNDER SCAN FLICKER REDUCTION NTSC/PAL ENCODER RGB 64 32 FRAME AGP/PCI

PM4358-NGI

Abstract: PM4359-NGI PM4359 tetra system block diagram pm4358-ni PM4359-NI PM4358 ATT Preliminary Technical reference pub 62411 CABGA-256 TETRA monitoring
Contextual Info: 09 ug us t, 20 06 PM4358 COMET OCTAL :0 8: 17 PM COMET OCTAL and COMET TETRA Product Overview Released n Th ur sd ay ,0 3A Eight Channel Combined E1/T1/J1 Transceiver and Framer Pa rtm in er In co PM4359 COMET TETRA Product Overview Released Issue No. 4: June 2006

serial flash memory ic 2gb format

Abstract: CFG8B12MKABCSFAA TDK GBDriver RS2 TDK GBDriver RA3 controller CFG8B08G ERS3S1GBS CFG8B ssd controller CFG8B12MKAB msata connector
Contextual Info: FLASH forward T D K F L A S H S T O R A G E C A TALOGUE SM A RT ST O R A G E, SM A R T F U T U R E TDK GBDriver is an NAND flash memory controller IC based on TDK s original NAND flash control technology, which achieves high-speed access while ensuring high

Contextual Info: TDK FLASH STOR STORAGE AGE DATA SHEET eSSD SATA 3Gbps SSD Device ERS3S Series Merging Memory and Intelligence “eSSD” The adoption of solid state drives SSDs as storage devices that substitute and complement HDDs is rapidly increasing for various electronic devices. The memory

Contextual Info: 12 ov em be r, 20 05 PM4358 COMET OCTAL :5 0: 57 AM COMET OCTAL and COMET TETRA Product Overview Preview Th ur sd ay ,0 3N Eight Channel Combined E1/T1/J1 Transceiver and Framer tm in er In co n PM4359 COMET TETRA Product Overview Preview Issue No. 2: September 2005

nFORCE 430

Abstract: nvidia nforce 430 nforce 410 mcp NVIDIA nForce pcie x16 mcp 430 nvidia PCIe Bridge nFORCE DB1200 bga nvidia
Contextual Info: Pericom Solutions for PCI Express PCIe August 2006 Table of Contents Æ Æ Æ Æ About Pericom About PCI Express Why Pericom? PCIe Product Detail ƒ ƒ ƒ ƒ ƒ ƒ Æ 2 PCIe Bridges PCIe Packet Switches PCIe PHY PCIe Signal Switches PCIe Re-Drivers PCIe Clocks

M58WR032KB

Abstract: BF524 Embedded Processing ADSP-BF522 ADSP-BF526 MT48H32M16LFCJ-75 VFBGA56 numonyx nand flash "NAND Flash" intel
Contextual Info: Analog Devices: BF526-EZBRD : Blackfin Processors : Embedded Processing and DSP Page 1 of 3 ADSP-BF526 EZ-Board for the ADSP-BF522, BF524, BF526 Blackfin Processo The Blackfin BF526 EZ-Board evaluation board provides developers with a low-cost platform for initial evaluation of the

FPQ-256(352)-0.5-04

Abstract: ic149-208-161-s5 FPQ-256 Enplas drawings IC51-1004-809 Enplas fpq 352 Yamaichi TQFP Enplas fpq IC51-1764-1505-5 IC51-1444-1354
Contextual Info: v2.0 Socket Recommendation for Actel FPGA Packages So c ke t s f or Pr o t o t yp i n g w i t h Ac t e l F P G A s Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

Yamaichi IC51-1444-1354-7 footprint

Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 SY-PQ240 enplas FPQ-256
Contextual Info: v3.1 Socket Recommendation for Actel FPGA Packages Sockets for Prototyping with Actel FPGAs Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced