15X151 Search Results

Contextual Info: 94 max. S 15xlT08l = [m 2l 109-40065 F48M z.b.d Lot / dip-solder 3mm GK II / class 2 Standard Kontakt / Standard Contad |6nm O O O O O O O O O O O O O O O O O O O O O O O O O O O O O O Q O 32 Zenfrierbohrung fur Kodierstift / center hole for coding pin 32 31 30 29 2B 27 2t 25 24 23 22 21 20 19 18 17 16 15 141312 1110 9 8 7 6 5 4 3 2 1

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O