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Others 2115-2X16G00DN/4U
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
PUI	2115-2X16G00DN/4U		89			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Oupiin 2115-2X16G00DN/4U Pin header 2.0mmx2.0mm double
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Master Electronics	2115-2X16G00DN/4U					1 - 10 - 100 $1.01 1000 $0.75 10000 $0.68	Buy Now

152X16 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
LHMN5 Abstract: 48TSOP LH5332600 LH5332600N LH5332600T LH5332C00D TSOP048-P-1218 LH5332500 2sj au LHMV Contextual Info: NBA/ INFORMATION LH5332600 • High-speed 32M-bit Mask-Programmable ROM Pin Connections Description The LH5332600N/T User's No. : LHMN56XX/LHMN5FXX is a CM OS 32M-bit mask-programmable ROM organized as 4 194 304X8 bits (Byte mode) or 2 097 152X 16 bits (Word	OCR Scan	LH5332600 32M-bit LH5332600N/T LHMN56XX/LHMN5FXX) 32\l-bit 304X8 LH5332600N 44-pin OP044-P-0600) LH5332600T LHMN5 48TSOP LH5332600 LH5332C00D TSOP048-P-1218 LH5332500 2sj au LHMV	PDF
heat sink Contextual Info: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 heat sink	PDF
EPOXY RESIN Contextual Info: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 EPOXY RESIN	PDF
a3020 Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130 a3020	PDF
Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063W/cm 152x160 120x130	PDF