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SMC Corporation of America CG5EA63TNSV-152-X165US WATER RESISTANT CYLINDER, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5EA63TNSV-152-X165US	Bulk		5 Weeks	1	1 $382.16 10 $382.16 100 $382.16 1000 $382.16 10000 $382.16	Get Quote
SMC Corporation of America CG5BA63TNSV-152-X165US CYLINDER, AIR, STAINLESS STEEL, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5BA63TNSV-152-X165US	Bulk		5 Weeks	1	1 $409.71 10 $409.71 100 $409.71 1000 $409.71 10000 $409.71	Get Quote
SMC Corporation of America CG5EN80TNSR-152-X165US CYLINDER, AIR, STAINLESS STEEL, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5EN80TNSR-152-X165US	Bulk		5 Weeks	1	1 $453.34 10 $453.34 100 $453.34 1000 $453.34 10000 $453.34	Get Quote
SMC Corporation of America CG5GA63TNSV-152-X165US CYLINDER, AIR, STAINLESS STEEL, CG5 SERIES
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CG5GA63TNSV-152-X165US	Bulk		5 Weeks	1	1 $443.80 10 $443.80 100 $443.80 1000 $443.80 10000 $443.80	Get Quote
Dichtomatik 120X152X16SA (75003165) OIL SEAL, 120MM ID, 152MM OD, 16MM WIDTH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	120X152X16SA (75003165)	Bulk		3 Weeks	16	1 - 10 - 100 $33.74 1000 $33.74 10000 $33.74	Get Quote

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152X16 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
LHMN5 Abstract: 48TSOP LH5332600 LH5332600N LH5332600T LH5332C00D TSOP048-P-1218 LH5332500 2sj au LHMV Contextual Info: NBA/ INFORMATION LH5332600 • High-speed 32M-bit Mask-Programmable ROM Pin Connections Description The LH5332600N/T User's No. : LHMN56XX/LHMN5FXX is a CM OS 32M-bit mask-programmable ROM organized as 4 194 304X8 bits (Byte mode) or 2 097 152X 16 bits (Word	OCR Scan	lh5332600 32m-bit lh5332600n/t lhmn56xx/lhmn5fxx +1332\l-bit 304x8 lh5332600n 44-pin op044-p-0600 lh5332600t lhmn5 48tsop lh5332c00d tsop048-p-1218 lh5332500 2sj au lhmv	PDF
heat sink Contextual Info: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130 heat sink	PDF
EPOXY RESIN Contextual Info: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130 epoxy resin	PDF
a3020 Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130 a3020	PDF
Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	063w/cm 152x160 120x130	PDF