152MB Search Results

83977ATF

Abstract: winbond msl 83977TF marking rld bh sot 223 st ae gp 446
Contextual Info: W83977ATF WINBOND I/O W83977ATF Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 n.a. 08/25/97 0.50 First published. 2 53,54,58,63,64,65, 69,138.1,139 11/17/97 0.51 Register correction 3 1,2,3,20,45,53,63, 65,99,103,150 04/01/98

siemens 3tb44

Abstract: 3tb52 SIEMENS 3TH 82 catalog for 3RT series contactor* siemens 3TH43 siemens 3th42 3TH42 siemens contactor IEC 60947 VDE 0660 3TB44 siemens magnetic contactor
Contextual Info: 3RT, 3RH, 3TB, 3TC, 3TH, 3TK Contactors for Special Applications Contactors with Extended Tolerance 0.7 . 1.25 x Us , for Railway Applications 3RT10 motor contactors, 5.5 . 45 kW DC operation • DC solenoid system Screw terminals For screw and snap-on mounting onto standard mounting rail

Y51 h 85c

Abstract: RY5FD01D Y51i marking 1Hc Y5FD01D RY5FD diode receptor pin optical ry5f
Contextual Info: SHARP 1996 April 5th General Specification Product name : Infrared Communication Unit Model : RY5FD01D Sharp Corporation Electronic Components Group Components Division These products are under development. ‘1’hese specifications are subject to change without notice.

Contextual Info: EIN UNTERNEHMEN VON Roederstein Keramik-Kondensatoren fur die Unterhattungs-Elektronik Ceramic Capacitors for entertainment electronics Keram ische Hochspannungs-Scheibenkondensatonen, Klasse 2 C eram ic high voltage disc capacitors, class 2 Ausfiihrung / Design:

sd 4841 p

Abstract: sd 4841
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled

Contextual Info: IBM31T38JS IBM31T38JT Low-Power Integrated Infrared Transceiver Features • IrDA, HP-SIR, Local Talk and Sharp ASK • Ultracompact package: • H 4.0 mm x D 4.8 mm x L 9.6 mm Low power consumption • ~2 mA @ 2.7 V • -3 .3 m A @ 5.25 V • Data rates from 9600 bit/s to 4 Mbit/s

sd 4841 p

Abstract: sd 4841 DALE 100MB 471mb marking 333*A
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M ount, G apped and U ngapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-5047 Inductors S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

102MB

Contextual Info: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

Contextual Info: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICARON FOR OPTICAL DATA COMMUNICATION TRANSCEIVER MODEL No. GP2W1001YP Specified for Enclosed please find copies of the Specifications which consists of 23 pages including cover.

o 103na

Abstract: PENI Ci HP 2200
Contextual Info: A COMPANY MODEL LPE-6855 Inductors . O A L E OF , Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

Contextual Info: IBM Microelectronics IBM31T1502 Infrared Communications Controller Data Sheet — Note! - Before using this information and the product it supports, be sure to read the general information under “ Notices” on

amibios

Abstract: amibcp amibios* setup version 1.0 NCR-53C810 American Megatrends mercury computer motherboard amibios* setup version 2.4 Megatrends vga bios PC MOTHERBOARD SERVICE MANUAL intel
Contextual Info: MPE-PNTM System Board BIOS User’s Guide P/N: 771920-DO2 Version DO2 August, 1994 Preface MPE-PNTM BIOS User’s Guide PREFACE Thank you for your choice of a Mylex MPE-PNTM System Board product. With proper installation and care, your Mylex System Board will operate for years without any service requirement. This Installation

Contextual Info: MODEL LPE-6855 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

cl 6562

Abstract: o 103na DALE ELECTRONICS 154NA
Contextual Info: A COMPANY M O D EL L P E -6 562 In d u c to rs . a M C OF , Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

o 103na

Contextual Info: A COMPANY OF M O D EL L P E -5 047 In d u c to rs Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

how to use timer in bascom

Abstract: ali 3511 NKK DATE code 1304h NR4650 NKK NR4650
Contextual Info: Preliminary ND5000LBG ND5000LBG System Controller with PCI Bus for NR5XXX /NR4700 /NR46XX CPUs Preliminary Rev.4.0 Oct. 1998 SYSTEM BLOCK DIAGRAM < CPU > / / / / NR46 00 NR46 50 NR47 00 NR50 00 NR56 50 < DRAM > Memory bus 3.3V SysAD bus (3.3V) SDR A M EDO

Contextual Info: A COMPANY OF M O DEL L P E -5047 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: A COMPANY OF MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

o 103na

Contextual Info: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

bat 102H transistor

Abstract: NEC 71055 keyboard interfacing with 8255 microprocessors AMIBIOS HIFLEX SETUP UTILITY VERSION 1.3 8255 interfacing with 8086 CX486SLC interfacing keyboard matrix with 8255 8255 keyboard interfacing amibios Floppy connector 34 pin IDC
Contextual Info: APEX 104 CPU & APEX 104 CI-2 User Manual APEX 104 CPU & APEX 104 CI-2 User Manual Document Part N° Document Reference Document Issue Level 127-150 APEX\.\127-150.DOC 2.0 Manual covers PCBs with the following Revision N° A All rights reserved. No part of this publication may be reproduced, stored in any retrieval system or

Contextual Info: Figure 24. IRMS6400/IRMT6400 detail drawings with optional side view or top view mounting Dim ensions in inches mm — All dim ensions have tolerances of ±0 .0 0 4 " (±0.1 m m) Recommended PCB footprint TOP VIEW .116 014 36) .388 (9.86) Max. 6400RYYWW uwmiuwU