102NA Search Results

mb9af105n

Abstract: mb9af MB9AF102 MB9AF104NA
Contextual Info: FUJITSU SEMICONDUCTOR FACT SHEET NP706-00005-2v0-E 32-bit Microcontrollers FM3 Family MB9A100A Series MB9A100A series are highly integrated 32-bit microcontrollers that target for high-performance and cost-sensitive embedded control applications. MB9A100A series are based on the ARM Cortex-M3 Processor and on-chip Flash memory and

Contextual Info: M O DEL L P E -3325 In d u c to rs Surface Mount, Gapped and Ungapped F E A TU R ES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

sd 4841 p

Abstract: sd 4841
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled

102MB

Contextual Info: A C O M PAN Y OF M O DEL L P E -3 325 In d u c to rs Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

sd 4841 p

Abstract: sd 4841 DALE 100MB 471mb marking 333*A
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M ount, G apped and U ngapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-5047 Inductors S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

E170721

Abstract: sn 2402
Contextual Info: TYPE KAH No. P-KAH-E003 Type KAH micro fuse is designed for circuit protection against excessive current in portable electronic equipment, electronic circuit around battery, etc. because the demand for high capacity batteries is increasing. Further miniaturization and low profile with extended rated range can be used for wider application.

Contextual Info: Model LPE-4841 VISHAY Vishay Dale Transformers/lnductors Surface Mount, Gapped and Ungapped Custom Configurations Available ELECTRICAL SPECIFICATIONS Inductance Range: 10]uH to 47000|^H, measured at 0.10V RMS @ 10kHz without DC current, using an HP 4263A or HP 4284A impedance analyzer.

102MB

Contextual Info: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

Matsuo Electric KAB 2402 162

Abstract: pulse load calculation formula E170721 H60A H60S H63A UL248-1 Electronic fuse
Contextual Info: No. P-KAH-001 DATE 2007-01 PRODUCTS DATA SHEET MICRO FUSE UL/cUL approved File No. E170721 RoHS COMPLIANT <lead-free> Type KAH Size 1005 Type KAH micro fuse is designed for circuit protection against excessive current in portable electronic equipment, electronic circuit around

o 103na

Abstract: PENI Ci HP 2200
Contextual Info: A COMPANY MODEL LPE-6855 Inductors . O A L E OF , Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

JAD2402202NA010

Abstract: Matsuo 501 JIS-Z-3282
Contextual Info: P-JAD-E002 Type JAD Type JAD micro fuse is designed for circuit protection against excessive current in portable electronic equipment, electronic circuit around battery etc. because the demand for high capacity batteries is increasing. Since it is designed as chip type, it is compact and the best suitable for portable use.

UL248-1

Abstract: KAH marking Matsuo KAB fuse Matsuo 631 40107 Equivalent
Contextual Info: TYPE KAH Type KAH micro fuse is designed for circuit protection against excessive current in portable electronic equipment, electronic circuit around battery, etc. because the demand for high capacity batteries is increasing. Further miniaturization and low profile with extended rated range can be used for wider application.

Contextual Info: M ODEL LPE-6562 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-6855 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

micro fuse

Abstract: fuse 102 E170721 H60A H60S H63A JAD322 JISZ3282 pulse load calculation formula fuse i2t
Contextual Info: No. P-JAD-001 DATE 2007-02 PRODUCTS DATA SHEET MICRO FUSE UL/cUL approved File No. E170721 RoHS COMPLIANT LEAD FREE Type JAD Size 3216 Type JAD micro fuse is designed for circuit protection against excessive current in portable electronic equipment, electronic circuit around

JAD2402

Abstract: E170721 H60A H60S H63A JAD322 JISZ3282 CM328 10N102K 8512A
Contextual Info: No. P-JAD-001 DATE 2006-10 PRODUCTS DATA SHEET マイクロヒューズ UL. cUL 認定品 File No.E170721 RoHS指令対応品 JAD型 3216サイズ 携帯用電子機器の普及に伴い大容量バッテリーの使用が増加しています。マイクロヒューズは、携帯用電子機器のバッテ

MB9BF104NA

Abstract: MB9BF104 MB9BF102NA MB9BF106RA
Contextual Info: FUJITSU SEMICONDUCTOR FACT SHEET NP706-00004-2v0-E 32-bit Microcontrollers FM3 Family MB9B100A Series MB9B100A series are highly integrated 32-bit microcontrollers that target for high-performance and cost-sensitive embedded control applications. MB9B100A series are based on the ARM Cortex-M3 Processor and on-chip Flash memory

cl 6562

Abstract: o 103na DALE ELECTRONICS 154NA
Contextual Info: A COMPANY M O D EL L P E -6 562 In d u c to rs . a M C OF , Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

o 103na

Contextual Info: A COMPANY OF M O D EL L P E -5 047 In d u c to rs Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

Contextual Info: A COMPANY OF M O DEL L P E -5047 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

LPE-3325

Contextual Info: A COMPANY OF M O DEL L P E -3325 In d u c to rs Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

Contextual Info: A COMPANY OF MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints