15 BALL CSP Search Results

28F160

Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Contextual Info: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than

MO-192-AAF-1

Abstract: aaf1 256-BALL
Contextual Info: 256-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-256-2 Dimensions shown in millimeters A1 CORNER INDEX AREA 17.20 17.00 SQ 16.80 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T BALL A1 PAD CORNER 15.00 BSC SQ TOP VIEW *1.85

BC-208-2

Abstract: 208-Ball
Contextual Info: 208-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-208-2 Dimensions shown in millimeters 17.10 17.00 SQ 16.90 A1 BALL CORNER A1 CORNER INDEX AREA 20 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1 A B C D E F G H J K L M N P R T U V W Y 15.20 BSC SQ

transistor BC-148

Abstract: BC148 BC 148 L BC 148 transistor BC-148 MO-195 BC 148 BC148 L transistor bc 148 "bc 148"
Contextual Info: a 148-Lead Chip Scale Package Ball Grid Array [CSP_BGA] BC-148 Dimensions shown in millimeters A1 CORNER INDEX AREA 9.10 9.00 SQ 8.90 BALL A1 PAD CORNER TOP VIEW 16 14 12 10 15 13 11 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T 7.50 BSC SQ 0.50 BSC

LGA 1150

Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch

EMI filter schematic diagram

Abstract: notebook schematic diagram circuit diagram of wireless camera CM1452-04CP Wireless Camera Circuit Diagram mobile camera circuit diagram emi filter cell phone display pcb CM1452 CM1452-06CP CM1452-08CP
Contextual Info: PRELIMINARY CM1452 LCD & Camera EMI Filter Array with ESD Protection Features Applications 4, 6 and 8 channels of EMI filtering 15kV ESD protection IEC 61000-4-2, contact discharge 30kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz Chip Scale Package (CSP) with 0.40mm pitch and

bga 576 socket

Abstract: IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket
Contextual Info: IC280 Series Clamshell Ball Grid Array (FBGA / CSP / LGA) Specifications Part Number (Details) 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch 500V AC for 1 minute for 0.80mm pitch 100V AC for 1 minute for 0.75mm pitch

sensors mttf

Abstract: SAC405 UM 3841 4953 sac 405 "Hall Effect Sensor" mttf resistor activation energy sURVEY OF Hall Effect Current Measurements WLCSP Cu6Sn5
Contextual Info: Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps Stephen Gee and Luu Nguyen National Semiconductor M/S 19-100 3875 Kifer Rd. Santa Clara, CA 95051 stephen.gee@nsc.com luu.nguyen@nsc.com ABSTRACT In this test setup, embedded die surface temperature sensors are

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

128W18

Abstract: 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp
Contextual Info: 128-Mbit 1.8 Volt Intel Wireless Flash Memory W18 + 32-Mbit PSRAM Stacked-CSP Family Datasheet Product Features • ■ ■ ■ Flash Architecture — Flexible, Multiple-Partition, DualOperation: Read-While-Write / ReadWhile-Erase — 32 Partitions, 4 Mbits each

Contextual Info: Preliminary CMOS SRAM KM68V4000BZ, KM68U4000BZ Family Document Title 512Kx8 Low Voltage & Low Power SRAM Data Sheets for 48-CSP Revision History Rev. No. History Draft Data Remark Rev. 0.0 - 1′st edition - Package Dimension Finalized Feb. 4′th, 1997 Preliminary

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

WLCSP flip chip

Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Contextual Info: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters

CM1442-06l

Abstract: MARKING 1053
Contextual Info: CM1442-06LP LCD and Camera EMI Filter Array with ESD Protection Functional Description Features • Six Channels of EMI Filtering with Integrated ESD Protection • 0.4 mm Pitch, 15−Bump, 2.360 mm x 1.053 mm Footprint Chip • • • • • Scale Package CSP

dycostrate

Abstract: CH-2074 without underfill
Contextual Info: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP

Contextual Info: CSPEMI201A 2 Channel Headset Speaker EMI Filter with ESD Protection Features Product Description • • The CSPEMI201A is a dual low-pass filter array integrating two pi-style filters C-R-C that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a

Contextual Info: CSPEMI202A 2 Channel Headset Microphone EMI Filter with ESD Protection Features Product Description • • The CSPEMI202A is a dual low-pass filter array integrating two pi-style filters C-R-C that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a

Contextual Info: CSPEMI202A 2 Channel Headset Microphone EMI Filter with ESD Protection Features Product Description • • The CSPEMI202A is a dual low-pass filter array integrating two pi-style filters C-R-C that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a

Contextual Info: CSPEMI204 2 Channel Headset EMI Filter with ESD Protection Features Product Description • The CSPEMI204 is a low-pass filter array designed specifically to reduce EMI/RFI emissions and provide ESD protection for a headset port on a cellular and mobile devices. The CSPEMI204 integrates two high

Contextual Info: CSPEMI201A 2 Channel Headset Speaker EMI Filter with ESD Protection Features Product Description • • The CSPEMI201A is a dual low-pass filter array integrating two pi-style filters C-R-C that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a

Contextual Info: CSPEMI200A 4 Channel Headset EMI Filter with ESD Protection Features Product Description • • The CSPEMI200A is a quad low-pass filter array integrating four pi-style filters C-R-C that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface

marking AF

Contextual Info: CSPEMI205 3 Channel Headset EMI Filter with ESD Protection Features Product Description • The CSPEMI205 is a low-pass filter array integrating three pi-style filters C-R-C that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the

Contextual Info: Preliminary CMOS SRAM KM68V4000BZ, KM68U4000BZ Family Document Title 512Kx8 Low Voltage & Low Power SRAM Data Sheets for 48-CSP Revision History Rev. No. History Draft Data Rem ark Rev. 0.0 - 1 s t edition - Package Dimension Finalized Feb.4 th, 1997 Preliminary

Contextual Info: Preliminary KM616FS2000Z, KM616FR2000Z Family CMOS SRAM Document Title 128Kx16 Super Low Power and Low Voltage Full CMOS SRAM Data Sheets for 48-CSP Revision History R e v is io n N o . 0.0 H is to ry Initialize Draft Data R e m a rk February. 4, 1997 Prelim inary