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    1457H Search Results

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    Samtec Inc FTR-114-57-H-D

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    Master Electronics FTR-114-57-H-D
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    Samtec Inc HTMS-114-57-H-S

    .050 X .100 High-Temp Through-hole Micro Terminal Strip
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    Master Electronics HTMS-114-57-H-S
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    Sager HTMS-114-57-H-S
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    Siemens 5SJ41457HG41

    MINIATURE CIRCUIT BREAKER 5SJ4 1P 240V 45A 10K C-TRIP
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    RS 5SJ41457HG41 Bulk 1
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    Siemens 5SJ4145-7HG40

    MINIATURE CIRCUIT BREAKER 5SJ4 1P 240V 45A SAME PH 10K C-TRIP
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    RS 5SJ4145-7HG40 Bulk 3 Weeks 1
    • 1 $45.99
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    Phoenix Contact 1411457 (HC-EVO-B10-HLWD-EL-AL)

    CONNECTOR HOUSING;HOOD;SIDE ENTRY;B10;LOCKING CLIP (2) ON HOOD
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    RS 1411457 (HC-EVO-B10-HLWD-EL-AL) Bulk 1
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    1457H Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    UPA1457H

    Contextual Info: N EC ELECTRONICS INC Tfi D Ë J b457555 D O l I l b ? fl | ~ -7 - . * ^ ¿¿P A PNP 3 .^ 5* 1457H SILICON EPITA X IA L POWER T R A N S I S T O R L O W S P E E D S W I T CH I N G D A R L I N G T O N ARRAY DESCRIPTION The /1457H Is an array of four darlington power transistors. It Is


    OCR Scan
    b4575551457hupa1457h PDF

    NEC asu

    Abstract: 13E3h 1442H
    Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original
    r8c/22r8c/23rej09b0251-0200nec asu+213e3h1442h PDF

    T8032

    Abstract: 0547 fsm 0x1516 0x150F 13,824mhz "K042" tb8032 transistor GT 1081
    Contextual Info: W681307 Product Datasheet USB1.1 CODEC Microprocessor Control Unit with 32KB Mask ROM and 4KB RAM. -1- Publication Release Date: May, 2007 Revision 1.3 W681307 AMENDMENT HISTORY Changes •: modified, √: added, x: removed Ver Date 1.0 2006/11/22 Filename


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    w6813070x14c40x14e5t8032+70547 fsm0x15160x150f13,824mhzk042tb8032transistor gt 1081 PDF

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


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    r8c/22r8c/2316-bitrej03b0097-0020+1148-pin13cdma 1360h13bfh1344hr5f21226jfpr5f21226kfpr5f21227jfpr5f21227kfp1421h1447h PDF

    Super10

    Abstract: UDE RD1 ST10 SXM 08 rbps2 SXLB
    Contextual Info: Super10 STANDARD PERIPHERAL USER’S MANUAL Release 1.2 June 2004 This is advance information on a new product now in development or undergoing evaluation. Details are subject to change without notice. Super10 STANDARD PERIPHERAL USER’S MANUAL PREFACE By introducing the ST10 family member Super10, STMicroelectronics is expanding its offer on strategic


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    super10sup10spude rd1st10+3sxm 08rbps2sxlb PDF

    1N44H

    Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
    Contextual Info: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use


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    spectra-4x155pm53164x155pmc-1990822+111n31h1n44h1a5ah1178h1n60h1171h1a86h0m021b7ah19c1h1n14h PDF

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    r8c/22r8c/23rej03b0097-010048-pin+61312h144bh1458h1351h13d0h1444h PDF

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    r8c/22r8c/23rej03b0097-011048-pin+10r5f2123r5f2123ckfp131bhr5f2122cjfpr5f21226dfpr5f21226jfpr5f21227dfpr5f21227jfp1428hr5f21228jfp PDF

    1C65H

    Abstract: 1a5ah
    Contextual Info: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner


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    4x155pm5316pmc-19908221c65h+11a5ah PDF

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Contextual Info: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    rej09b0251-0200r8c/22r8c/23r5f2122ckfp+5r5f21237jfpr5f21238kfpr5f21236jfpr5f2123ckfp1342h PDF

    2482h b3

    Abstract: 3204H PL 2305H PMC-2021098 1A27H 171bh 1D18 336FH 1733H 3583H
    Contextual Info: 14 PM TUPP 2488 ASSP Data Sheet Register Description Released ob sd ay ,2 8O ct TUPP 2488 er ,2 00 4 12 :5 9: PM5364 rtm in er In co n Th ur SONET/SDH Tributary Unit Payload Processor For 2488.32 Mbit/s Interfaces Released Issue No. 6: August 2004 Do wn


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    pmc-2020188pm53640115h011dh+102482h b33204hpl 2305hpmc-20210981a27h171bh1d18336fh1733h3583h PDF

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original
    nec 1378hr5f2123ckfp1347h13f9h+6r5f21226dfpr5f21226jfpr5f2123r5f21227jfpr5f21228dfpr5f21228jfp PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


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    r8c/22r8c/23rej03b0097-020048-pin+10145ahma 1360h1320h1378h icr5f2122ckfpr5f2123ckfp13c4hr5f2122ajfpr5f21226dfpr5f21227dfp PDF

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


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    r8c/22r8c/2316-bitrej03b0097-0010+1348-pindi5-900unit260713d2h1429h1332hr5f21231466h1439h1423h1342h13f9h1436h PDF

    Contextual Info: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner


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    4x155pm5316pmc-1990822 PDF

    Contextual Info: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    rej09b0251-0110r8c/22r8c/23 PDF