NEC asu
Abstract: 13E3h 1442H
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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r8c/22r8c/23rej09b0251-0200nec asu+213e3h1442h
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1037h
Abstract: 1250H 1488h MX12 MX23 PM5365
Contextual Info: PM5365 TEMAP STANDARD PRODUCT DATASHEET PMC-1991148 ISSUE 3 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP VT/TU MAPPER AND M13 MULTIPLEXER DATA SHEET PROPRIETARY AND CONFIDENTIAL RELEASED ISSUE 3: SEPTEMBER 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its Customers’ Internal Use
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Contextual Info: PM8315 TEMUX STANDARD PRODUCT DATASHEET ISSUE 7 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX :5 4: 01 AM PMC-1981125 co n Fr id ay ,2 TEMUX 9O ct ob er ,2 00 4 10 PM8315 DATASHEET PROPRIETARY AND CONFIDENTIAL ISSUE 7: MAY 2001 Do wn lo
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13CD
Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is
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1587H
Contextual Info: PM8315 TEMUX PRELIMINARY DATASHEET PMC-981125 ISSUE 4 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY
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0B-09
Abstract: bip 109
Contextual Info: PM5365 TEMAP PRELIMINARY DATASHEET PMC-991148 ISSUE 1 VT/TU MAPPER AND M13 MUX PM5365 TEMAP VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 1: SEPTEMBER 1999 PMC-Sierra, Inc. 105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000
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Contextual Info: Intel C600 Series Chipset Data Sheet March 2012 Document Number: 326514-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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a8293
Abstract: A8294 A8264 PC 1498H 1250H a8296 BA RV cb rv 1050H REQ64
Contextual Info: Intel 80312 I/O Companion Chip Developer’s Manual December 2000 Order Number: 273410-002 Intel® 80312 I/O Companion Chip Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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181ch1820h1824h1828h+16182ch1830h1834h1838h183ch18ffha8293a8294a8264pc 1498h1250ha8296ba rvcb rv1050hreq64
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1312H
Abstract: 144BH 1458h 1351h 13D0H 1444H
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level
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r8c/22r8c/23rej03b0097-010048-pin+61312h144bh1458h1351h13d0h1444h
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SI 1340H
Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
Contextual Info: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.
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1257h
Abstract: 1488h 1542H 1250H 200H MX12 PM4328 PM5362 PM5365 PM8315
Contextual Info: TEMUX Programmer's Guide Released PM8315, PM5365, PM4328 TM TEMUX TEMUX, TEMAP, TECT3 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER Programmer’s Guide Proprietary and Confidential Release Issue 4: November 2001 Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use
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PC 1498H
Abstract: SDIN5 AK7750VT marking 6ah AK6512C AK6514C AK7750 MPX16 AKM 34 2 01 15
Contextual Info: [ASAHI KASEI] [AK7750] AK7750 Audio DSP with Built-in Hands-Free Phone Features General Description The AK7750 is a highly integrated Audio Digital Signal Processor with a stereo audio codec in one chip. The AK7750 combines an on-chip DSP and an ARM7 processor that can be used to create Echo
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ak7750ms0296-e-00pc 1498hsdin5+6ak7750vtmarking 6ahak6512cak6514cmpx16akm 34 2 01 15
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Contextual Info: PM8315 TEMUX PRELIMINARY DATASHEET PMC-1981125 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY
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R5F2123
Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level
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r8c/22r8c/23rej03b0097-011048-pin+10r5f2123r5f2123ckfp131bhr5f2122cjfpr5f21226dfpr5f21226jfpr5f21227dfpr5f21227jfp1428hr5f21228jfp
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SDIN5* flash
Abstract: M/OSC 1518h 152AH srs wow
Contextual Info: [ASAHI KASEI] Preliminary [AK7750] AK7750 Audio DSP with Built-in Hands-Free Phone Features General Description The AK7750 is a highly integrated Audio Digital Signal Processor with a stereo audio codec in one chip. The AK7750 combines an on-chip DSP and an ARM7 processor that can be used to create Echo
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ak7750ak6512csdin5* flashm/osc 1518h+2152ahsrs wow
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r5f2122ckfp
Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
Contextual Info: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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2482h b3
Abstract: 3204H PL 2305H PMC-2021098 1A27H 171bh 1D18 336FH 1733H 3583H
Contextual Info: 14 PM TUPP 2488 ASSP Data Sheet Register Description Released ob sd ay ,2 8O ct TUPP 2488 er ,2 00 4 12 :5 9: PM5364 rtm in er In co n Th ur SONET/SDH Tributary Unit Payload Processor For 2488.32 Mbit/s Interfaces Released Issue No. 6: August 2004 Do wn
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Contextual Info: PM5365 TEMAP PRELIMINARY DATASHEET PMC-1991148 ISSUE 2 VT/TU MAPPER AND M13 MUX PM5365 TEMAP VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 2: FEBRUARY 2000 PMC-Sierra, Inc. 105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000
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SI 1360H
Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H
Contextual Info: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential
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pm8315pmc-1990495si 1360h1542h+61488h1558hpsl 26mx12mx23si 1340h
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NEC 1378h
Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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nec 1378hr5f2123ckfp1347h13f9h+6r5f21226dfpr5f21226jfpr5f2123r5f21227jfpr5f21228dfpr5f21228jfp
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145AH
Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of
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r8c/22r8c/23rej03b0097-020048-pin+10145ahma 1360h1320h1378h icr5f2122ckfpr5f2123ckfp13c4hr5f2122ajfpr5f21226dfpr5f21227dfp
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Thermologger
Abstract: 140C 140D hanna hi-1285
Contextual Info: Instruction Manual HI 140 Series NTC Thermologgers & HI 90140 Infrared Transmitter Dear Customer, Thank you for choosing a Hanna product. This manual will provide you with the necessary information for correct operation. Please read it carefully before using the logger. If you
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140ah140bh140ch140dh+9140eh140fh140gh140hhistr140r2thermologger140c140dhanna hi-1285
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EMFP RS
Abstract: mark 321f PM8315-PI 1037h 1250H 1488h MX12 MX23 PM8315 mux E1
Contextual Info: PM8315 TEMUX STANDARD PRODUCT DATASHEET PMC-1981125 ISSUE 7 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER DATASHEET PROPRIETARY AND CONFIDENTIAL ISSUE 7: MAY 2001
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13D2H
Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU
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