13S30 Search Results
13S30 Price and Stock
Samtec Inc IDSD-13-S-30.00INSULATION DISPLACEMENT TERMINAL |
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JRH ELECTRONICS 660-013NF13S3-01PROTECTIVE COVER |
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Amphenol Aerospace JT07A-10-13S(301)RECEPT |
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Amphenol Aerospace JT01RE-10-13S(304)RECEPT |
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Amphenol Aerospace JT00RE-10-13S(304)RECEPT |
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13S30 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Technical Data Sheet RF_35/05.10/6.0 Dieses Dokument ist urheberrechtlich geschützt ● This document is protected by copyright ● Rosenberger Hochfrequenztechnik GmbH & Co. KG Rosenberger RIGHT ANGLE PLUG FOR PCB HSD D4S20Y-400A5-Y All dimensions are in mm; tolerances according to ISO 2768 m-H |
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D4S20Y-400A5-Y D-84526 400A5-Z 13-s301 | |
Contextual Info: C-Press 3009 Series C-Press® Sip Socket Connector SPECIFICATIONS INSULATOR Material: Polycarbonate MATING COMPONENT TAIL REQUIREMENTS: Width: 0.381 - 0.584 mm Thickness: 0.204 - 0.40 mm Insertion depth: 4.5 mm max. Termination: Solderless press-fit TECHNICAL DATA |
OCR Scan |
48S-3009-0154 48S-3009-0154 47S-3009-0154 46S-3009-0154 45S-3009-0154 44S-3009-0154 43S-3009-0154 42S-3009-0154 41S-3009-0154 40S9S-3009-0154 | |
42181
Abstract: 121-14204 121-14207-1 kollmorgen MIL-C-28859 winchester electronics litton TBA 860 a 4514 v A1856 ipc SMB SMC
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in7-43839 42181 121-14204 121-14207-1 kollmorgen MIL-C-28859 winchester electronics litton TBA 860 a 4514 v A1856 ipc SMB SMC | |
Contextual Info: C-Press C-Press* Sip Socket Connector SPECIFICATIONS INSULATOR Material: Polycarbonate MATING COMPONENT TAIL REQUIREMENTS: Width: 0.381 -0.584 mm Thickness: 0.204 - 0.40 mm Insertion depth: 4.5 mm max. Termination: Solderless “C-Press’ press-fit TECHNICAL DATA |
OCR Scan |
48S-3009-0154 48S-3009-0154 47S-3009-0154 46S-3009-0154 45S-3009-0154 44S-3009-0154 43S-3009-0154 42S-3009-0154 41S-3009-0154 40S-3009-0154 | |
fenwal thermistor R-T curve 10AContextual Info: NTC THERMISTORS F E N W A L D E L E C T R O N IC S I N C O R P O R A T E D GLASS ENCAPSULATED CHIP SERIES FEATURES CHIP • Low cost • Rugged DO-35 glass encapsulation ■ High temp, capability 300° C ■ Delivery from stock ■Ideal for highly automated assembly |
OCR Scan |
DO-35 03LFW 135-3031FW-J01 fenwal thermistor R-T curve 10A | |
Contextual Info: Z~Communications, Inc. Z-COMMUNICATIONS *4SE J> INC ^ b b ^ lb b 0GD035Ö fl H Z C I VCO MODEL D-81444 *T-S 0-lS PAGE1 9939 Via Pasar • San Diego, California 92126 Phone 619 621-2700 FAX (619) 621-2722 P H A S E N O IS E (1 Hz B W ) (TY P ) FEATURES Exceptional Phase Noise Characteristics |
OCR Scan |
0GD035Ö D-81444 10KHz 13S30 DS-1191 | |
C-Press
Abstract: Winchester ansi unc 4-40 screw 05s300 21-s300 HE61 5-44 UNF plug IPC-D-422 09NO3
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C-Press®
Abstract: IPC-D-422 MIL-C-28859 QQ-B-620 09NO3 winchester electronics litton A1856 barrier type double row screw terminal 6-48 UNS ipc SMB SMC
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in503 C-Press® IPC-D-422 MIL-C-28859 QQ-B-620 09NO3 winchester electronics litton A1856 barrier type double row screw terminal 6-48 UNS ipc SMB SMC | |
Contextual Info: C-Press 3009 Series C-Press® Sip Socket Connector SPECIFICATIONS INSULATOR Material: Polycarbonate MATING COMPONENT TAIL REQUIREMENTS: Width: 0.381 - 0.584 mm Thickness: 0.204 - 0.40 mm Insertion depth: 4.5 mm max. Cube Contact Plating: Tin/Lead Temperature Range: |
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48S-3009-0154 21S-3009-0154 20S-3009-0154 19S-3009-0154 18S-3009-0154 17S-3009-0154 16S-3009-0154 15S-3009-0154 14S-3009-0154 13S-3009-0154 |