13APR05 Search Results
13APR05 Datasheets Context Search
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Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - ALL RIGHTS RESERVED. REVISIONS LOC DIST AG 53 LTR m 3 2 ,6 ± 0 ,2 D DESCRIPTION REVISED PER OS12 -0 5 5 0 -0 4 - DATE DWN APVD 13APR05 RR MY 40 PLACES 30.8±0.2 |
OCR Scan |
13apr0531mar200026mar99 | |
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Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. —»— LOC ALL RIGHTS RESERVED. G DIST R E V IS IO N S 86 LTR DATE OWN APVD 13APR05 JR TM DESCRIPTION REV PER ECR 0 5 - 0 0 1 4 7 9 AMP WIR E RANGE D |
OCR Scan |
13apr0531mar2000 | |
81c4256a
Abstract: VISHAY WL ZENER WL MARKING CODE VISHAY DO-219AB GZF10C GZF11C GZF12C GZF91C
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gzf91c2002/95/ec2002/96/ecdo-219ab+7 | |
BZW03C
Abstract: BZW03C10 BZW03C11 BZW03C12 BZW03C13 BZW03C6V8 BZW03C7V5 BZW03C8V2 BZW03C9V1 BZW03C43 vishay
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bzw03-series2002/95/ec2002/96/ecod-64+11 | |
S413Contextual Info: S413D Vishay Semiconductors Fast Soft Recovery Avalanche Sinterglass Diode Description Polarity: Cathode indicated by a band Features • • • • • • Hermetically sealed glass envelope Glass passivated e2 Low reverse current Miniature axial leaded |
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s413d2002/95/ec2002/96/ecdot-30b+2 | |
81c4256a
Abstract: DO-219AB GZF10C GZF11C GZF12C GZF91C
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gzf91c2002/95/ec2002/96/ecdo-219ab+6 | |
BYW32
Abstract: BYW33 BYW34 BYW35 BYW36
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byw322002/95/ec2002/96/ecod-57+7 | |
BYV37
Abstract: BYV38 16343
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byv37byv382002/95/ec2002/96/ec+3 | |
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Contextual Info: BYW72 / 73 / 74 / 75 / 76 Vishay Semiconductors Fast Avalanche Sinterglass Diode Features • • • • Glass passivated junction Hermetically sealed package Low reverse current Soft recovery characteristics e2 949588 • Lead Pb -free component • Component in accordance to RoHS 2002/95/EC |
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byw722002/95/ec2002/96/ecod-64+5 | |
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Contextual Info: BYT54. Vishay Semiconductors Fast Avalanche Sinterglass Diode Features • • • • • • Glass passivated junction Hermetically sealed package e2 Low reverse current Soft recovery characteristics Lead Pb -free component Component in accordance to RoHS 2002/95/EC |
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byt542002/95/ec2002/96/ecod-57+6 | |
BYT56 diode
Abstract: BYT56
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byt562002/95/ec2002/96/ecod-64+7 | |
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Contextual Info: BZG05C-Series Vishay Semiconductors Zener Diodes Features • • • • • • • Glass passivated junction High reliability e3 Voltage range 3.3 V to 100 V Fits onto 5 mm SMD footpads Wave and reflow solderable Lead Pb -free component Component in accordance to RoHS 2002/95/EC |
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bzg05c-series2002/95/ec2002/96/ecdo-214ac+2 | |
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Contextual Info: BYV12 / 13 / 14 / 15 / 16 Vishay Semiconductors Fast Avalanche Sinterglass Diode Features • • • • • • Glass passivated junction Hermetically sealed package e2 Soft recovery characteristic Low reverse current Lead Pb -free component Component in accordance to RoHS 2002/95/EC |
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byv122002/95/ec2002/96/ecod-57+5 | |
BYT52JContextual Info: BYT52. Vishay Semiconductors Fast Avalanche Sinterglass Diode Features • • • • • • Glass passivated junction Hermetically sealed package e2 Low reverse current Soft recovery characteristics Lead Pb -free component Component in accordance to RoHS 2002/95/EC |
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byt522002/95/ec2002/96/ecod-57+6 | |
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ILBB-0603Contextual Info: ILBB-0603 Vishay Dale Multilayer Ferrite Beads FEATURES • High reliability. • Surface mountable. • Magnetically self shielded. • Nickel barrier plating virtually eliminates silver migration. • 100 % Lead Pb -free and RoHS compliant. MECHANICAL SPECIFICATIONS* |
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ilbb-060308-apr-05 | |
s4 markingContextual Info: SL02 / 03 / 04 Vishay Semiconductors Small Signal Schottky Diodes Features • • • • • For surface mounted applications Low-profile package e3 Ideal for automated placement Low power loss, high efficiency High temperature soldering: 260 °C/10 seconds at terminals |
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2002/95/ec2002/96/ecdo-219absl02-gs18+7 | |
VISHAY diode MARKING ED
Abstract: DO-219AB ES07B ES07D vishay MARKING UM
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es07bes07d2002/95/ec2002/96/ec+6 | |
RS07DGS08Contextual Info: RS07B / 07D / 07G / 07J Vishay Semiconductors Small Signal Fast Switching Diode, High Voltage Features • • • • • For surface mounted applications Low profile package e3 Ideal for automated placement Glass passivated High temperature soldering: 260 °C/ 10 seconds at terminals |
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rs07b2002/95/ec2002/96/ecdo-219ab+6 | |
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Contextual Info: BYV37 / BYV38 Vishay Semiconductors Fast Avalanche Sinterglass Diode Features • • • • • • Glass passivated junction Hermetically sealed package e2 Low reverse current Soft recovery characteristics Lead Pb -free component Component in accordance to RoHS 2002/95/EC |
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byv37byv382002/95/ec2002/96/ec+2 | |
BYW32
Abstract: BYW32 diode
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byw322002/95/ec2002/96/ecod-57+6 | |
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Contextual Info: BY228 Vishay Semiconductors Standard Avalanche Sinterglass Diode Features • • • • Glass passivated junction Hermetically sealed package e2 Lead Pb -free component Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC 949588 Applications Mechanical Data |
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by2282002/95/ec2002/96/ecod-64+3 | |
BYV38
Abstract: 16343 BYV37
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byv37byv382002/95/ec2002/96/ec+3 | |
BYT77
Abstract: BYT78
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byt77byt782002/95/ec2002/96/ec+3 | |
diode sod57
Abstract: BYT52J SOD-57 BYT52 BYT52A BYT52B BYT52D BYT52G BYT52K BYT52M
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byt522002/95/ec2002/96/ecod-57+10 | |