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Catalog Datasheet	Type	Document Tags	PDF
2N6925 Abstract: TO3 package 2n6924 Contextual Info: O General Semiconductor Industries, Inc. * NPN TRANSISTOR CHIP " Typical Device Types: 2N6924, 2N6925 37 " 35 AMP Bonding Pad Areas Fast Switching Base 1 135x28 mils Emitter (1)49 x 30 mils Typical Switching Front Metallization: Aluminum Back Metallization:	OCR Scan	2n6924 2n6925 135x28 20nsec +590nsec 1300nsec 150nsec 50mackage to3 package	PDF

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2N6925

Abstract: TO3 package 2n6924
Contextual Info: O General Semiconductor Industries, Inc. * NPN TRANSISTOR CHIP " Typical Device Types: 2N6924, 2N6925 37 " 35 AMP Bonding Pad Areas Fast Switching Base 1 135x28 mils Emitter (1)49 x 30 mils Typical Switching Front Metallization: Aluminum Back Metallization:

OCR Scan

2n6924 2n6925 135x28 20nsec +5

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