128P6 Search Results

QFP128-P-2828-0

Abstract: QFP128 QFP-128 128P6
Contextual Info: 128P6-C Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D b2 ME 97 128 1 96 I2 Symbol HE E Recommended Mount Pad 65 32 33 64 A c A2 L1 y F b A1 e L Detail F A A1 A2 b c D E

LQFP128

Abstract: LQFP128-P-1420-0
Contextual Info: 128P6D-D Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g MD e JEDEC Code – Lead Material Cu Alloy HD 128 102 b2 103 ME D 1 l2 Symbol HE E Recommended Mount Pad 38 65 64 39 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E

LQFP128

Abstract: P-LQFP-128 PLQP0128KB-A ZD 103 128P6Q-A PACKAGE LQFP128
Contextual Info: JEITA Package Code P-LQFP128-14x20-0.50 RENESAS Code PLQP0128KB-A Previous Code 128P6Q-A MASS[Typ.] 0.9g HD *1 D 102 65 103 64 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. bp E c *2 HE c1 b1 Reference

128P6

Abstract: QFP128 QFP128-P-2828-0
Contextual Info: 128P6-A Plastic 128pin 28✕28mm body QFP EIAJ Package Code QFP128-P-2828-0.80 Weight g 4.49 JEDEC Code – Lead Material Alloy 42 MD e HD D ME 97 b2 128 1 96 I2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 65 32 33 64 A c A2 L1 y F b

LQFP Package 128-pin

Abstract: NQPACK128RD 128-PIN HQPACK128RD M3T-F160-128NRD YQPACK128RD 128P6Q-A
Contextual Info: M3T-F160-128NRD Converter for Connecting 160-core Flexible Board FLX160 to 128-pin 0.5mm-pitch LQFP External View and Dimensions Function The M3T-F160-128NRD is a converter for connecting the FLX160 160-core flexible board to a foot pattern of a 128-pin 0.5mm-pitch LQFP 128P6Q-A . This converter can be used

LQFP128

Abstract: LQFP128-P-1420-0 128P6D-A D1102
Contextual Info: 128P6D-A Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g 0.85 Lead Material Alloy 42 MD e JEDEC Code – HD 103 b2 128 ME D 1 102 I2 E HE Recommended Mount Pad Symbol 65 38 39 64 L1 A F A1 c A2 e b y L Detail F A A1 A2 b

LQFP128

Abstract: LQFP128-P-1420-0
Contextual Info: 128P6D-C Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD b2 128 103 1 ME D 102 l2 HE D Recommended Mount Pad Symbol 65 38 39 64 A L1 F b A1 c A2 e y L Detail F A A1 A2 b c D E

M3062

Abstract: TA2140 csc 2313 m3062lfgpgp u3
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

7335B

Abstract: NQPACK128RD
Contextual Info: M3T-F160-128NRD Converter Board for Connecting FLX160 to 128-pin 0.5-mm-pitch LQFP User's Manual Keep safety first in your circuit designs! • Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products better and more

Contextual Info: Datasheet M16C/65C Group RENESAS MCU 1. R01DS0015EJ0100 Rev.1.00 Feb 07, 2011 Overview 1.1 Features The M16C/65C Group microcomputer MCU incorporates the M16C/60 Series CPU core and flash memory, employing sophisticated instructions for a high level of efficiency. This MCU has 1 MB of address

R5F3650NNFB

Abstract: R5F3650NDFA 13000H cec p77
Contextual Info: Datasheet M16C/65 Group RENESAS MCU 1. R01DS0031EJ0200 Rev.2.00 Feb 07, 2011 Overview 1.1 Features The M16C/65 Group microcomputer MCU incorporates the M16C/60 Series CPU core and flash memory, employing sophisticated instructions for a high level of efficiency. This MCU has 1 MB of address

M30622MEP-XXXGP

Abstract: M30620FCPFP M30622F8PGP M30622F8PFP
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

PC14

Abstract: 2ah 2037 philips ak 141-15
Contextual Info: REJ09B0126-0101Z M16C/6N Group 16 M16C/6NL, M16C/6NN Hardware Manual RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / M16C/60 SERIES Before using this material, please visit our website to verify that this is the most updated document available. Rev. 1.01

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
Contextual Info: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

M30622F8PGP

Abstract: M16C/62P M30622F8PFP M16C M30626FHPFP hardware manual op amp marking P3 M30622M6P-XXXFP M30622M6P-XXXGP M30622M8P-XXXFP M30622M8P-XXXGP M30623M6P-XXXGP
Contextual Info: M16C/62P Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0230Z Rev.2.30 Sep 01, 2004 1. Overview The M16C/62P Group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the highperformance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,

X00000002

Abstract: CM211
Contextual Info: REJ09B0016-0110Z 16 M16C/62 Group M16C/62P Hardware Manual RENESAS 16-BIT CMOS SINGLE-CHIP MICROCOMPUTER M16C FAMILY / M16C/60 SERIES Before using this material, please visit the our website to confirm that this is the most current document available. Rev. 1.10

M30622F8PGP

Abstract: M30622MEP-XXXGP M30622F8PFP M30620FCPFP
Contextual Info: M16C/62 Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0200Z Rev.2.00 Oct. 29, 2003 1. Overview The M16C/62 group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,

DIN 41612 connector 24 pin

Abstract: 107109
Contextual Info: DIN SPECIFICATIONS Series DIN 41612 Style 6033 6043 B&C Q&R GENERAL No. of Contacts 32,48,64,96 20,32,48,96 Temperature Range -60°C to +140°C -65°C to +140°C ELECTRICAL DATA Current Rating 1 Amp @ 70°C 1 Amp @ 70°C Contact Resistance 20 Milliohms Max

42P-6063-0731-0

Abstract: dacron
Contextual Info: DIN SPECIFICATIONS Series DIN 41612 Style 6033 6043 B&C Q&R GENERAL No. of Contacts 32,48,64,96 20,32,48,96 Temperature Range -60°C to +140°C -65°C to +140°C ELECTRICAL DATA Current Rating 1 Amp @ 70°C 1 Amp @ 70°C Contact Resistance 20 Milliohms Max

SRF 7016

Abstract: M30624FGPFP M30624FGPGP 100P6S-A 10MHZ 24MHZ TA40 8259ER SIM 300 AT COMMANDS
Contextual Info: er nt Preliminary Specifications Rev.1.0 Und opme l e v e Specifications in this manual are tentative and subject to change. d Overview Mitsubishi microcomputers M16C / 62P Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Overview The M16C/62P group of single-chip microcomputers are built using the high-performance silicon gate

100MHZ

Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,

ic tlp 759

Abstract: SL-BC050515TJ-1 JHB-TQ121214-M L196-49 L196-65A PTB54C SL-BG060615TJ-2 SL-BG060615TJ-1 ST-TQ070710TJ-1 PVQN0020KB-A
Contextual Info: Unit:mm The pin1 is located in the hatching portion Note : Numbers in parentheses are the numbers of Ics contained in five trays per inner box, and those without parentheses are the numbers of Ics contained in eight or nine trays per inner box.

R5F72543

Abstract: r5f61725 SH7724 R5F2136Can R5F72543RKBGV R5F35L83 R8A77240D500BG 2332 prom R5F70834AD80FTV R5F70835
Contextual Info: Renesas MPU & MCU General Catalog 2009.10 2009.10 Renesas MPU & MCU General Catalog Renesas MPU & MCU General Catalog RJJ01B0001-1200 2009. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon 11.1 Renesas Technology www.renesas.com