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    11SMN Search Results

    11SMN Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    SCANSTA111SM/NOPB
    Texas Instruments Enhanced SCAN Bridge Multidrop Addressable IEEE 1149.1 (JTAG) Port 49-NFBGA -40 to 85 Visit Texas Instruments Buy
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    11SMN Price and Stock

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    Rochester Electronics LLC NB4N11SMNG

    IC XLTR MS UNIDIR 16-QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey NB4N11SMNG Tube 30,032 52
    • 1 -
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    • 100 $5.74
    • 1000 $5.74
    • 10000 $5.74
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    Rochester Electronics LLC NB4N11SMNR2G

    IC XLTR MS UNIDIR 16-QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey NB4N11SMNR2G Bulk 5,721 52
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    • 100 $5.74
    • 1000 $5.74
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    onsemi NB6N11SMNR2G

    IC CLK BUFFER 1:2 2GHZ 16QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey () NB6N11SMNR2G Cut Tape 4,264 1
    • 1 $12.58
    • 10 $8.67
    • 100 $6.49
    • 1000 $6.23
    • 10000 $6.23
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    NB6N11SMNR2G Digi-Reel 4,264 1
    • 1 $12.58
    • 10 $8.67
    • 100 $6.49
    • 1000 $6.23
    • 10000 $6.23
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    NB6N11SMNR2G Reel 3,000 3,000
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    • 10000 $6.62
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    Avnet Americas NB6N11SMNR2G Reel 23 Weeks 3,000
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    • 10000 $6.73
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    Mouser Electronics NB6N11SMNR2G
    • 1 $12.58
    • 10 $9.23
    • 100 $8.54
    • 1000 $6.50
    • 10000 $6.23
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    Newark () NB6N11SMNR2G Cut Tape 297 1
    • 1 $12.58
    • 10 $8.67
    • 100 $6.53
    • 1000 $6.23
    • 10000 $6.23
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    NB6N11SMNR2G Reel 3,000
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    • 10000 $5.93
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    Bristol Electronics () NB6N11SMNR2G 3,324
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    NB6N11SMNR2G 83
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    Avnet Silica NB6N11SMNR2G 24 Weeks 3,000
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    Chip Stock NB6N11SMNR2G 3,122
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    EBV Elektronik NB6N11SMNR2G 25 Weeks 3,000
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    Master Electronics NB6N11SMNR2G 1,040
    • 1 -
    • 10 $9.39
    • 100 $9.39
    • 1000 $6.02
    • 10000 $5.93
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    Rochester Electronics LLC SCANSTA111SM-NS

    MICROPROCESSOR CIRCUIT, CMOS, PB
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SCANSTA111SM-NS Bulk 503 22
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    • 100 $13.70
    • 1000 $13.70
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    onsemi NB6L11SMNG

    IC CLK BUFFER 1:2 2GHZ 16QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey NB6L11SMNG Tube 388 1
    • 1 $11.38
    • 10 $8.91
    • 100 $8.30
    • 1000 $7.06
    • 10000 $6.93
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    Avnet Americas NB6L11SMNG Tube 59 18 Weeks 123
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    Mouser Electronics NB6L11SMNG 495
    • 1 $11.38
    • 10 $8.92
    • 100 $7.55
    • 1000 $7.18
    • 10000 $6.66
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    Newark NB6L11SMNG Bulk 117 1
    • 1 $5.94
    • 10 $5.94
    • 100 $5.94
    • 1000 $5.94
    • 10000 $5.94
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    RS NB6L11SMNG Bulk 2
    • 1 -
    • 10 $10.81
    • 100 $10.24
    • 1000 $10.24
    • 10000 $10.24
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    TME NB6L11SMNG 1
    • 1 $10.83
    • 10 $8.47
    • 100 $7.26
    • 1000 $6.91
    • 10000 $6.42
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    Avnet Asia NB6L11SMNG 23 Weeks 123
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    Avnet Silica NB6L11SMNG 24 Weeks 123
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    Chip Stock NB6L11SMNG 393
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    EBV Elektronik NB6L11SMNG 25 Weeks 123
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    Win Source Electronics NB6L11SMNG 268
    • 1 -
    • 10 $11.44
    • 100 $9.47
    • 1000 $9.47
    • 10000 $9.47
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    11SMN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: 971160151 971160151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 16.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 7.0mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400


    Original
    11SMn PDF

    Contextual Info: 971080151 971080151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 8.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 5.5mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400


    Original
    11SMn PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: 970230321 L [mm] C [mm] M SW 23.0 7.0 M3 5.5 Material: 11SMnPb30 1.0718 970230321 Surface: zinc-plated (A3F) STEEL SPACER internal/internal Drawn Mark Wirth 2012-11-22 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400


    Original
    11SMnPb30 PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION


    Original
    11SMnPB30 2768m PDF