11SMN Search Results
11SMN Result Highlights (1)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| SCANSTA111SM/NOPB | Texas Instruments | Enhanced SCAN Bridge Multidrop Addressable IEEE 1149.1 (JTAG) Port 49-NFBGA -40 to 85 |
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11SMN Price and Stock
onsemi NB6L11SMNR2GClock / Data Fanout Buffer, 1:2 AnyLevel™ Input, LVDS, 2.5 V - Tape and Reel (Alt: NB6L11SMNR2G) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6L11SMNR2G | Tape & Reel | 3,000 |
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NB6L11SMNR2G | Tape & Reel | 3,000 |
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NB6L11SMNR2G | 3,000 |
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NB6L11SMNR2G | 36 Weeks | 3,000 |
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NB6L11SMNR2G | 37 Weeks | 3,000 |
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NB6L11SMNR2G | 12,000 |
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onsemi NB6N11SMNR2GClock / Data Fanout Buffer, 1:2 AnyLevel™ Input, LVDS, 3.3 V - Tape and Reel (Alt: NB6N11SMNR2G) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6N11SMNR2G | Tape & Reel | 55 Weeks | 3,000 |
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NB6N11SMNR2G | Tape & Reel | 1,008 | 10 |
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| NB6N11SMNR2G | Cut Tape | 1,008 | 1 |
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| NB6N11SMNR2G | Tape & Reel | 3,000 |
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| NB6N11SMNR2G | Cut Tape | 3,000 |
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NB6N11SMNR2G | 3,368 |
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NB6N11SMNR2G | 36 Weeks | 3,000 |
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NB6N11SMNR2G | 33 Weeks | 3,000 |
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NB6N11SMNR2G | 50 |
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onsemi NB6L11SMNGEVBEvaluation Board For NB6L11SMMNG Differential 1 To 2 Clock Or Data Receiver - Boxed Product (Development Kits) (Alt: NB6L11SMNGEVB) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6L11SMNGEVB | Box | 2 |
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NB6L11SMNGEVB | Bulk | 1 |
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NB6L11SMNGEVB | 1 | 1 |
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NB6L11SMNGEVB | 4,218 |
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onsemi NB6N11SMNGEVBEvaluation Board For NB6N11SMNG, Differential 1 To 2 Clock Or Data Receiver - Boxed Product (Development Kits) (Alt: NB6N11SMNGEVB) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6N11SMNGEVB | Box | 2 |
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NB6N11SMNGEVB | Bulk | 1 |
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NB6N11SMNGEVB | 1 | 1 |
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NB6N11SMNGEVB | 53 Weeks | 1 |
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onsemi NB6L11SMNGFanout Buffer IC, Translator, 2 GHz, CML, LVCMOS, LVDS, LVPECL, LVTTL , 2 Outputs, 2.5 V, QFN-16 - Rail/Tube (Alt: NB6L11SMNG) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6L11SMNG | Tube | 65 Weeks | 1 |
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NB6L11SMNG | Bulk | 6 | 1 |
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NB6L11SMNG | Bulk | 2 |
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NB6L11SMNG | 1 |
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NB6L11SMNG | 65 Weeks | 123 |
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NB6L11SMNG | 29 Weeks | 123 |
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NB6L11SMNG | 30 Weeks | 123 |
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NB6L11SMNG |
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NB6L11SMNG | 6,710 |
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11SMN Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: 971160151 971160151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 16.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 7.0mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
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11smn | |
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Contextual Info: 971080151 971080151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 8.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 5.5mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
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11smn | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: 970230321 L [mm] C [mm] M SW 23.0 7.0 M3 5.5 Material: 11SMnPb30 1.0718 970230321 Surface: zinc-plated (A3F) STEEL SPACER internal/internal Drawn Mark Wirth 2012-11-22 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
Original |
11smnpb30 | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11smnpb302768m | |