11SMN Search Results
11SMN Result Highlights (1)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| SCANSTA111SM/NOPB |
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Enhanced SCAN Bridge Multidrop Addressable IEEE 1149.1 (JTAG) Port 49-NFBGA -40 to 85 |
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11SMN Price and Stock
Rochester Electronics LLC NB4N11SMNGIC XLTR MS UNIDIR 16-QFN |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB4N11SMNG | Tube | 30,032 | 52 |
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Rochester Electronics LLC NB4N11SMNR2GIC XLTR MS UNIDIR 16-QFN |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB4N11SMNR2G | Bulk | 5,721 | 52 |
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onsemi NB6N11SMNR2GIC CLK BUFFER 1:2 2GHZ 16QFN |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6N11SMNR2G | Cut Tape | 4,264 | 1 |
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NB6N11SMNR2G | Reel | 23 Weeks | 3,000 |
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NB6N11SMNR2G |
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NB6N11SMNR2G | Cut Tape | 297 | 1 |
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NB6N11SMNR2G | 3,324 |
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NB6N11SMNR2G | 24 Weeks | 3,000 |
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NB6N11SMNR2G | 3,122 |
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NB6N11SMNR2G | 25 Weeks | 3,000 |
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NB6N11SMNR2G | 1,040 |
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Rochester Electronics LLC SCANSTA111SM-NSMICROPROCESSOR CIRCUIT, CMOS, PB |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SCANSTA111SM-NS | Bulk | 503 | 22 |
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onsemi NB6L11SMNGIC CLK BUFFER 1:2 2GHZ 16QFN |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6L11SMNG | Tube | 388 | 1 |
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NB6L11SMNG | Tube | 59 | 18 Weeks | 123 |
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NB6L11SMNG | 495 |
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NB6L11SMNG | Bulk | 117 | 1 |
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NB6L11SMNG | Bulk | 2 |
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NB6L11SMNG | 1 |
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NB6L11SMNG | 23 Weeks | 123 |
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NB6L11SMNG | 24 Weeks | 123 |
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NB6L11SMNG | 393 |
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NB6L11SMNG | 25 Weeks | 123 |
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NB6L11SMNG | 268 |
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11SMN Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: 971160151 971160151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 16.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 7.0mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
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11SMn | |
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Contextual Info: 971080151 971080151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 8.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 5.5mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
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11SMn | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: 970230321 L [mm] C [mm] M SW 23.0 7.0 M3 5.5 Material: 11SMnPb30 1.0718 970230321 Surface: zinc-plated (A3F) STEEL SPACER internal/internal Drawn Mark Wirth 2012-11-22 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
Original |
11SMnPb30 | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
|
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |