11SMN Search Results
11SMN Result Highlights (1)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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SCANSTA111SM/NOPB |
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Enhanced SCAN Bridge Multidrop Addressable IEEE 1149.1 (JTAG) Port 49-NFBGA -40 to 85 |
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11SMN Price and Stock
onsemi NB6L11SMNR2GIC CLK BUFFER 1:2 2GHZ 16QFN |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6L11SMNR2G | Cut Tape | 457 | 1 |
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NB6L11SMNR2G | Reel | 18 Weeks | 3,000 |
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NB6L11SMNR2G | 1,592 |
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NB6L11SMNR2G | Reel | 3,000 |
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NB6L11SMNR2G | 3,000 |
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NB6L11SMNR2G | 3,676 |
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NB6L11SMNR2G | 19 Weeks | 3,000 |
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NB6L11SMNR2G | 20 Weeks | 3,000 |
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NB6L11SMNR2G | 12,000 |
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onsemi NB6L11SMNGIC CLK BUFFER 1:2 2GHZ 16QFN |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6L11SMNG | Tube | 275 | 1 |
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NB6L11SMNG | Tube | 103 | 18 Weeks | 123 |
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NB6L11SMNG | 651 |
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NB6L11SMNG | Bulk | 3 | 1 |
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NB6L11SMNG | 1 |
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NB6L11SMNG | 19 Weeks | 123 |
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NB6L11SMNG | 20 Weeks | 123 |
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NB6L11SMNG | 268 |
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onsemi NB6N11SMNGEVBEVAL BOARD FOR NB6N11S |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6N11SMNGEVB | Bulk | 1 | 1 |
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NB6N11SMNGEVB | Box | 2 |
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NB6N11SMNGEVB |
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NB6N11SMNGEVB | Bulk | 1 |
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NB6N11SMNGEVB | 1 |
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NB6N11SMNGEVB | 53 Weeks | 1 |
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onsemi NB6L11SMNGEVBEVAL BOARD FOR NB6L11S |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB6L11SMNGEVB | Box | 1 | 1 |
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NB6L11SMNGEVB | Box | 2 |
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NB6L11SMNGEVB |
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NB6L11SMNGEVB | Bulk | 1 |
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NB6L11SMNGEVB | 1 |
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Rochester Electronics LLC NB4N11SMNGIC XLTR MS UNIDIR 16-QFN |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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NB4N11SMNG | Tube | 63 |
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11SMN Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: 971160151 971160151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 16.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 7.0mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
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11SMn | |
Contextual Info: 971080151 971080151 Material: 11SMn Pb30 STEEL SPACER, external/internal L = 8.0mm l3 = 6.0mm G1,G2 = M2,5 l2 = 5.5mm SW5 Surface: zinc plated Drawn Mark Wirth 2009-12-09 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
Original |
11SMn | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
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Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: 970230321 L [mm] C [mm] M SW 23.0 7.0 M3 5.5 Material: 11SMnPb30 1.0718 970230321 Surface: zinc-plated (A3F) STEEL SPACER internal/internal Drawn Mark Wirth 2012-11-22 Würth Elektronik eiSos GmbH & Co KG D – 74638 Waldenburg Max-Eyth-Straße 1 Tel.: 0049 7942-945-0 / Fax: 0049 7942-945-400 |
Original |
11SMnPb30 | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m | |
Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Value Surface Tin plated Material 11SMnPB30 Thread M3 Tightening torque 0.5 Nm Solder Cream Thickness 150 µm Packaging Reel C Stencil suggestion: E General information: DESCRIPTION |
Original |
11SMnPB30 2768m |