100MI Search Results

PGA-208c-a02

Abstract: PGA209-C-S17U-1
Contextual Info: PIN GRID ARRAY PACKAGE 208 PIN CERAMIC PGA-208C-A02 EIAJ code : ∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100mil Pin matrix 17 Sealing method Metal seal (PGA-208C-A02) 208-pin ceramic PGA (PGA-208C-A02)

a06 transistor

Abstract: 179-PIN
Contextual Info: PIN GRID ARRAY PACKAGE 179 PIN CERAMIC PGA-179C-A06 179-pin ceramic PGA Lead pitch 100mil Pin matrix 16 Sealing method Metal seal PGA-179C-A06 179-pin ceramic PGA (PGA-179C-A06) 2.54 ± 0.25 (.100 ± .010) 35.99 (1.417) DIA TYP 1.27 (.050) DIA TYP (4 PLCS)

149C

Contextual Info: PIN GRID ARRAY PACKAGE 149 PIN CERAMIC PGA-149C-A03 EIAJ code : HPGA149-C-S15D-2 149-pin ceramic PGA Lead pitch 100mil Pin matrix 15 Sealing method Metal seal PGA-149C-A03 149-pin ceramic PGA (PGA-149C-A03) 2.54 ± 0.25 (.100 ± .010) 36.00 (1.417) DIA 0.46 ± 0.05

Contextual Info: PIN GRID ARRAY PACKAGE 149 PIN CERAMIC PGA-149C-A09 EIAJ code : HPGA149-C-S15D-3 Lead pitch 100mil Pin matrix 15 Sealing method Metal seal 149-pin ceramic PGA PGA-149C-A09 149-pin ceramic PGA (PGA-149C-A09) 2.54 ± 0.25 (.100 ± .010) 0.46 +– 0.05 0.08

Contextual Info: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A05 256-pin ceramic PGA Lead pitch 100mil Pin matrix 19 Sealing method Metal seal PGA-256C-A05 256-pin ceramic PGA (PGA-256C-A05) 3.40 +– 0.41 0.36 (.134 +– .016 .014 ) 8.89 (.350) MAX 1.27 ± 0.25 (.050 ± .010)

PGA-121C-A02

Contextual Info: PIN GRID ARRAY PACKAGE 121 PIN CERAMIC PGA-121C-A02 121-pin ceramic PGA Lead pitch 100mil Pin matrix 13 Sealing method Metal seal PGA-121C-A02 121-pin ceramic PGA (PGA-121C-A02) 0.46 +– 0.05 0.08 DIA (.018 +– .002 .003 ) 2.54 ± 0.25 (.100 ± .010) 27.00 (1.063)

PGA089-C-S12U-2

Abstract: 88PIN
Contextual Info: PIN GRID ARRAY PACKAGE 88 PIN CERAMIC PGA-88C-A02 EIAJ code : ∗PGA089-C-S12U-2 88-pin ceramic PGA Number of pins 89 pins includes extra index pin Lead pitch 100mil Pin matrix 12 Sealing method Metal seal (PGA-88C-A02) 88-pin ceramic PGA (PGA-88C-A02) 0.46 +– 0.18

PGA179-C-S15U-2

Contextual Info: PIN GRID ARRAY PACKAGE 179 PIN CERAMIC PGA-179C-A03 EIAJ code : ∗PGA179-C-S15U-2 179-pin ceramic PGA Lead pitch 100mil Pin matrix 15 Sealing method Metal seal PGA-179C-A03 179-pin ceramic PGA (PGA-179C-A03) 2.54±0.25 (.100±.010) 35.56(1.400) REF 1.27(.050)TYP DIA

PGA-299C-A01

Abstract: PGA299-C-S20D-1
Contextual Info: PIN GRID ARRAY PACKAGE 299 PIN CERAMIC PGA-299C-A01 EIAJ code : ∗PGA299-C-S20D-1 299-pin ceramic PGA Lead pitch 100mil Pin matrix 20 Sealing method Metal seal PGA-299C-A01 299-pin ceramic PGA (PGA-299C-A01) 2.41 ± 0.10 (.095 ± .004) 1.65 ± 0.10 (.065 ± .004)

Contextual Info: PIN GRID ARRAY PACKAGE 80 PIN CERAMIC PGA-80C-A01 EIAJ code : HPGA080-C-S12D-1 80-pin ceramic PGA Lead pitch 100mil Pin matrix 12 Sealing method Metal seal PGA-80C-A01 80-pin ceramic PGA (PGA-80C-A01) 2.54±0.25 (.100±.010) 27.00(1.063)DIA 27.94(1.100)

FM20

Abstract: FN812
Contextual Info: Power Transistor FN812 ICBO IEBO VCEO hFE VCE sat (Ta=25ºC) Unit µA µA V Ratings 10max 10max 100min 70min 0.3max External Dimensions FM20 (full-mold) 10.0 V a b Typical Switching Characteristics VCC (V) 12 RL (Ω) 4 IC (A) 3 VBB1 (V) 10 VBB2 (V) –5

Contextual Info: 5/U3:/NPN=*ffiÄ*iflBh5:/Stt9 G-TR 2SD SILICON NPN TRIPLE DIFFUSED MESA TRANSISTOR G-TR ) I Is i * i TENTATIVE INDUSTRIAL APPLICATIONS O * 1 / ] ^ -f ? o High Power Switching Applications Unit in mm H f e = 100MIN. ' ( I q — 400A) Battery Car üse M A X I M U M RATIN GS ( T c = 2 5 t )

Contextual Info: Equivalent circuit SAH02 2 1 Silicon PNP Epitaxial Planar Transistor with Shottky Barrier Diode µA IEBO VEB=–10V –10max µA V BR CEO IC=–10mA –30min V ICBO VCEO –30 V VEBO –10 V IC –3 A hFE1 VCE=–2V, IC=–1A 100min IB –0.5 A hFE2 VCE=–2V, IC=–0.5A

EPA120B-100P

Abstract: 100MIL
Contextual Info: EPA120B-100P High Efficiency Heterojunction Power FET UPDATED 01/13/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +29.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1200 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION

Resistance

Abstract: AC-71
Contextual Info: aL A/D ELECTRONICS, INC 5P DIN SOCKET: Insulation Resistance: 100Mi at 500 V.D.C D ielectric Strength: 1,000V A.C.71 Minute C o n tact Resistance: 20mC Maximum. Rating: 100V A.C. 2A iti f i r ^ ¿o o j A D S -125 ^fsn C R T SOCKET: Contact Resistance: 30mfl M AX

EPA160A

Abstract: 9018 transistor EPA160A-100P 100MIL
Contextual Info: EPA160A-100P High Efficiency Heterojunction Power FET UPDATED 02/15/2005 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +31.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1600 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION

MA 7824

Abstract: EPA120B-100P 100MIL
Contextual Info: EPA120B-100P High Efficiency Heterojunction Power FET UPDATED 10/30/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +29.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1200 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION

100MIL

Abstract: GaAs FET EFA025A
Contextual Info: EFA025A-100P Low Distortion GaAs Power FET UPDATED 11/17/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +21.0dBm TYPICAL OUTPUT POWER 9.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 250 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION ADVANCED EPITAXIAL HETEROJUNCTION

DIP-24P-M04

Contextual Info: SLIM DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M04 EIAJ code : ∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20 30.28 –0.30 +.008 1.192 –.012

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M05 EIAJ code : ∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30 +.008 1.407 –.012 INDEX-1

DIP-14P-M02

Abstract: DIP14-P
Contextual Info: DUAL IN-LINE PACKAGE 14 PIN PLASTIC DIP-14P-M02 EIAJ code : ∗DIP014-P-0300-1 14-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-14P-M02 14-pin plastic DIP (DIP-14P-M02) +0.20 19.55 –0.30 +.008 .770 –.012 INDEX-1

Contextual Info: DUAL IN-LINE PACKAGE 40 PIN PLASTIC DIP-40P-M02 EIAJ code : ∗DIP040-P-0600-2 40-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-40P-M02 40-pin plastic DIP (DIP-40P-M02) +0.20 52.40 –0.30 +.008 2.063 –.012 INDEX-1

DIP-20P-M02

Contextual Info: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M02 EIAJ code : ∗DIP020-P-0300-2 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M02 20-pin plastic DIP (DIP-20P-M02) +0.20 24.64 –0.30 .970 +.008 –.012 INDEX-1

34036

Contextual Info: DUAL IN-LINE PACKAGE 42 PIN CERAMIC DIP-42C-A03 EIAJ code : WDIP042-C-0600-1 42-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-42C-A03 42-pin ceramic DIP (DIP-42C-A03) 53.34±0.51 (2.100±0.20) 8.50(.335)DIA. TYP R1.27(.050)