100 PIN WQFN Search Results

100 pin wqfn

Abstract: WQFN LA014
Contextual Info: UNIT : mm 335±1.0 23.5±1.0 288±1.0 16 27.5±0.5 137.5±1.0 180±1.0 21.25±1.0 32±0.5 16 25.5 5 25.5 Applied Package Quantity pcs 64 pin WQFN MAX. 60 Material 80 pin WQFN MAX. 60 Heat Proof Temp. 100 pin WQFN MAX. 60 Surface resistance Tray LA-014 Carbon PVC

Contextual Info: 100 PIN CERAMIC WQFN A K B C U1 D U T Q S W 100 I M H 1 F G E J Z X100KL-65A NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 20.6 ± 0.27 0.811 ± 0.011 B

65A1

Abstract: 100 pin wqfn
Contextual Info: Packing Name NEC Tray LA-014 100 pin WQFN A R B J Q S H I M U1 C D T 100 1 W K U G F Z NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. NEC CODE X100KL-65A1 EIAJ CODE Weight (Reference Value)

Contextual Info: 100 PIN CERAMIC WQFN A R B J Q S H I M U1 C D T 100 1 W K U G F Z NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 20.6±0.25 0.811±0.010 B 19.0 0.748 C 13.6

Contextual Info: 100 PIN CERAMIC WQFN A B Q D C K T S W 100 H U I M G F E J Z X100KW-65A-1 NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 20.6 ± 0.4 0.811 ± 0.016 B 19.0

100 pin wqfn

Contextual Info: Packing Name NEC Tray LA-014 100 pin WQFN A K B T Q C D U U1 S W 100 H I M 1 E F G J Z X100KL-65A NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. NEC CODE X100KL-65A EIAJ CODE Weight (Reference Value)

100 pin wqfn

Contextual Info: Packing Name NEC Tray LA-014 100 pin WQFN A B Q D C K T S W 100 H U I M G E F J Z X100KW-65A-1 NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. NEC CODE X100KW-65A-1 EIAJ CODE Weight (Reference Value)

100-PIN PLASTIC LQFP NEC

Abstract: nec 100 pin l7170
Contextual Info: IVEC tfPD78P0308Y PIN CONFIGURATIONS Top View (t) Normal operating mode • 100-pin plastic LQFP (fine pitch) (14 x 14 mm) pPD78P0308YGC-8EU h h S X X > X W _ X > æ 87 86 85 84 83 82 81 80 79 78 77 76 75 P11/ANI1 P12/ANI2 P13/ANI3 O P14/ANI4 P15/ANI5 O

nec 100 pin

Contextual Info: 10. PACKAGE DRAWINGS 100 PIN PLASTIC LQFP FINE PITCH (14x14) -A-B- HHHRRflflBHflflRIIHHRBBHflHHRFIH" | /75 76 51 \JJ 50 EE zn 33 detail of lead end az CLZ C D EC a= az zn m 26 = —lr~H m K T im !i!iii!i!i!iii!i!i|i!iM 0i!i!i!i!i!i!i!iii!i!i!i!Vg1!

Contextual Info: OBSOLETE LMX2505 www.ti.com SNWS008D – MAY 2004 – REVISED MAY 2004 LMX2505 PLLatinum Dual Frequency Synthesizer System with Integrated VCOs Check for Samples: LMX2505 FEATURES APPLICATIONS • • 1 23 • • • • • • • Small Size – 5.0 mm X 5.0 mm X 0.75 mm 28-Pin WQFN

PI3L720ZHE

Abstract: PI3L-720ZHE PI3L720
Contextual Info: NCN7200 Gigabit Ethernet LAN Switch with 2:1 Mux/ DeMux and Power-down Feature http://onsemi.com The NCN7200 is pin−compatible to the PI3L720ZHE and comes in a 42−pin WQFN package 3.5 mm x 9 mm x 0.5 mm Pitch . The NCN7200 is an 8−channel, bidirectional switch with a power

PI3L-720ZHE

Abstract: PI3L720ZHE PI3L720
Contextual Info: NCN7200 Gigabit Ethernet LAN Switch with 2:1 Mux/ DeMux and Power-down Feature http://onsemi.com The NCN7200 is pin−compatible to the PI3L720ZHE and comes in a 42−pin WQFN package 3.5 mm x 9 mm x 0.5 mm Pitch . The NCN7200 is an 8−channel, bidirectional switch with a power

Contextual Info: NCN7200 Gigabit Ethernet LAN Switch with 2:1 Mux/ DeMux and Power-down Feature http://onsemi.com The NCN7200 is pin−compatible to the PI3L720ZHE and comes in a 42−pin WQFN package 3.5 mm x 9 mm x 0.5 mm Pitch . The NCN7200 is an 8−channel, bidirectional switch with a power

Contextual Info: OBSOLETE LMX2525 www.ti.com SNWS012B – MAY 2004 – REVISED MAY 2004 LMX2525 PLLatinum Dual Frequency Synthesizer System with Integrated VCOs Check for Samples: LMX2525 FEATURES APPLICATIONS • • 1 23 • • • • • • • Small Size – 5.0 mm X 4.0 mm X 0.75 mm 24-Pin WQFN

CERAMIC LEADLESS CHIP CARRIER

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 68 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1
Contextual Info: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 Lead pitch 50mil Package width x package length 450 × 550mil Sealing method Metal seal 32-pad ceramic LCC LCC-32C-A01 *Shape of PIN NO.1 INDEX : Subject to change without notice.

WQFN032-C-R450-1

Abstract: C038
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)

WQFN032-G-R450-1

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal

PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal

Contextual Info: OBSOLETE LMX2515 www.ti.com SNWS011C – MAY 2004 – REVISED MAY 2004 LMX2515 PLLatinum Frequency Synthesizer System with Integrated VCO Check for Samples: LMX2515 FEATURES APPLICATIONS • • 1 23 • • • • • • • Small Size – 5.0 mm X 5.0 mm X 0.75 mm 28-Pin WQFN

CERAMIC LEADLESS CHIP CARRIER

Abstract: c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038
Contextual Info: LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50mil Package width x package length 550 × 550mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01) R0.20(.008) TYP (36 PLCS)

36 pin CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)

36 pin CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 64 CERAMIC LEADLESS CHIP CARRIER LCC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 CERAMIC LEADLESS CHIP CARRIER
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC To Top / Package Lineup / Package Index LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal

TC7732

Abstract: TC7732FTG DCDC35
Contextual Info: TC7732FTG TOSHIBA CMOS Integrated Circuit Silicon Monolithic TC7732FTG Sub Power Management IC for Mobile Equipment P-WQFN-16-0303-0.50-001 Features CD0.13 m monolithic IC Input Voltage ; VDD: 2.5 V to 5.5 V For LDO: 1.8 V to VDD Maximum of Output Current ;