WQFN Search Results

Contextual Info: User's Guide SNVA353B – February 2009 – Revised April 2013 AN-1870 LM26420 Evaluation Board 1 Introduction The LM26420 evaluation board was designed to provide two 2A outputs, VOUT1 and VOUT2 . It is available in either the HTSSOP package option of the LM26420 for easier probing or the WQFN version for evaluating

LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
Contextual Info: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)

WQFN56

Abstract: 510AK
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN56 5x11, 0.5P CASE 510AK−01 ISSUE A SCALE 2:1 PIN ONE LOCATION A B D ÉÉÉ ÉÉÉ ÉÉÉ DATE 02 MAR 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS.

WQFN16

Abstract: WQFN-16 0827 AB
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN16, 1.8x2.6, 0.4P CASE 488AP−01 ISSUE B DATE 25 JUN 2008 1 SCALE 5:1 PIN 1 REFERENCE 2X 2X L A D ÉÉÉ ÉÉÉ ÉÉÉ DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E ÉÉ ÉÉ EXPOSED Cu 0.15 C B A1 MILLIMETERS

Contextual Info: DATA SHEET Part No. MN39901PL Package Code No. WQFN044-C-1212A Publication date: July 2009 SME00002CEC 1 MN39901PL Contents „ Overview ……………………………………………………….…………………………………………………… 3

P-WQFN64-9x9-0

Abstract: EE49
Contextual Info: JEITA Package Code P-WQFN64-9x9-0.50 Previous Code TNP-64AV RENESAS Code PWQN0064KB-A MASS[Typ.] 0.14g HD D 48 33 32 Lp ZE Reference Symbol 17 64 1 16 Index mark ZD b x M A S y S c HE E e 49 Ni/Pd/Au plating D E A2 A A1 b b1 e Lp x y y1 t HD HE ZD ZE c

Contextual Info: 80 PIN CERAMIC WQFN A Q K B D 80 S W C U1 T H U 1 I M R G F J Z X80KW-65A-1 NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 14.0 ± 0.2 0.551 ± 0.008 B 13.6

Contextual Info: 84 PIN CERAMIC WQFN A K B L Q 84 1 D C P U H G Y F S T I M R E J X84KW-50A1-1 NOTE Each lead centerline is located within 0.12 mm 0.005 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 29.2 ± 0.27 1.150 ± 0.011

100 pin wqfn

Abstract: WQFN LA014
Contextual Info: UNIT : mm 335±1.0 23.5±1.0 288±1.0 16 27.5±0.5 137.5±1.0 180±1.0 21.25±1.0 32±0.5 16 25.5 5 25.5 Applied Package Quantity pcs 64 pin WQFN MAX. 60 Material 80 pin WQFN MAX. 60 Heat Proof Temp. 100 pin WQFN MAX. 60 Surface resistance Tray LA-014 Carbon PVC

loadcell

Abstract: CM500S WQFN044-C-1212A 750H
Contextual Info: Part No. MN39901AL Package Code No. WQFN044-C-1212A Publication date: July 2009 nt in ue Pl pl d in ea an c se ed lud pl vi an m m es si tf ed ain ai fo ol t n l ht low disc dis ena ten low tp in o co n an in :// g nt n ce c g pa U in tin t e fo na RL ue ue ype typ ur

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM 26 – October – 2012 PACKAGING INFORMATION Orderable Device Status 1 Pack Type Pack Drawing Pins Pack Qty TPS65632ARTER ACTIVE WQFN RTE 16 3000

a 512 j

Abstract: D801
Contextual Info: Packing Name NEC Tray LA-014 80 pin WQFN A R B J H S I Q M T U C D 80 1 W U1 K G F Z NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 14.0±0.18 INCHES +0.008 0.551 –0.007

Contextual Info: 44 pin WQFN A K B Q L 44 1 D C P S T Y E I M G F H R J X44KW-50A-2 NOTE Each lead centerline is located within 0.12 mm 0.005 inch of its true position (T.P.) at maximum material condition. NEC CODE EIAJ CODE Weight (Reference Value) X44KW-50A-2 ITEM MILLIMETERS

100 pin wqfn

Contextual Info: Packing Name NEC Tray LA-014 100 pin WQFN A B Q D C K T S W 100 H U I M G E F J Z X100KW-65A-1 NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. NEC CODE X100KW-65A-1 EIAJ CODE Weight (Reference Value)

C681

Contextual Info: 68 PIN CERAMIC WQFN A L K B Q P S C 68 1 D U T Y G F E H I M J R X68KW-50A-1 NOTE Each lead centerline is located within 0.12 mm 0.005 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 24.13 ± 0.4 0.950 ± 0.016 B

TRAY

Abstract: pvc material LA010
Contextual Info: UNIT : mm 335±1.0 288±1.0 23.5±1.0 21 27.5±0.5 180±1.0 137.5±1.0 21.25±1.0 32±0.5 21 27 5 27 Tray LA-010 Carbon PVC Material Heat Proof Temp. 70°C Surface resistance less than 1x10 Ω/ 6 Applied Package Quantity pcs 74pin Ceramic WQFN MAX. 60

X80KW-80A-1

Abstract: LA014
Contextual Info: Packing Name NEC Tray LA-014 80 pin WQFN A Q K C D B T W S 80 I H U 1 M E F G J X80KW-80A-1 NOTE Each lead centerline is located within 0.08 mm 0.003 inch of its true position (T.P.) at maximum material condition. NEC CODE X80KW-80A-1 EIAJ CODE Weight (Reference Value)

Contextual Info: Packing Name NEC Tray LA-010 74 pin WQFN A K Q B C D T W S 74 Y H U I 1 M R G E F J X74KW-100A-1 NOTE Each lead centerline is located within 0.10 mm 0.004 inch of its true position (T.P.) at maximum material condition. NEC CODE X74KW-100A-1 EIAJ CODE Weight (Reference Value)

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2011 PACKAGING INFORMATION Orderable Device TPS65168RSBR Status 1 ACTIVE Package Type Package Drawing WQFN RSB Pins Package Qty

56-PIN

Contextual Info: 56-PIN PLASTIC WQFN 8x8 D DETAIL OF A PART E S A c A1 A S y S D2 A 1 (UNIT:mm) 14 ITEM 15 56 B E2 D 8.00 ± 0.05 E 8.00 ± 0.05 D2 6.50 E2 6.50 A 0.75 ± 0.05 A1 0.00 to 0.02 + 0.25 − 0.05 0.07 0.20 ± 0.05 b 43 28 29 42 Lp e b x M S AB DIMENSIONS c e Lp

CERAMIC LEADLESS CHIP CARRIER

Abstract: a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
Contextual Info: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40mil Package width x package length 420 × 420mil Sealing method Metal seal LCC-32C-A06 *Shape of PIN NO.1 INDEX : Subject to change without notice.

CERAMIC LEADLESS CHIP CARRIER

Abstract: c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038
Contextual Info: LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50mil Package width x package length 550 × 550mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01) R0.20(.008) TYP (36 PLCS)

k120s

Contextual Info: 120 PIN CERAMIC WQFN A B Q U2 D C U1 U T K 120 S Y H 1 G J R F E I M Z X120KW-80A-1 NOTE Each lead centerline is located within 0.08 mm 0.003 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 27.3 ± 0.27 1.075 ± 0.011

Contextual Info: 100 PIN CERAMIC WQFN A K B C U1 D U T Q S W 100 I M H 1 F G E J Z X100KL-65A NOTE Each lead centerline is located within 0.06 mm 0.003 inch of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 20.6 ± 0.27 0.811 ± 0.011 B