05JUL201 Search Results

Contextual Info: D R A W IN G IS U N P U B L IS H E D . R ELEASED FO R A LL P U B L IC A T IO N R IG H TS LOC RESERVED. D IS T 00 HÏ C O P Y R IG H T REVISIO N S D E S C R IP T IO N w REV PER M ATERIAL: DWN E C O —1 2 —0 1 2 9 ' H O U S IN G 05JUL201 - 2 JM POLYCARBONATE,

Contextual Info: D R A W IN G IS U N P U B L IS H E D . R ELEASED FO R A LL P U B L IC A T IO N R IG H TS RESERVED. C O P Y R IG H T LOC D IS T HÏ 00 REVISIO N S D E S C R IP T IO N REV D IM EN SIO N S O T H E R W IS E PER 05JUL2012 E C O —1 2 —0 1 2 9 ' A R E MAXIM UI

Contextual Info: T H IS D R AW IN G IS U N P U B L IS H E D . R E L E A S E D FO R P U B LIC A T IO N LOC HÏ A LL RIGHTS R ESER VED . CO PYRIG H T R EVISIO N S D IS T 00 D E S C R IP T IO N DWN 05JUL2012 REV PER ECO—1 2 —0 1 2 9 ' — APVD JM JG MATERIAL: HOUSING - POLYCARBONATE, CLEAR.

Contextual Info: M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF 256-Kbit serial I²C bus EEPROM Datasheet − production data Features • Compatible with all I2C bus modes: – 1 MHz – 400 kHz – 100 kHz ■ Memory array: – 256 Kbit 32 Kbytes of EEPROM – Page size: 64 bytes

Contextual Info: STH260N6F6-6 N-channel 60 V, 1.7 mΩ typ., 180 A STripFET VI DeepGATE™ Power MOSFET in H²PAK-6 package Datasheet − preliminary data Features Order code VDSS RDS on max ID STH260N6F6-6 60 V < 2.4 mΩ 180 A • Low gate charge ■ Very low on-resistance

Contextual Info: VNN7NV04P-E, VNS7NV04P-E OMNIFET II fully autoprotected Power MOSFET Features Type RDS on Ilim Vclamp VNN7NV04P-E VNS7NV04P-E 60 mΩ 6A 40 V • Linear current limitation ■ Thermal shutdown ■ Short circuit protection ■ Integrated clamp ■ Low current drawn from input pin

STM32L152

Abstract: STM32L15xxx STM32L151xx STM32L15xxx Flash programming manual STM32L152xx STM32L151 STM32L15x STM32L STM32L151C8 STM32L151RB
Contextual Info: STM32L151xx and STM32L152xx Errata sheet STM32L151xx and STM32L152xx ultralow power limitations Silicon identification This errata sheet applies to the revision W of the STMicroelectronics STM32L151xx and STM32L152xx ultralow power products. This family features an ARM 32-bit Cortex -M3

wd 969 usb

Abstract: SPEAR320-2 SD protocol SPEAr320 vxworks driver
Contextual Info: SPEAr320 Embedded MPU with ARM926 core, optimized for factory automation and consumer applications Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102 shared I/Os.

Contextual Info: Technical Data Sheet 0402 Package Chip LED 0.45mm Height 16-213/T7D-AQ1R1QY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.

LRIS64K

Abstract: DSASW003741
Contextual Info: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):

p45nf06

Abstract: P45NF 7433 diagram nor gate 7433 P45NF0 STP45NF06 B45n STB45NF06 JULY2010 230v to 12v transformer
Contextual Info: STB45NF06 STP45NF06 N-channel 60 V, 0.023 Ω, 38 A TO-220, D2PAK STripFETTM II Power MOSFET Features Type VDSS RDS on ID STP45NF06 60 V <0.028 Ω 38 A STB45NF06 60 V <0.028 Ω 38 A • Exceptional dv/dt capability ■ Standard threshold drive ■ 100% avalanche tested

Contextual Info: Technical Data Sheet 1206 Package Chip LED 0.5mm Height 15-215/G7C-BN1P2B/2T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.

Contextual Info: Technical Data Sheet White Chip LED With Right Angle Lens 48-213/T3D-AP1Q2TY/3C Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.

Contextual Info: Technical Data Sheet 0603 Package Chip LED 0.3mm Height 19-218/BHC-ZL1M2QY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.

tda2003av

Abstract: tda2003a
Contextual Info: TDA2003A 10 W car radio audio amplifier Datasheet − production data Features • Improved performance over the TDA2002 pinto-pin compatible ■ Very low number of external components ■ Ease of assembly ■ Cost and space savings Description Pentawatt

STGW60

Abstract: gw60 STGWT60H65F 019012 AM-1185 stgw60h65
Contextual Info: STGW60H65F STGWT60H65F 60 A, 650 V field stop trench gate IGBT Datasheet − production data Features • High speed switching ■ Tight parameter distribution ■ Safe paralleling ■ Low thermal resistance ■ 6 µs short-circuit withstand time ■ 2 Lead free package

Contextual Info: Technical Data Sheet White Chip LED With Right Angle Lens 48-213/T7D-AQ1R2QY/3C Features Package in 8mm tape on 7 diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type.

Contextual Info: SPEAr320 Embedded MPU with ARM926 core, optimized for factory automation and consumer applications Features • ARM926EJ-S 333 MHz core ■ High-performance 8-channel DMA ■ Dynamic power-saving features ■ Configurable peripheral functions on 102 shared I/Os.

mpc5602b

Abstract: mpc5604b MPC5604BC ic lm 4704 LQFP 144 footprint mpc56 instruction MPC5603 MPC5603B PH ON 4006 MPC56
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 7, 07/2010 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 15 MAPBGA mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet 32-bit MCU family built on the Power Architecture for

ST IGBT code marking

Abstract: STGW60H65F GW60H65F
Contextual Info: STGW60H65F 60 A, 650 V field stop trench gate IGBT Preliminary data Features • Very high speed switching ■ Tight parameter distribution ■ Safe paralleling ■ Low thermal resistance ■ 6 µs short-circuit withstand time ■ Lead free package 2 3 1 Applications

Contextual Info: M24256-BF M24256-BR M24256-BW M24256-DR 256 Kbit serial I²C bus EEPROM with three Chip Enable lines Features • Compatible with all I2C bus modes: – 1 MHz Fast-mode Plus – 400 kHz Fast mode – 100 kHz Standard mode ■ Memory array: – 256 Kb 32 Kbytes of EEPROM

Contextual Info: 7 T H IS D R A W IN G IS U N P U B L IS H E D . R ELEASED A LL C O P Y R IG H T ~ By FO R 6 P U B L IC A T IO N RIG HTS R E S ER VE D . - D C B PCB HOLE DRILLED HOLE FIN. H O L E C u —t h k s S n P b —t h k s DIMENSIONS :0.7 :0 .5 5 :0.025 :0.004 TO TO

VNH5050

Abstract: VNH5050A VNH5050A-E N-1324 POWERSsO36 PART33 powersso-36
Contextual Info: VNH5050A-E Automotive fully integrated H-bridge motor driver Features Type RDS on Iout Vccmax VNH5050A-E 50 mΩ max (per leg) 30 A 41 V • Output current: 30 A ■ 3 V CMOS compatible inputs ■ Undervoltage and overvoltage shutdown ■ Overvoltage clamp

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)