04SEP0 Search Results

Contextual Info: 7 TH IS DRAWING IS U N P U B LIS H E D . RELEASED FOR ALL COPYRIGHT - 6 5 4 3 2 PUBLICATION RIGHTS LOC RESERVED. CM BY TYCO ELECTRONICS CORPORATION. D IST R E V IS IO N S 00 LTR DE SC RIPTIO N AL SEE DWN BSV GSR 04SEP06 EC O —0 6 —0 1 3 8 9 1 APVD DETAIL

RJ45 Jack low profile with led

Abstract: RJ45 jack 1X4 RJ45 1x4 jack low profile connector low profile rj45 offset low profile rj45 connector offset modular jack stacked low profile rj45 connector offset 2x4 RJ45 LED 1888250-1
Contextual Info: 107-68171 Packaging Specification 04Sep09 Rev R MODULAR JACK ASSY CONNECTOR 1. PURPOSE 目的 Define the packaging specifiction and packaging method of MODULAR JACK ASSY CONNECTOR. 订定 MODULAR JACK ASSY CONNECTOR 产品之包装规格及包装方式。

PH05

Contextual Info: I 6 7 T H IS JÊL DRAWING COPYRIGHT 15 UNPUBLISHED. RELEASED FOR P U B L I C A T IO N 19 BY AMP INCORPORATED. , 4 5 2 3 19 D I ST LOC ALL RIGHTS RESERVED. AD REVISIONS DE SC RI PT IO N REV 5 1 RECEPTACLE '2' AN 0 G 3 C -0 104-01 .008-.014 RB 04SEP01 THK. I.C.

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 480711 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 6 5 4 3 2 480711 ,480711 ALL RIGHTS RESERVED. LOC DIST CM 00 R E V IS IO N S LTR AJ SEE DESCRIPTION DATE DWN BSV GSR 04SEP06 ECO—0 6 —01 3891 APVD

Contextual Info: 8 7 THIS DRAWING IS UNPUBLISHED. 7 ?\ COPYRIGHT 480711 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 6 5 4 3 2 4 8 0 7 1 1 ,4 8 0 7 1 1 ALL RIGHTS RESERVED. LOC DIST CM 00 R E V IS IO N S P LTR AJ DESCRIPTION DATE DWN 04SEP06 E C O —0 6 —0 1 3 8 9 1

Contextual Info: 107-68226 Packaging Specification 04Sep09 Rev D 2.5MM PITCH BATTERY CONN 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 2.5MM PITCH BATTERY CONN. 订定 2.5MM PITCH BATTERY CONN 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

176153-4

Abstract: X-171825-X
Contextual Info: 107-68305 Packaging Specification 04Sep09 Rev J EI SERIES & MTEI CONNECTOR ASSY PRODUCTS 1. PURPOSE 目的 Define the packaging specifiction and packaging method of EI SERIES & MTEI CONNECTOR ASSY PRODUCTS. 订定 EI SERIES & MTEI CONNECTOR ASSY PRODUCTS 产品之包装规格及包装方式。

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. CM DIST R E VIS IO N S 00 LTR AL AL1 SEE DETAIL DATE DESCRIPTION DWN APVD ECO—0 6 —0 1 3 8 91 04SEP06 BSV GSR REVISED PER E C O - 0 9 - 0 2 1 826

35MM

Abstract: tyco USB connector TR00664
Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. Tooling RELEASED FOR PUBLICATION D rawing LOC ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. COPYRIGHT 2 R E V IS IO N S DIST GP 00 LTR NO. DESCRIPTION PER ECR—0 6 —0 2 0 6 5 9 DATE DWN APVD 04SEP06 ww WW USB A: T R 0 0 6 6 2

Contextual Info: 107-68175 Packaging Specification 04Sep09 Rev C 110 SERIES POSITIVE LOCK EX-III 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 110 SERIES POSITIVE LOCK EX-III. 订定 110 SERIES POSITIVE LOCK EX-III 产品之包装规格及包装方式。

Contextual Info: THIS DRAWING IS UNPUBUSHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. AF Dl ST REVISIONS 50 LTR DESCRIPTION D DATE REV PER 0G3A— 0543— 03 DWN APVD JR KY 04SEP03 D D 1 A CDNTINUDUS STRIP EIN REELS, 0,00381 [,000150] MIN TIN OVER

Contextual Info: THIS DRAWING IS UNPUBUSHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - REVISIONS DIST LOC J ALL RIGHTS RESERVED. LTR E1 DATE DWN APVD 04SEP03 TS KB DESCRIPTION REVISED FJAO—051 3 —03 D D •c Lx - V 3 y 1.8 A-A -20.4+0.5 -8.9±0.3

Contextual Info: SA5.0 thru SA170CA Vishay General Semiconductor TRANSZORB Transient Voltage Suppressors FEATURES • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate duty cycle :

tgl200

Contextual Info: TGL41-6.8 thru TGL41-200A Vishay General Semiconductor Surface Mount TRANSZORB Transient Voltage Suppressors FEATURES • Plastic MELF package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional polarity only

SMBJ188CA

Abstract: JESD22-B102 J-STD-002 SMBJ10 SMBJ10CA SURGE PROTECTORS
Contextual Info: SMBJ5.0 thru SMBJ188CA Vishay General Semiconductor Surface Mount TRANSZORB Transient Voltage Suppressors FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional

SSO20

Abstract: T7024 T7024-DB T7024-PGQ T7024-PGS T7024-TRQ T7024-TRS
Contextual Info: T7024 ISM 2.4 GHz Front End IC Description The T7024 is a monolithic SiGe transmit/ receive front end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth, DECT, IEE 802.11 FHSS

TL-10632

Abstract: H5811
Contextual Info: i FO-55 HONEYWELL PA RT NUMBER REV DOCUMENT 7 0011600 C H A N G E D BY DVM CHECK 05MAR05 AK 62AT39 SERIE S CHART FAA-PMA APPROVED 34 ± 8 FAA-PMA C O R R O S ION R E S I S T A N T L E V E R , B U S H I NG A N D B R A C K E T . 240 5 / 3 2 - 3 2 UNS T H R E A D TO

XD 105 94V-0

Abstract: BFM 41A Zener diode smd marking code 39c transistor 1BW GENERAL SEMICONDUCTOR TVS CJ 53B 30 097 transistor 110 3CG
Contextual Info: VISHAY INTERTECHNOLOGY , INC . INTERACTIVE data book transient voltage suppressors vishay general semiconductor vse-db0002-1102 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents

Contextual Info: SM5A27 Vishay General Semiconductor Surface Mount Automotive Transient Voltage Suppressors High Temperature Stability and High Reliability Conditions FEATURES • Patented PAR construction • Low leakage current • Low forward voltage drop d* e t n e Pat

Contextual Info: TSTS7100 Vishay Semiconductors Infrared Emitting Diode, RoHS Compliant, 950 nm, GaAs FEATURES • Package type: leaded • Package form: TO-18 • Dimensions in mm : ∅ 4.7 • Peak wavelength: λp = 950 nm • High reliability • High radiant power • High radiant intensity

TPSMC6.8

Contextual Info: TPSMC6.8 thru TPSMC47A Vishay General Semiconductor Surface Mount Automotive Transient Voltage Suppressors High Temperature Stability and High Reliability Conditions FEATURES • Patented PAR construction • Available in uni-directional polarity only *

tCnd5000

Contextual Info: TCND5000 Vishay Semiconductors Reflective Optical Sensor with PIN Photodiode Output Description The TCND5000 is a reflective sensor that includes an infrared emitter and PIN photodiode in a surface mount package which blocks visible light. Top view A Features

Contextual Info: TCST1210 Vishay Semiconductors Transmissive Optical Sensor with Phototransistor Output Description Top view The TCST1210 is a transmissive sensor that includes an infrared emitter and a phototransistor, located face-to-face on the optical axes in a leaded package

Contextual Info: SA5.0 thru SA170CA Vishay General Semiconductor TRANSZORB Transient Voltage Suppressors FEATURES • Glass passivated chip junction • Available in uni-directional and bi-directional • 500 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate duty cycle :