000PC Search Results

sharp ir sensor

Abstract: PD60T sharp 65 A 05
Contextual Info: PD60T PD60T Chip Type Photodiode • Features ■ Outline Dimensions 1. Subminiature Dimensions : 3.2 x 1.6 × 0.8mm 2. Thin type (Thickness : 0.8mm) 3. Surface mount type (leadless type) 4. Taped model (4 000pcs./reel) 3.2±0.15 *1 Hand soldering temperature, for MAX. 3s

PT601T

Abstract: SHARP LEDS 5 MM SHARP AUDIO IC
Contextual Info: PT601T PT601T Chip Type Phototransistor • Features ■ Outline Dimensions 1. Subminiature Dimensions: 1.6 x 1.6 x 0.8mm 2. Thin type (Thickness: 0.8mm) 3. High sensitivity (Darlington output) 4. Surface mount type (leadless type) 5. Taped model (4 000pcs./reel)

Contextual Info: 5ÈËÎ3 N O T E S 3 D - 5 2 8 9 3 - * * 17 £ # , ^ T 3 1 A RE DETAILED DIMENSION, SE E S D - 5 2 8 9 3 - * * IT I 1 O O O - i S / ' J — JL NUMBER OF CONNECTORS 'J - K x - ^ S a LEAD : TAPE 000PCS/REEL LENGTH ? p c s „ MiN- TOP T A P E BONDED P A R T . E M P T Y

sharp ir sensor

Abstract: GL610T
Contextual Info: GL610T GL610T Chip Type Infrared Emitting Diode • Features ■ Outline Dimensions 1. Subminiature Dimensions : 1.6 x 1.6 × 0.8mm 2. Thin type (Thickness : 0.8mm) 3. Taped model (4 000pcs./reel) 4. Leadless type (Unit : mm) 0.8 1.6 Transparent resin 1.2

PT460

Abstract: PT460/460F PT460F PT461 PT461F PT465F
Contextual Info: PT460/PT460F/PT461/PT461F/PT465F PT460/PT460F/PT461 PT461F/PT465F Duble-end Type Phototransistor • Features ■ Outline Dimensions 1. Compact double-end type package 2. Taping package 2 000pcs. /reel ( PT xxx T ) 3. Visible light cut-off type ( PT460F / PT461F / 465F )

Contextual Info: LC FILTERS AND DIRECTIONAL COUPLERS Packaging TAPE DIMENSIONS: mm D irection of feed 1 000pcs/reet Dimension LFA 30/LFL 30/LFJ 30 LFK 30/LDC 30 (90° Hybrid) A LFE 35 LDC 30 Directional Coupler 5.5 ± 0.05 B 12.0 ± 0 . 2 C 3.6 5.2 4.5 D 4.9 6.1 5.5 2.6

PT460

Abstract: PT460F DLA9 PT461 PT465F c125t
Contextual Info: PT460/PT460F/PT461 /PT461 F/PT465F PT460/PT460F/PT461 PT461 F/PT465F Duble-end Type Phototransistor • Features ■ Outline Unit : mm Dim-ns 1. Compact double-end type package 2. Taping package (2 000Pcs. /reel) (PTX X X T ) 3. Visible light cut-off type

PC3Q67QJ000F

Abstract: pc3q67q E64380 EN60747-5-2 PC3H7J00000F VDE0884
Contextual Info: PC3Q67QJ000F Series Mini-flat Half Pitch 4-channel Package, General Purpose Photocoupler PC3Q67QJ000F Series * 1-channel package type is also available. model No. PC3H7J00000F Series • Description ■ Agency approvals/Compliance PC3Q67QJ000F Series contains an IRED optically

E210

Abstract: E64380 PC3Q410NIP0F
Contextual Info: PC3Q410NIP0F Mini-flat Half Pitch 4-channel Package, High CMR, AC Input, Low Input Current Photocoupler PC3Q410NIP0F ∗ 1-channel package type is also available. model No. PC3H41xNIP0F Series • Description ■ Agency approvals/Compliance PC3Q410NIP0F contains a IRED optically coupled

E64380

Abstract: PC814 PC814X PC814XP PC844X VDE0884
Contextual Info: PC814X Series DIP 4pin AC Input Photocoupler PC814X Series ∗ 4-channel package type is also available. model No. PC844X Series • Description ■ Agency approvals/Compliance PC814X Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in SMT gullwing lead-form option.

PC8171xNIP

Abstract: PC8171 PC81712NIP PC81716NIP E64380 PC81710NSZ PC81711NSZ PC81712NSZ PC81713NSZ PC81715NSZ
Contextual Info: PC8171xNSZ Series PC8171xNSZ Series DIP 4pin High CMR, Low Input Current Photocoupler • Description ■ Agency approvals/Compliance PC8171xNSZ Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in SMT gullwing lead-form option.

Contextual Info: 9"JX 9JU 7411/9 MCF FP2 Series • ^ J b /F e a tu re • ifi'J 'M • M S I ( « ? = 1.3mm) • •» w i4 • g • U7 □ • Compact and thin (Height = 1,3mm) • Excellent vibration resistance and shock resistance • Designed for automatic mounting and reflow soldering

Contextual Info: V'JZQIb 7 -fJI/S MCF BT6 Series • ^ ^ /F e a tu r e • ']'$J * M It) ( 4 ^ — JU MCF) • x > 7 T-—t°> • u7 □ • Compact and thin (four pole MCF) • Emboss taping specification • Reflow is possible ■ f t til/S p ecifica tio n Number of inner

Contextual Info: 10 ±Mo. i5 06 . (4. I) ( 06 . RECOMMENDED P.C.BOARD PATTERN DIMENSION. (REF.) (MOUNTING AREA) ) y i l L YIO/LExil □ flSix 4F ITTIN G NAIL : TIN 1.0 MICROMETER MINIMUM ISWGIRTi-ftA. V I — 'A LA j T UNDER PLATING : NICKEL (FITTIN G NAIL) a 1.0 MICROMETER MINIMUM

PC401

Abstract: PC401T PC401Z
Contextual Info: PC401 PC401 Compact, Surface Mount Type OPIC Photocoupler • Features ■ Outline Dimensions 1. Mini-flat package 2. “ High ” output during light emission 3. Isolation voltage between input and output Viso : 3 750V rms 4. TTL and LSTTL compatible output

2SD11

Abstract: CA95323 E64380 PC2SD11NTZ PC2SD11NVZ PC3SD11NTZ PC2SD11NTZAF 2Sd114 2SD11 triac
Contextual Info: PC2SD11NTZ Series VDRM : 400V Non-zero cross type DIP 6pin Phototriac Coupler for triggering PC2SD11NTZ Series ∗ VDRM : 600V type is also available. PC3SD11NTZ Series • Description ■ Agency approvals/Compliance PC2SD11NTZ Series Phototriac Coupler include an

R39MF2

Abstract: R29MF2 R39MF R29MF PR39MF2xNSZ EN60747-5-2 LR63705 PR29MF21NSZ VDE0884 PR29MF1xNSZ
Contextual Info: PR29MF21NSZ Series PR39MF2xNSZ Series IT rms ≤0.9A, Zero Cross type DIP 8pin Triac output SSR PR29MF21NSZ Series PR39MF2xNSZ Series ∗ Non-zero cross type is also available. (PR29MF1xNSZ Series/PR39MF1xNSZ Series) • Description ■ Agency approvals/Compliance

Contextual Info: CRYSTAL-LESS PCI EXPRESS DUAL OUTPUT ULTRA MINIATURE PURE SILICONTM SMD CLOCK GENERATOR AB-557-03 Series Moisture Sensitivity Level MSL 1 – 14 QFN MSL 3 – 16 TSSOP Pb FEATURES: • Meets PCIe Gen1, Gen2, & Gen3 specs. • High Performance MEMS Technology by Discera

PC925L

Abstract: pc925 PC925L0NSZ0F PC925L0NIP0F china model inverter circuit diagram high speed Photocoupler PC925L APPLICATION E251 E64380 PC925L0NUP0F
Contextual Info: PC925L0NSZ0F Series PC925L0NSZ0F Series High Speed, 2.5A Output, Gate Drive DIP 8 pin ∗OPIC Photocoupler • Description ■ Agency approvals/Compliance PC925L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing

sharp pc400

Contextual Info: PC400 PC400 Compact, Surface Mount Type OPIC Photocoupler • Features ■ Outline Dimensions 1. Mini-flat package 2. “ Low ” output during light emission 3. Isolation voltage between input and output Viso : 3 750V rms 4. TTL and LSTTL compatible output

PC410L0NIP

Abstract: pc410l PC410L0NIP Series
Contextual Info: PC410L0NIP Series PC410L0NIP Series High Speed 10Mb/s, High CMR Mini-flat Package ∗OPIC Photocoupler • Description ■ Agency approvals/Compliance PC410L0NIP Series contains a LED optically coupled to an OPIC chip. It is packaged in a 5 pin mini-flat.

0316mA

Contextual Info: PC401 PC401 Compact, Surface Mount Type OPIC Photocoupler • Features ■ Outline Dimensions 1. Mini-flat package 2. “ High ” output during light emission 3. Isolation voltage between input and output Viso : 3 750V rms 4. TTL and LSTTL compatible output

pc123

Abstract: PC123 Series PC123ZY1 PC123 how to test PC-123 PC123 VDE pc1234 VDE0884 PC123 pin out PC123*1
Contextual Info: PC123 Series PC123 Series DIP 4pin Reinforced Insulation Type Photocoupler • Description ■ Agency approvals/Compliance PC123 Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.

PR36MF51NSLF Series

Contextual Info: PR33MF51NSZF PR36MF51NSLF Series PR36MF51NSLF PR33MF51NSZF Series IT rms ≤0.3A, 0.6A, Non-Zero Cross type DIP 8pin Triac output SSR • Description ■Agency approvals/Compliance PR36MF51NSLF Series Solid State Relays (SSR) PR33MF51NSZF are an integration of an infrared emitting diode (IRED),