000155B Search Results

Contextual Info: 168-pin Enhanced SDRAM DIMM 8/16/32 MB Enhanced Memory Systems Inc. Pin Assignment Features • JE D E C S tandard 168-pin D IM M s • P C -100 S pec C o m pliant - Low est Latency • S ingle 3.3V ± 0 .3 V P o w e r S upply 1 Vss 43 • U nbuffered 2 DQ0

HDB3 schematic

Abstract: VL80C75-PC
Contextual Info: V L S I TECHNOLOGY INC Ifl VLSI D e | =1300347 0001S2Q 0 ^ T - l S - i h V i Te c h n o l o g y , in c . VL80C75 T1 INTERFACE FEATURES DESCRIPTION • Supports T1, T1C, and CEPT data rates The VL80C75 is a general purpose PCM Line Interface circuit. It Is designed Ho

tb1d

Contextual Info: VTB1012, 1013 VTB Process Photodiodes P A C K A G E DIMENSIONS inch mm PRODUCT DESCRIPTION CASE 17 Sm all area planar silicon photodiode in a "flat" w indow , dual lead T O -46 package. Cathode is comm on to the case. These diodes have very high shunt resistance and have good blue

Contextual Info: Models 152 and 155 Description The Model 152 is an economical, general purpose operational amplifier featuring very low input bias current and high input impedance. It is designed for applications involving high source resistances. The Model 155 has all these same features

Contextual Info: •HYUNDAI SEMICONDUCTOR H Y 5 1 1 6 1 0 0 S e r ie s 16Mx 1-bit CMOS DRAM DESCRIPTION The HY5116100 is the new generation and fast dynamic RAM organized 16,777,216 x 1-bit. The HY5116100 utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating

MPS 2112

Abstract: dd1555 R3000A PR2000 PR31 MIPS R2000 PR3010A PR3000A td70c R2000 mips processor
Contextual Info: PE R FO R M A N CE SEMICONDUCTOR 50E D 7 0 b 2 S li 7 • ÜDD1SS1 PERFORMANCE INTEGRATED MIPS MODULE PIMM" 713 «PSC PffiEBJIIlflDNAIHIV FEATURES: ■ Single VLSI muttichip module contains: • PR3000A CPU • PR3010A FPA • PR3100A Write/Read and Parity Buffer

74153 mux

Abstract: mvb bus schematics 74138 decoder IC 74153 dual 4*1 multiplexer pin diagram 41 multiplexer 74153 OPTI 82C611 ic 74153 Multiplexer 82C602A 82C465MVB 82c465
Contextual Info: 82C465MV/MVA/MVB Single-Chip Mixed Voltage Notebook Solution 1.0 Overview The OPTi 82C465MV chipset is a highly integrated ASIC that implements 32-bit AT-compatible core logic, along with power management and CPU thermal management hardware, in a single device. Its feature set provides an array of control and

Contextual Info: DENSE-PAC 8 MEGABIT FLASH EEPROM DPZ256X32IV3 M I C R O S Y S T E M S D E S C R IP T IO N : The D P Z 2 5 6 X 3 2 IV 3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadiess Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: AS AHI KASF.I AK2304A: A K 2 3 0 4 A AKM P PC« CODEC/FILTER COHBO LSI V. ajuuumwAw bam 1 F e a t u r e s □ □ □ □ □ □ □ □ □ □ D Compliant lo ATST and ITU reconaendalions Monolithic 4-channel CODEC/Filter Suitable for PBX/KTS applications

7024S15

Contextual Info: Commercial/ Industrial INC. TM PA7024 PEEL Array Programmable Electrically Erasable Logic Array Features I CMOS Electrically Erasable Technology I High-Speed Commercial and Industrial Versions - Reprogrammable in 24-pin DIP, SOIC, and 28-pin PLCC packages

Contextual Info: THYRISTOR MODULE PK PPI200QB Power Thyristor/Diode Module P K 2 0 0 G B series are designed for various rectifier circuits and power controls. For your circuit application, following internal connections and wide voltage rat­ ings up to 800 V are available.

Contextual Info: ART Data Sheet August 1993 Microelectronics FC050C, FC100C, FC150C Power Modules: dc-dc Converters; 28 Vdc Input, 15 Vdc Output, 50 W to 150 W Features • High efficiency: 85% typical ■ Parallel operations with load sharing ■ Low profile: 0.5 in. ■ Complete input and output filtering

Contextual Info: 16 Amp SCHOTTKY BARRIER RECTIFIERS Mechanical Dimensions JEDEC T0 -220AB •14 * > <— » .10 T~ .39 T — = + .42 .to o SR1630 it - .50 -♦ r ♦- .225 N jo h i* —* F e a tu re s ■ HIGH CURRENT C A M B IL IT Y WITH LOW V F ■ HIGH SURGE VOLTAGE AND

Contextual Info: .0.100 In. ISA Card Edge-Card Connectors 1.27 mm 0.050 in. Centerlines w ith 2.54 mm (0.100 in.) Staggered PCB Grid EISA Edge-Card Connector 188 Position Features • Meets the requirements of the EISA (Extended Industry Standard Architecture) Standard.