0.8MM PITCH BGA Search Results

SF-BGA256J-B-01

Abstract: FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA
Contextual Info: 14mm [0.551"] 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] 0.8mm [0.031"] pitch typ. 12mm [0.472"] sqr. 0.36mm [0.014"] 0.8mm [0.031"] pitch typ. Side View 6.78mm [0.267"] 2 1.6mm [0.063"] 1 0.8mm [0.031"] pitch typ. 0.33mm [0.013"] 3 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

1mm pitch BGA socket

Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
Contextual Info: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)

256 ball bga

Abstract: IPC-4552
Contextual Info: 256-301750-18 16x16 Array 256 Ball BGA Adapter Converts from 0.8mm Pitch to 1.00mm Pitch FEATURES: • Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by

ASTM-B-733

Abstract: 16x16 bga 256 ball bga
Contextual Info: 256-301750-18 16x16 Array 256 Ball BGA Adapter Converts from 0.8mm Pitch to 1.00mm Pitch FEATURES: • Correct-A-Ship technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by

Contextual Info: 35.56mm [1.400"] Orientations: Top Views PLCC QFP 35.56mm [1.400"] 2.54mm [0.100"] pitch typ. Top View 4 17.16mm [0.676"] 1 19.08mm [0.751"] assembled 3 6.35mm [0.250"] 0.8mm [0.031"] pitch typ. 2 0.46mm [0.018"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

smt a1 transistor

Abstract: foot
Contextual Info: 0.8mm Pitch SMT foot and female-to-female socket Attachment and Use Daughter board Orientation mark, Align with Target pin A1 Surface mount Foot UGA socket A Top View: Surface mount foot Surface mount Foot Cross section: A-A Target PCB Step 1 Attach SMT BGA emulator foot to target PCB

Contextual Info: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball

MX23L8102

Abstract: MX23L8102XI-12 MX23L8102XI-70 MX23L8102XI-90
Contextual Info: MX23L8102 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball

C4 to BGA

Abstract: MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815
Contextual Info: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball

MX23L8102

Abstract: MX23L8102XI-12 MX23L8102XI-70 MX23L8102XI-90
Contextual Info: MX23L8102 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball

0.3mm pitch BGA

Abstract: SF-BGA180C-B-11
Contextual Info: 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] sqr. 12mm [0.472"] sqr. Side View 0.3mm [0.012"] dia. typ. 8.75mm [0.344"] 6.79mm [0.268"] 2 3.75mm [0.148"] 1 3 0.8mm pitch typ. 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

smt a1 transistor

Abstract: kapton
Contextual Info: 0.8mm Pitch SMT foot and UGA socket Attachment and Use Daughter board Orientation mark, Align with Target pin A1 Kapton Tape UGA socket Note: Do not remove the kapton tape from the bottom of the socket until it is attached to the daughter board. Surface mount Foot

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

0.8mm pitch BGA

Abstract: LS-BGA90B-61
Contextual Info: Tooling hole X2 Y Top View (reference only) 3.76mm [0.148"] 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout 0.80mm typ. 11.20mm [0.441"] X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 Top View of Land Pattern Scale: 2:1 0.80mm

BGA60C

Abstract: 0.8mm pitch BGA LS-BGA60C-11 BGA-60
Contextual Info: Tooling hole X2 BGA60C 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout Y 7.20mm [0.283"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 0.20mm [0.008"] dia. Top View of Land Pattern

0.8mm pitch BGA

Abstract: LS-BGA81C-11 BGA81C
Contextual Info: Tooling hole X2 BGA81C 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout Y 0.80mm typ. [0.031"] 6.40mm [0.252"] Top View (reference only) X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 3.76mm [0.148"] Top View of Land Pattern

0.8mm pitch BGA

Abstract: LS-BGA100C-11
Contextual Info: Tooling hole X2 BGA100C 7.20mm [0.283"] See BGA pattern code to the right for actual pattern layout Y 7.20mm [0.283"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 Top View of Land Pattern Scale: 2:1

0.8mm pitch BGA

Abstract: BOX21151 LS-BGA54B-61
Contextual Info: Tooling hole X2 BGA54B 6.40mm [0.252"] See BGA pattern code to the right for actual pattern layout Y 6.40mm [0.252"] Top View (reference only) 3.76mm [0.148"] 0.80mm typ. X Ø 0.51mm [Ø 0.020"] BGA pad 2.17mm [0.086"] 1 0.20mm [0.008"] dia. Top View of Land Pattern

BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced

BGA Solder Ball 0.35mm collapse

Abstract: BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm AN-5026 FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543
Contextual Info: Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right

BGA Solder Ball collapse

Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
Contextual Info: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to

TSSOP YAMAICHI SOCKET

Abstract: TSSOP-56 footprint texas JEDEC Jc-11 mo-205 free IDT marking IDT package marking LVCH JEDEC Jc-11 free OREGA IC280-096-144 marking B44 RC3041
Contextual Info: 32 Bit Logic Families in LFBGA packages: 96 and 114 Balls Low Profile Fine Pitch BGA Packages. Application Note. October 26th, 1998 by: Sylvie Kadivar, Philips Semiconductors Maria Balian, Texas Instruments Ed Agis, Texas Instruments Valentino Liva, Integrated Device Technology

SF-BGA208D-P-01

Contextual Info: 2 Side View 1.71mm [0.068"] 3 1 11.11mm [0.438"] 14.29mm [0.563"] 4 4 15.01mm [0.591"] 17.08mm [0.673"] Substrate: FR4/G10 or equivalent high temp material. Non-clad. 0.8mm [0.031"] Bottom View 15.01mm [0.591"] 0.8mm [0.031"] 17.06mm [0.671"] 1 2 Description: BGA Emulator Foot