0.5 MM PITCH MLP Search Results

sony cmos sensor imx 174

Abstract: Sony imx 174 Sony IMX 145 CMOS
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 3, 04/2014 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

sony cmos sensor imx 174

Abstract: sony cmos sensor imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.2, 08/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

sony cmos sensor imx 179

Abstract: sony cmos sensor imx 174 sony cmos sensor imx 117 sony cmos sensor imx 175 IMX* Sony sony IMX 117 sony IMX 136 sony IMX 179 emmc 4.41 spec sony IMX cmos
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.1, 05/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

sony cmos sensor imx 179

Abstract: sony cmos sensor imx 174 sony cmos sensor imx 175 sony IMX 136 sony cmos sensor imx 117 sony CMOS sensor imx 136 Sony "IMX 175" CMOS sony imx 175 sony IMX 179 imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 1, 11/2012 MCIMX6L i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3

ecopack2

Abstract: ST 2x3 eeprom BR-256 ecopack M95M01-R ufdfpn hearing aids M24C02-R M24C04-R M24C08-R
Contextual Info: EEPROMs in miniature packages MLP 2x3, WLCSP Innovative solutions for EEPROMs As well as EEPROM flexibility and low-power functioning, ST offers kilobytes of EEPROM packaged in a few millimeters with wafer level CSP or MLP 2x3 to allow you to save space and cost.

ufdfpn

Abstract: ecopack2 0.5 mm pitch mlp M24C02-R M24C04-R M24C08-R M93C66-R M95020-R M95040-R M95080-R
Contextual Info: EEPROMs in miniature packages MLP 2x3, WLCSP Innovative solutions for EEPROMs As well as EEPROM flexibility and low-power functioning, ST offers kilobytes of EEPROM packaged in a few millimeters with wafer level CSP or MLP 2x3 to allow you to save space and cost.

ecopack2

Abstract: ST 2x3 eeprom ufdfpn I2C Memory ic hearing aids M95512-R M24C08-R M93C66-R M95020-R M95040-R
Contextual Info: EEPROMs in miniature packages MLP 2x3, WLCSP Innovative solutions for EEPROMs As well as EEPROM flexibility and low-power functioning, ST offers kilobytes of EEPROM packaged in a few millimeters with wafer level CSP or MLP 2x3 to allow you to save space and cost.

IC 4047

Abstract: GAAS FET rf switch CROSS REFERENCE 0.5 mm pitch mlp 16 pin ceramic attenuator MHz diode EGP 30 data sheet of IC 4047 Driver IC 4047 GAAS FET CROSS REFERENCE HP MMIC ic 4047 datasheet
Contextual Info: PRODUCT FEATURE RF DIGITAL ATTENUATORS IN PLASTIC MLP PACKAGES B Fig. 1 Relative sizes of the five-bit and six-bit attenuators. ▼ roadband digital attenuators have been used to set power levels in RF and microwave circuits for many years. The concept is to electronically switch resistive T

Contextual Info: Tape Information Vishay Siliconix MLP65-18/20L 2.0"0.5 See Note 3 4.0 See Note 1 1.75 " 0.10 A 5.5"0.05 See Note 3 12.0"0.3 A SECTION A-A 8.0 R0.5 NOTES: 1. 10 sprocket hole pitch cumulative tolerance "0.2. 2. Camber in compliance with EIA 481. 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.

B0412

Abstract: "IEC 61000" modem 2FAB-M20R
Contextual Info: NT IA • *R oH S CO M PL Features ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to ten data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAB-M20R – Integrated Passive & Active Device using MLP

B0412

Abstract: "IEC 61000" modem 2FAA-M20R
Contextual Info: NT IA PL • *R oH S CO M Features ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to ten data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAA-M20R – Integrated Passive & Active Device using MLP

Contextual Info: Package Information Vishay Siliconix -B- PowerPAKr MLP65-18/20 POWER IC ONLY D D/2 NXb Index Area D/2 E/2 -A- bbb M A B C NXb 2x E/2 E2/2 E2 2.00 aaa C E Index Area D/2 E/2 aaa NXL 2x C Detail D D2/2 D2 TOP VIEW BOTTOM VIEW A // ccc C 0.08 C A3 SEATING NX

"IEC 61000" modem

Abstract: 2FAA-M20R B0412
Contextual Info: PL IA NT Features CO M • *R oH S ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to ten data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAA-M20R – Integrated Passive & Active Device using MLP

C1620

Abstract: 2FAB-M20R B0412
Contextual Info: IA NT Features CO M PL • oH S ■ *R ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to ten data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAB-M20R – Integrated Passive & Active Device using MLP

MLP33-10

Abstract: MO229-VEED-2 MO-229VEED
Contextual Info: Package Information Vishay Siliconix MLP33-10 POWER IC ONLY JEDEC Part Number: Outline is consistent with JEDEC MO229-VEED-2 Detail D 4xQ // ccc C A NX A2 A1 A3 0.08 C Side View Detail C e 1 A1 5 NX b bbb M C A B 2 L2 ddd M C D ÉÉÉ ÇÇ ÉÉÉ ÇÇ ÉÉÉ

D 5888 s

Abstract: MLP33-10 M0229-VEED-2 MO229-VEED-2 S-21822-Rev 5888
Contextual Info: Package Information Vishay Siliconix MLP33−10 JEDEC Part Number: Outline is consistent with JEDEC MO229-VEED-2 Detail D 4xQ // ccc C A2 A A1 NX A3 0.08 C Side View e 1 A1 5 NX b bbb M C A B 2 L2 ddd M C D ÉÉÉ ÇÇ ÉÉÉ ÇÇ ÉÉÉ L Detail C Seating

IPC-7525

Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
Contextual Info: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in

ods-1072

Abstract: SM-69 ODS-1056 VHHC W1 sot 363 M513 MO-220 MSOP-10 PQFN-12 ODS-54
Contextual Info: Tape and Reel Packaging for Surface Mount Components M513 V9 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape

SM-69

Abstract: ods-1072 ODS-1079 ODS-1306 PQFN-12 sm2 1056 SOIC-AC90 W1 sot 363 M513 SM-46
Contextual Info: Tape and Reel Packaging for Surface Mount Components M513 V11 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape

FAJ 20 ESD

Abstract: FAJ 20 "IEC 61000" modem 2FAJ-M16R B0412
Contextual Info: NT *R oH S CO M PL IA Features • ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to eight data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAJ-M16R – Integrated Passive & Active Device using MLP

"IEC 61000" modem

Abstract: 2FAI-M16R B0412
Contextual Info: NT *R oH S CO M PL IA Features • ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to eight data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAI-M16R – Integrated Passive & Active Device using MLP

2FAI-M16R

Abstract: B0412
Contextual Info: NT *R oH S CO M PL IA Features • ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to eight data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAI-M16R – Integrated Passive & Active Device using MLP

FAJ 20 ESD

Abstract: B0412 F B0412 FAJ ESD FAJ 40 2FAJ-M16R
Contextual Info: NT *R oH S CO M PL IA Features • ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to eight data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAJ-M16R – Integrated Passive & Active Device using MLP

FAJ 20 ESD

Abstract: "IEC 61000" modem 2FAJ-M16R B0412
Contextual Info: PL IA NT Features CO M • *R oH S ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to eight data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAJ-M16R – Integrated Passive & Active Device using MLP