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    DSA00109760.pdf

    • -
    • Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel
    • Original

    DSA00109760.pdf preview Download Datasheet

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    intel C4 package Low viscosity underfill for flip chip microwave oven underfill underfill for good adhesion and low viscosity with or without underfill
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