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    DSAZSAA00019989.pdf

    • NXP Semiconductors
    • Package outline BGA400: plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm D SOT901-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e
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    DSAZSAA00019989.pdf preview Download Datasheet

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    BGA400
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