DSA00178704.pdf

Partial File Text FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou Fujitsu San Jose, CA USA Takashi Ozawa Fujitsu Kawasaki, JAPAN Dev Malladi, Chris Furman, Mary Kreb
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45X45mm INCOMING PACKAGING MATERIAL INSPECTION form Low viscosity underfill for flip chip MIL-STD-105C motherboard major problems & solutions underfill