DSASW00131.pdf

by NXP Semiconductors

Partial File Text AN10343 MicroPak soldering information Rev. 2 -- 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level
Datasheet Type Original

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J-STD-020D MICROPAK XX SOT103 sot1049 SOT833 SOT996 SOT996-2 VSSOP8 VSSOP8 land pattern WLCSP stencil design WLCSP Texas XQFN10U