Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAUD005765.pdf
    by Xilinx

    • 0 Packages and Thermal Characteristics R February 2, 1999 (Version 2.1) 0 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages defin
    • Original

    DSAUD005765.pdf preview
    Download Datasheet

    Datasheet Impression

    User Tagged Keywords

    bav 17 diode BGA 11x11 junction to board thermal resistance EFTEC-64 fine BGA thermal profile footprint jedec MS-026 TQFP footprint jedec MS-026 TQFP 11x11 footprint jedec MS-026 TQFP 128 footprint jedec MS-026 TQFP 44 HQ160 HQ208 J-STD-013 JEDEC MS-026 footprint land pattern QFP 208 MS-026-ACB MS-026-ACD PQ100 PQ160 PQ208 qfp 64 0.4 mm pitch land pattern qfp 64 0.5 mm pitch land pattern QFP PACKAGE thermal resistance die down schematic impulse sealer TQ100 TQ144 TQ176 VQ100 xilinx mechanical drawings

    Newly Added Datasheets | Privacy Policy | Do Not Sell or Share my personal information | Digital Services Act | Contact Us | About Us

    Copyright © 2026.

    Supplyframe Tracking Pixel