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    DASF0019462.pdf

    by Lattice Semiconductor
    • Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, L
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    20X20 23x23 28X28 36 pin, FCBGA 7x7mm 45x45 mm bga BGA 11x11 junction to board thermal resistance BGA 23X23 CABGA 48 7x7 CABGA 6x6 CABGA 8X8 fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance jc FPBGA FPBGA 27x27 FPGA 23X23 FTBGA 256 Lattice LFXP2 lattice package dimension LCMXO1200C LFE2M20E LFE3-17 lfe3-35 LFE3-70 LFE395 LFEC1 14x14 LFXP15C LFXP2-17E LFXP2-30 LFXP2-30E LFXP2-40E LFXP2-5E LFXP2-8E LFXP2-8E 132 LFXP20C lfxp6c PBGA 23X23 PBGA 324 19x19 QFN 20X20 QFN 68 8x8 QFN PACKAGE thermal resistance SCM15 SCM25 theta fcbga Theta JB Theta JB ssop 36 theta jc FCBGA TQFP 144 PACKAGE lattice tqfp 64 thermal resistance

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